DE60218669D1 - Hochtemperatur elektrostatischer halter - Google Patents

Hochtemperatur elektrostatischer halter

Info

Publication number
DE60218669D1
DE60218669D1 DE60218669T DE60218669T DE60218669D1 DE 60218669 D1 DE60218669 D1 DE 60218669D1 DE 60218669 T DE60218669 T DE 60218669T DE 60218669 T DE60218669 T DE 60218669T DE 60218669 D1 DE60218669 D1 DE 60218669D1
Authority
DE
Germany
Prior art keywords
chuck
heat transfer
expansion assembly
transfer body
plasma etching
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60218669T
Other languages
English (en)
Inventor
Greg Sexton
Alan Schoepp
Mark Allen Kennard
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lam Research Corp
Original Assignee
Lam Research Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lam Research Corp filed Critical Lam Research Corp
Application granted granted Critical
Publication of DE60218669D1 publication Critical patent/DE60218669D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67103—Apparatus for thermal treatment mainly by conduction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H01L21/6833—Details of electrostatic chucks

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Drying Of Semiconductors (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Physical Vapour Deposition (AREA)
DE60218669T 2001-06-28 2002-06-05 Hochtemperatur elektrostatischer halter Expired - Lifetime DE60218669D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/892,458 US6669783B2 (en) 2001-06-28 2001-06-28 High temperature electrostatic chuck
PCT/US2002/017663 WO2003003448A2 (en) 2001-06-28 2002-06-05 High temperature electrostatic chuck

Publications (1)

Publication Number Publication Date
DE60218669D1 true DE60218669D1 (de) 2007-04-19

Family

ID=25399981

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60218669T Expired - Lifetime DE60218669D1 (de) 2001-06-28 2002-06-05 Hochtemperatur elektrostatischer halter

Country Status (12)

Country Link
US (1) US6669783B2 (de)
EP (1) EP1399963B1 (de)
JP (1) JP4256257B2 (de)
KR (1) KR100907848B1 (de)
CN (2) CN1293620C (de)
AT (1) ATE356431T1 (de)
AU (1) AU2002303965A1 (de)
DE (1) DE60218669D1 (de)
IL (2) IL159497A0 (de)
RU (1) RU2295799C2 (de)
TW (1) TW550643B (de)
WO (1) WO2003003448A2 (de)

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Also Published As

Publication number Publication date
IL159497A0 (en) 2004-06-01
US6669783B2 (en) 2003-12-30
IL159497A (en) 2008-03-20
JP4256257B2 (ja) 2009-04-22
ATE356431T1 (de) 2007-03-15
TW550643B (en) 2003-09-01
KR100907848B1 (ko) 2009-07-14
AU2002303965A1 (en) 2003-03-03
CN1293620C (zh) 2007-01-03
US20030003749A1 (en) 2003-01-02
CN100437968C (zh) 2008-11-26
EP1399963A2 (de) 2004-03-24
RU2295799C2 (ru) 2007-03-20
WO2003003448A3 (en) 2003-05-08
KR20040015763A (ko) 2004-02-19
EP1399963B1 (de) 2007-03-07
WO2003003448A2 (en) 2003-01-09
JP2005516379A (ja) 2005-06-02
RU2004102206A (ru) 2005-02-27
CN1941317A (zh) 2007-04-04
CN1537328A (zh) 2004-10-13

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