DE10296494D2 - Optoelektronische Baugruppe mit Peltierkühlung - Google Patents

Optoelektronische Baugruppe mit Peltierkühlung

Info

Publication number
DE10296494D2
DE10296494D2 DE10296494T DE10296494T DE10296494D2 DE 10296494 D2 DE10296494 D2 DE 10296494D2 DE 10296494 T DE10296494 T DE 10296494T DE 10296494 T DE10296494 T DE 10296494T DE 10296494 D2 DE10296494 D2 DE 10296494D2
Authority
DE
Germany
Prior art keywords
optoelectronic module
peltier cooling
peltier
cooling
optoelectronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
DE10296494T
Other languages
English (en)
Inventor
Martin Weigert
Axel Schubert
Franz Auracher
Karl-Heinz Schlereth
Gustav Mueller
Hans-Ludwig Althaus
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
MICROPELT GMBH, 79110 FREIBURG, DE
Original Assignee
Infineon Technologies AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Infineon Technologies AG filed Critical Infineon Technologies AG
Application granted granted Critical
Publication of DE10296494D2 publication Critical patent/DE10296494D2/de
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4266—Thermal aspects, temperature control or temperature monitoring
    • G02B6/4268—Cooling
    • G02B6/4271—Cooling with thermo electric cooling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/645—Heat extraction or cooling elements the elements being electrically controlled, e.g. Peltier elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/024—Arrangements for thermal management
    • H01S5/02407—Active cooling, e.g. the laser temperature is controlled by a thermo-electric cooler or water cooling
    • H01S5/02415—Active cooling, e.g. the laser temperature is controlled by a thermo-electric cooler or water cooling by using a thermo-electric cooler [TEC], e.g. Peltier element
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
    • H01L2924/10253—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19107—Disposition of discrete passive components off-chip wires

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electromagnetism (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Semiconductor Lasers (AREA)
  • Optical Integrated Circuits (AREA)
DE10296494T 2002-02-14 2002-02-14 Optoelektronische Baugruppe mit Peltierkühlung Ceased DE10296494D2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/DE2002/000543 WO2003069744A1 (de) 2002-02-14 2002-02-14 Optoelektronische baugruppe mit peltierkühlung

Publications (1)

Publication Number Publication Date
DE10296494D2 true DE10296494D2 (de) 2005-07-07

Family

ID=27674407

Family Applications (1)

Application Number Title Priority Date Filing Date
DE10296494T Ceased DE10296494D2 (de) 2002-02-14 2002-02-14 Optoelektronische Baugruppe mit Peltierkühlung

Country Status (4)

Country Link
US (1) US20050138934A1 (de)
AU (1) AU2002244626A1 (de)
DE (1) DE10296494D2 (de)
WO (1) WO2003069744A1 (de)

Families Citing this family (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7258839B2 (en) * 2001-12-21 2007-08-21 Cytonome, Inc. Temperature controlled microfabricated two-pin liquid sample dispensing system
JP3977315B2 (ja) 2003-10-31 2007-09-19 ファイベスト株式会社 光通信器、光通信システムおよび光送受信器
US7232264B2 (en) 2003-12-19 2007-06-19 Infineon Technologies Ag Optoelectronic arrangement having a laser component, and a method for controlling the emitted wavelength of a laser component
US7167492B2 (en) 2003-12-19 2007-01-23 Infineon Technologies Ag Optoelectronic arrangement having at least one laser component, and a method for operating a laser component
US7118292B2 (en) * 2005-01-24 2006-10-10 Emcore Corporation Coaxial cooled laser modules with integrated thermal electric cooler and optical components
DE102007019296B4 (de) * 2007-04-24 2009-06-25 Siemens Ag Vorrichtung aus einer Kombination eines Magnetresonanztomographen und eines Positronen-Emissions-Tomographen
DE102007044873A1 (de) * 2007-09-20 2009-04-16 Siemens Ag Verfahren zur Stabilisierung der Verstärkung eines PET-Detektionssystems
US8180446B2 (en) * 2007-12-05 2012-05-15 The Invention Science Fund I, Llc Method and system for cyclical neural modulation based on activity state
US8195287B2 (en) * 2007-12-05 2012-06-05 The Invention Science Fund I, Llc Method for electrical modulation of neural conduction
US8170660B2 (en) 2007-12-05 2012-05-01 The Invention Science Fund I, Llc System for thermal modulation of neural activity
US8165668B2 (en) * 2007-12-05 2012-04-24 The Invention Science Fund I, Llc Method for magnetic modulation of neural conduction
US8170658B2 (en) * 2007-12-05 2012-05-01 The Invention Science Fund I, Llc System for electrical modulation of neural conduction
US20090149797A1 (en) * 2007-12-05 2009-06-11 Searete Llc, A Limited Liability Corporation Of The State Of Delaware System for reversible chemical modulation of neural activity
US8165669B2 (en) * 2007-12-05 2012-04-24 The Invention Science Fund I, Llc System for magnetic modulation of neural conduction
US8180447B2 (en) 2007-12-05 2012-05-15 The Invention Science Fund I, Llc Method for reversible chemical modulation of neural activity
US8160695B2 (en) * 2007-12-05 2012-04-17 The Invention Science Fund I, Llc System for chemical modulation of neural activity
CN100483762C (zh) * 2008-02-25 2009-04-29 鹤山丽得电子实业有限公司 一种发光二极管器件的制造方法
US8240885B2 (en) * 2008-11-18 2012-08-14 Abl Ip Holding Llc Thermal management of LED lighting systems
JP2013115257A (ja) * 2011-11-29 2013-06-10 Mitsubishi Electric Corp 光モジュール
TW201434133A (zh) * 2013-02-23 2014-09-01 Luxnet Corp 光收發元件封裝結構
DE102014006305B4 (de) * 2014-04-30 2017-11-23 Attocube Systems Ag Optisches Längenmesssystem mit einem interferometrischen Wegsensor zur Integration in Werkzeugmaschinen und Halbleiter-Lithografiesystemen
US9995696B2 (en) 2016-02-02 2018-06-12 Daniel Marc Himmel Open-air crystallization plate cooler
US11456532B2 (en) 2016-05-04 2022-09-27 California Institute Of Technology Modular optical phased array
US10382140B2 (en) 2016-06-07 2019-08-13 California Institute Of Technology Optical sparse phased array receiver
US11249369B2 (en) 2016-10-07 2022-02-15 California Institute Of Technology Integrated optical phased arrays with optically enhanced elements
US10795188B2 (en) * 2016-10-07 2020-10-06 California Institute Of Technology Thermally enhanced fast optical phase shifter
US10942273B2 (en) 2017-02-13 2021-03-09 California Institute Of Technology Passive matrix addressing of optical phased arrays
JP7175278B2 (ja) 2017-03-09 2022-11-18 カリフォルニア インスティチュート オブ テクノロジー コプライム光トランシーバアレイ
CN111247418A (zh) 2017-10-26 2020-06-05 粒子监测系统有限公司 粒子测量系统和方法
CN113692529A (zh) 2019-04-25 2021-11-23 粒子监测系统有限公司 用于轴上粒子检测和/或差分检测的粒子检测系统和方法
JP2023501769A (ja) 2019-11-22 2023-01-19 パーティクル・メージャーリング・システムズ・インコーポレーテッド 干渉粒子検出及び小サイズ寸法を有する粒子の検出のための高度なシステム及び方法

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2333119A1 (de) * 1973-06-29 1975-01-23 Licentia Gmbh Halbleiterlaser mit kuehlvorrichtung
US3941927A (en) * 1974-11-11 1976-03-02 Battelle Development Corporation Optical fiber deflection device
DE3048535A1 (de) * 1980-12-22 1982-07-08 Messerschmitt-Bölkow-Blohm GmbH, 8000 München Halbleiterlaser
JP2549307B2 (ja) * 1989-02-20 1996-10-30 敏雄 平井 熱電材料
DE3935610A1 (de) * 1989-10-26 1991-05-02 Messerschmitt Boelkow Blohm Monolithisch integrierbares peltier-kuehlelement
US5075555A (en) * 1990-08-10 1991-12-24 Kevex Instruments Peltier cooled lithium-drifted silicon x-ray spectrometer
US5127731A (en) * 1991-02-08 1992-07-07 Hughes Aircraft Company Stabilized two-color laser diode interferometer
JPH10200208A (ja) * 1997-01-09 1998-07-31 Nec Corp 半導体レーザーモジュール
US5898718A (en) * 1997-05-19 1999-04-27 Altos Inc. Method and apparatus for optimizing the output of a multi-peaked frequency harmonic generator
US5867303A (en) * 1997-05-19 1999-02-02 Altos Inc. Method and apparatus for optimizing the output of a harmonic generator
JPH1154848A (ja) * 1997-07-29 1999-02-26 Ando Electric Co Ltd 光モジュールの温度制御装置
AU6317000A (en) * 1999-08-03 2001-03-05 Toyo Kohan Co. Ltd. Thermoelectric device and manufacture thereof
DE10165080B4 (de) * 2000-09-20 2015-05-13 Hitachi Metals, Ltd. Siliciumnitrid-Pulver und -Sinterkörper sowie Verfahren zu deren Herstellung und Leiterplatte damit
US6711203B1 (en) * 2000-09-22 2004-03-23 Blueleaf, Inc. Optical transmitter comprising a stepwise tunable laser
US6611546B1 (en) * 2001-08-15 2003-08-26 Blueleaf, Inc. Optical transmitter comprising a stepwise tunable laser
US6741629B1 (en) * 2000-09-22 2004-05-25 Blueleaf, Inc. Optical transmitter having optically pumped vertical external cavity surface emitting laser
US6382762B1 (en) * 2001-04-30 2002-05-07 Hewlett-Packard Company Peltier humidity determination system for inkjet printing

Also Published As

Publication number Publication date
WO2003069744A1 (de) 2003-08-21
AU2002244626A1 (en) 2003-09-04
US20050138934A1 (en) 2005-06-30

Similar Documents

Publication Publication Date Title
DE10296494D2 (de) Optoelektronische Baugruppe mit Peltierkühlung
DE60301016D1 (de) Adaptermodul mit halterungsriegel
DE50307780D1 (de) Optoelektronisches bauelement
DE112005001431T5 (de) Thermoelektrisches Modul
DE60231371D1 (de) Thermoelektrische Wärmepumpe
DE60209895D1 (de) Reifenbauteile mit verbessertem elastizitätsmodul
DE60239934D1 (de) Optisches Übertragungsmodul mit Kühlkörper
DE60318905D1 (de) Optisches Element
DE60106323D1 (de) Optisches Halbleitermodul mit Temperaturregelung
DE60313877D1 (de) Halbleiterlasermodul mit verbesserter wellenlängenstabilität
DE20317904U1 (de) Laserdioden-Anordnung mit externem Resonator
DE60305745D1 (de) Vorrichtung mit photonischer Kristallstruktur
DE60121416D1 (de) Diodenlasermodul
DE60313777D1 (de) Optisches halbleiterbauelement
DE50313066D1 (de) Optisch gepumpte halbleiterlaservorrichtung
DE60224359D1 (de) Modulvorrichtung
DE60216842D1 (de) Optisches Halbleitermodul
DE10302134B8 (de) Halbleiterlaser mit Modulationsdotierung
DE502004012150D1 (de) Leistungshalbleitermodul
ATE311579T1 (de) Kühlelement
GB0313757D0 (en) Optical semiconductor module
DE50205609D1 (de) Leistungsmodul
DE502004008051D1 (de) Optisch gepumpte halbleiterlaservorrichtung
DE602004010218D1 (de) Thermisch geregeltes optisches Modul
DE60138359D1 (de) Optisches Modul

Legal Events

Date Code Title Description
OP8 Request for examination as to paragraph 44 patent law

Ref document number: 10296494

Country of ref document: DE

Date of ref document: 20050707

Kind code of ref document: P

8127 New person/name/address of the applicant

Owner name: MICROPELT GMBH, 79110 FREIBURG, DE

8131 Rejection