AU2002244626A1 - Optoelectronic component with a peltier cooler - Google Patents

Optoelectronic component with a peltier cooler

Info

Publication number
AU2002244626A1
AU2002244626A1 AU2002244626A AU2002244626A AU2002244626A1 AU 2002244626 A1 AU2002244626 A1 AU 2002244626A1 AU 2002244626 A AU2002244626 A AU 2002244626A AU 2002244626 A AU2002244626 A AU 2002244626A AU 2002244626 A1 AU2002244626 A1 AU 2002244626A1
Authority
AU
Australia
Prior art keywords
optoelectronic component
peltier cooler
peltier
cooler
optoelectronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
AU2002244626A
Inventor
Hans-Ludwig Althaus
Franz Auracher
Gustav Muller
Karl-Heinz Schlereth
Axel Schubert
Martin Weigert
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Infineon Technologies AG
Original Assignee
Infineon Technologies AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Infineon Technologies AG filed Critical Infineon Technologies AG
Publication of AU2002244626A1 publication Critical patent/AU2002244626A1/en
Withdrawn legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4266—Thermal aspects, temperature control or temperature monitoring
    • G02B6/4268—Cooling
    • G02B6/4271—Cooling with thermo electric cooling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/645—Heat extraction or cooling elements the elements being electrically controlled, e.g. Peltier elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/024—Arrangements for thermal management
    • H01S5/02407—Active cooling, e.g. the laser temperature is controlled by a thermo-electric cooler or water cooling
    • H01S5/02415—Active cooling, e.g. the laser temperature is controlled by a thermo-electric cooler or water cooling by using a thermo-electric cooler [TEC], e.g. Peltier element
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
    • H01L2924/10253—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19107—Disposition of discrete passive components off-chip wires

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • Semiconductor Lasers (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Optical Integrated Circuits (AREA)
AU2002244626A 2002-02-14 2002-02-14 Optoelectronic component with a peltier cooler Withdrawn AU2002244626A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/DE2002/000543 WO2003069744A1 (en) 2002-02-14 2002-02-14 Optoelectronic component with a peltier cooler

Publications (1)

Publication Number Publication Date
AU2002244626A1 true AU2002244626A1 (en) 2003-09-04

Family

ID=27674407

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2002244626A Withdrawn AU2002244626A1 (en) 2002-02-14 2002-02-14 Optoelectronic component with a peltier cooler

Country Status (4)

Country Link
US (1) US20050138934A1 (en)
AU (1) AU2002244626A1 (en)
DE (1) DE10296494D2 (en)
WO (1) WO2003069744A1 (en)

Families Citing this family (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7258839B2 (en) * 2001-12-21 2007-08-21 Cytonome, Inc. Temperature controlled microfabricated two-pin liquid sample dispensing system
JP3977315B2 (en) 2003-10-31 2007-09-19 ファイベスト株式会社 Optical communication device, optical communication system, and optical transceiver
US7167492B2 (en) 2003-12-19 2007-01-23 Infineon Technologies Ag Optoelectronic arrangement having at least one laser component, and a method for operating a laser component
US7232264B2 (en) 2003-12-19 2007-06-19 Infineon Technologies Ag Optoelectronic arrangement having a laser component, and a method for controlling the emitted wavelength of a laser component
US7118292B2 (en) * 2005-01-24 2006-10-10 Emcore Corporation Coaxial cooled laser modules with integrated thermal electric cooler and optical components
DE102007019296B4 (en) * 2007-04-24 2009-06-25 Siemens Ag Device comprising a combination of a magnetic resonance tomograph and a positron emission tomograph
DE102007044873A1 (en) * 2007-09-20 2009-04-16 Siemens Ag Method for stabilizing the reinforcement of a PET detection system
US20090149797A1 (en) * 2007-12-05 2009-06-11 Searete Llc, A Limited Liability Corporation Of The State Of Delaware System for reversible chemical modulation of neural activity
US8180446B2 (en) * 2007-12-05 2012-05-15 The Invention Science Fund I, Llc Method and system for cyclical neural modulation based on activity state
US8180447B2 (en) 2007-12-05 2012-05-15 The Invention Science Fund I, Llc Method for reversible chemical modulation of neural activity
US8165668B2 (en) * 2007-12-05 2012-04-24 The Invention Science Fund I, Llc Method for magnetic modulation of neural conduction
US8989858B2 (en) 2007-12-05 2015-03-24 The Invention Science Fund I, Llc Implant system for chemical modulation of neural activity
US8170658B2 (en) * 2007-12-05 2012-05-01 The Invention Science Fund I, Llc System for electrical modulation of neural conduction
US8165669B2 (en) * 2007-12-05 2012-04-24 The Invention Science Fund I, Llc System for magnetic modulation of neural conduction
US8195287B2 (en) * 2007-12-05 2012-06-05 The Invention Science Fund I, Llc Method for electrical modulation of neural conduction
US8170660B2 (en) 2007-12-05 2012-05-01 The Invention Science Fund I, Llc System for thermal modulation of neural activity
CN100483762C (en) * 2008-02-25 2009-04-29 鹤山丽得电子实业有限公司 LED device making method
US8240885B2 (en) * 2008-11-18 2012-08-14 Abl Ip Holding Llc Thermal management of LED lighting systems
JP2013115257A (en) * 2011-11-29 2013-06-10 Mitsubishi Electric Corp Optical module
TW201434133A (en) * 2013-02-23 2014-09-01 Luxnet Corp Light transceiver component packaging structure
DE102014006305B4 (en) * 2014-04-30 2017-11-23 Attocube Systems Ag Optical length measuring system with an interferometric displacement sensor for integration in machine tools and semiconductor lithography systems
US9995696B2 (en) 2016-02-02 2018-06-12 Daniel Marc Himmel Open-air crystallization plate cooler
US11456532B2 (en) 2016-05-04 2022-09-27 California Institute Of Technology Modular optical phased array
US10382140B2 (en) 2016-06-07 2019-08-13 California Institute Of Technology Optical sparse phased array receiver
US11249369B2 (en) 2016-10-07 2022-02-15 California Institute Of Technology Integrated optical phased arrays with optically enhanced elements
US10795188B2 (en) * 2016-10-07 2020-10-06 California Institute Of Technology Thermally enhanced fast optical phase shifter
US10942273B2 (en) 2017-02-13 2021-03-09 California Institute Of Technology Passive matrix addressing of optical phased arrays
US11336373B2 (en) 2017-03-09 2022-05-17 California Institute Of Technology Co-prime optical transceiver array
KR20230156814A (en) 2017-10-26 2023-11-14 파티클 머슈어링 시스템즈, 인크. System and method for particles measurement
WO2020219841A1 (en) 2019-04-25 2020-10-29 Particle Measuring Systems, Inc. Particle detection systems and methods for on-axis particle detection and/or differential detection
WO2021102256A1 (en) 2019-11-22 2021-05-27 Particle Measuring Systems, Inc. Advanced systems and methods for interferometric particle detection and detection of particles having small size dimensions

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2333119A1 (en) * 1973-06-29 1975-01-23 Licentia Gmbh Semiconductor laser with Peltier element heat sink - has Peltier elements between semiconductor body and heat sink block
US3941927A (en) * 1974-11-11 1976-03-02 Battelle Development Corporation Optical fiber deflection device
DE3048535A1 (en) * 1980-12-22 1982-07-08 Messerschmitt-Bölkow-Blohm GmbH, 8000 München Miniature semiconductor laser diode - has diode chip on small thermo-electric cooler and laser beam focussing gradient index fibres
JP2549307B2 (en) * 1989-02-20 1996-10-30 敏雄 平井 Thermoelectric material
DE3935610A1 (en) * 1989-10-26 1991-05-02 Messerschmitt Boelkow Blohm Monolithic semiconductor chip mfd. in micro-mechanical manner - has Peltier element over thin diaphragm, whose cold side lies on substrate island
US5075555A (en) * 1990-08-10 1991-12-24 Kevex Instruments Peltier cooled lithium-drifted silicon x-ray spectrometer
US5127731A (en) * 1991-02-08 1992-07-07 Hughes Aircraft Company Stabilized two-color laser diode interferometer
JPH10200208A (en) * 1997-01-09 1998-07-31 Nec Corp Semiconductor laser module
US5867303A (en) * 1997-05-19 1999-02-02 Altos Inc. Method and apparatus for optimizing the output of a harmonic generator
US5898718A (en) * 1997-05-19 1999-04-27 Altos Inc. Method and apparatus for optimizing the output of a multi-peaked frequency harmonic generator
JPH1154848A (en) * 1997-07-29 1999-02-26 Ando Electric Co Ltd Temperature control device for optical module
AU6317000A (en) * 1999-08-03 2001-03-05 Toyo Kohan Co. Ltd. Thermoelectric device and manufacture thereof
DE10165107B3 (en) * 2000-09-20 2015-06-18 Hitachi Metals, Ltd. Substrate with silicon nitride sintered body and printed circuit board
US6611546B1 (en) * 2001-08-15 2003-08-26 Blueleaf, Inc. Optical transmitter comprising a stepwise tunable laser
US6711203B1 (en) * 2000-09-22 2004-03-23 Blueleaf, Inc. Optical transmitter comprising a stepwise tunable laser
US6741629B1 (en) * 2000-09-22 2004-05-25 Blueleaf, Inc. Optical transmitter having optically pumped vertical external cavity surface emitting laser
US6382762B1 (en) * 2001-04-30 2002-05-07 Hewlett-Packard Company Peltier humidity determination system for inkjet printing

Also Published As

Publication number Publication date
DE10296494D2 (en) 2005-07-07
WO2003069744A1 (en) 2003-08-21
US20050138934A1 (en) 2005-06-30

Similar Documents

Publication Publication Date Title
AU2002244626A1 (en) Optoelectronic component with a peltier cooler
AU2003248993A1 (en) Optoelectronic devices
AU2003275662A1 (en) Light-emitting module
AU2003214822A1 (en) Light-emitting diode display
AU2003280708A1 (en) Light-emitting diode
AU2002368035A1 (en) Ge photodetectors
AU2002353425A1 (en) A camera module
AU2003226614A1 (en) Optical device
AU2002315146A1 (en) Tool with fastener engaging member
AU2003295559A1 (en) Glove with integrated light
AU2003297011A1 (en) Optical transceiver
AU2003240523A1 (en) Optical transceiver
AU2003268702A1 (en) Camera module
AU2003201893A1 (en) Optical module
AU2003274980A1 (en) Needle with fiberoptic capability
GB0225522D0 (en) Optical component assembly
AU2003226179A1 (en) Tensioner
AU2003262741A1 (en) Pigtail fastener
AU2003237030A1 (en) Electroluminescent device with improved light output
AU2003270072A1 (en) Carrier with tacky surfaces
AU2002361152A1 (en) Field device with a gps-module
AU2003232655A1 (en) Optical module with multiport
AU2002338822A1 (en) Integrated optical device
AU2002368246A1 (en) Integrated optical device
AU2003269270A1 (en) Optical device

Legal Events

Date Code Title Description
MK13 Application withdrawn section 141(2)/reg 8.3(2) - pct appl. non-entering nat. phase, withdrawn by applicant