ATE362650T1 - Hochtemperatur elektrostatischer halter - Google Patents

Hochtemperatur elektrostatischer halter

Info

Publication number
ATE362650T1
ATE362650T1 AT00311471T AT00311471T ATE362650T1 AT E362650 T1 ATE362650 T1 AT E362650T1 AT 00311471 T AT00311471 T AT 00311471T AT 00311471 T AT00311471 T AT 00311471T AT E362650 T1 ATE362650 T1 AT E362650T1
Authority
AT
Austria
Prior art keywords
chuck
heat transfer
high temperature
temperature electrostatic
electrostatic holder
Prior art date
Application number
AT00311471T
Other languages
English (en)
Inventor
Greg Sexton
Mark Allen Kennard
Alan Schoepp
Original Assignee
Lam Res Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lam Res Corp filed Critical Lam Res Corp
Application granted granted Critical
Publication of ATE362650T1 publication Critical patent/ATE362650T1/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T279/00—Chucks or sockets
    • Y10T279/23—Chucks or sockets with magnetic or electrostatic means

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Drying Of Semiconductors (AREA)
  • Physical Vapour Deposition (AREA)
  • Chemical Vapour Deposition (AREA)
AT00311471T 1999-12-22 2000-12-20 Hochtemperatur elektrostatischer halter ATE362650T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/469,287 US6377437B1 (en) 1999-12-22 1999-12-22 High temperature electrostatic chuck

Publications (1)

Publication Number Publication Date
ATE362650T1 true ATE362650T1 (de) 2007-06-15

Family

ID=23863212

Family Applications (1)

Application Number Title Priority Date Filing Date
AT00311471T ATE362650T1 (de) 1999-12-22 2000-12-20 Hochtemperatur elektrostatischer halter

Country Status (6)

Country Link
US (2) US6377437B1 (de)
EP (1) EP1111661B1 (de)
JP (1) JP4805450B2 (de)
AT (1) ATE362650T1 (de)
DE (1) DE60034862T2 (de)
TW (1) TW487951B (de)

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KR20160118205A (ko) * 2014-02-06 2016-10-11 어플라이드 머티어리얼스, 인코포레이티드 개선된 유동 전도성 및 균일성을 위해 축방향으로 대칭가능한 인라인 ｄｐｓ 챔버 하드웨어 설계
CN112366128B (zh) * 2014-04-09 2024-03-08 应用材料公司 用于在处理腔室中提供对称的流动路径的流动模块
US10249511B2 (en) * 2014-06-27 2019-04-02 Lam Research Corporation Ceramic showerhead including central gas injector for tunable convective-diffusive gas flow in semiconductor substrate processing apparatus
US10002782B2 (en) 2014-10-17 2018-06-19 Lam Research Corporation ESC assembly including an electrically conductive gasket for uniform RF power delivery therethrough
US9673071B2 (en) 2014-10-23 2017-06-06 Lam Research Corporation Buffer station for thermal control of semiconductor substrates transferred therethrough and method of transferring semiconductor substrates
CN111118477A (zh) 2015-06-05 2020-05-08 应用材料公司 赋予掺杂硼的碳膜静电夹持及极佳颗粒性能的渐变原位电荷捕捉层
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JP6873178B2 (ja) * 2019-03-26 2021-05-19 日本碍子株式会社 半導体製造装置用部材、その製法及び成形型
KR102615216B1 (ko) * 2020-05-15 2023-12-15 세메스 주식회사 정전 척, 기판 처리 장치 및 기판 처리 방법

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Also Published As

Publication number Publication date
JP2001250816A (ja) 2001-09-14
US6567258B2 (en) 2003-05-20
US6377437B1 (en) 2002-04-23
JP4805450B2 (ja) 2011-11-02
US20020075625A1 (en) 2002-06-20
DE60034862D1 (de) 2007-06-28
EP1111661A3 (de) 2004-02-04
DE60034862T2 (de) 2008-01-24
TW487951B (en) 2002-05-21
EP1111661B1 (de) 2007-05-16
EP1111661A2 (de) 2001-06-27

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Legal Events

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