DE60213151T2 - Abriebfeste leitende Film und Dichtung - Google Patents
Abriebfeste leitende Film und Dichtung Download PDFInfo
- Publication number
- DE60213151T2 DE60213151T2 DE60213151T DE60213151T DE60213151T2 DE 60213151 T2 DE60213151 T2 DE 60213151T2 DE 60213151 T DE60213151 T DE 60213151T DE 60213151 T DE60213151 T DE 60213151T DE 60213151 T2 DE60213151 T2 DE 60213151T2
- Authority
- DE
- Germany
- Prior art keywords
- film
- metal
- layer
- conductive
- coating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000005299 abrasion Methods 0.000 title claims description 23
- 229910052751 metal Inorganic materials 0.000 claims description 69
- 239000002184 metal Substances 0.000 claims description 69
- 239000010410 layer Substances 0.000 claims description 51
- 239000011248 coating agent Substances 0.000 claims description 40
- 238000000576 coating method Methods 0.000 claims description 40
- 229920006254 polymer film Polymers 0.000 claims description 17
- 238000000034 method Methods 0.000 claims description 13
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 12
- 229910052709 silver Inorganic materials 0.000 claims description 12
- 239000004332 silver Substances 0.000 claims description 12
- 230000003628 erosive effect Effects 0.000 claims description 8
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 6
- 238000000151 deposition Methods 0.000 claims description 6
- 238000004049 embossing Methods 0.000 claims description 6
- 229910001026 inconel Inorganic materials 0.000 claims description 5
- 229910001120 nichrome Inorganic materials 0.000 claims description 5
- 238000005260 corrosion Methods 0.000 claims description 4
- 230000007797 corrosion Effects 0.000 claims description 4
- 239000012071 phase Substances 0.000 claims description 4
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 4
- 238000007740 vapor deposition Methods 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 3
- 239000012790 adhesive layer Substances 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 230000008021 deposition Effects 0.000 claims description 3
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- 229910052755 nonmetal Inorganic materials 0.000 claims description 3
- 229910052718 tin Inorganic materials 0.000 claims description 3
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 2
- 229910052804 chromium Inorganic materials 0.000 claims description 2
- 239000011651 chromium Substances 0.000 claims description 2
- 230000005670 electromagnetic radiation Effects 0.000 claims description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 2
- 229910052737 gold Inorganic materials 0.000 claims description 2
- 239000010931 gold Substances 0.000 claims description 2
- 229910052697 platinum Inorganic materials 0.000 claims description 2
- 230000005855 radiation Effects 0.000 claims description 2
- 239000010936 titanium Substances 0.000 claims description 2
- 229910052719 titanium Inorganic materials 0.000 claims description 2
- 239000007789 gas Substances 0.000 claims 3
- 229920001940 conductive polymer Polymers 0.000 claims 1
- 239000007792 gaseous phase Substances 0.000 claims 1
- 239000010408 film Substances 0.000 description 36
- 239000011162 core material Substances 0.000 description 15
- 239000000463 material Substances 0.000 description 12
- 239000004744 fabric Substances 0.000 description 7
- 238000005253 cladding Methods 0.000 description 5
- 239000011104 metalized film Substances 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 230000006835 compression Effects 0.000 description 3
- 238000007906 compression Methods 0.000 description 3
- 239000003063 flame retardant Substances 0.000 description 3
- 239000006260 foam Substances 0.000 description 3
- 230000003647 oxidation Effects 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- 239000002759 woven fabric Substances 0.000 description 3
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 229920000092 linear low density polyethylene Polymers 0.000 description 2
- 239000004707 linear low-density polyethylene Substances 0.000 description 2
- 239000004745 nonwoven fabric Substances 0.000 description 2
- 239000011368 organic material Substances 0.000 description 2
- -1 polypropylene Polymers 0.000 description 2
- SQGYOTSLMSWVJD-UHFFFAOYSA-N silver(1+) nitrate Chemical compound [Ag+].[O-]N(=O)=O SQGYOTSLMSWVJD-UHFFFAOYSA-N 0.000 description 2
- 238000001228 spectrum Methods 0.000 description 2
- 239000002344 surface layer Substances 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 150000001722 carbon compounds Chemical class 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000010410 dusting Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000005470 impregnation Methods 0.000 description 1
- 229910001055 inconels 600 Inorganic materials 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000012811 non-conductive material Substances 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 230000010152 pollination Effects 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 229910001961 silver nitrate Inorganic materials 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000001947 vapour-phase growth Methods 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/0015—Gaskets or seals
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S277/00—Seal for a joint or juncture
- Y10S277/92—Seal including electromagnetic shielding feature
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49126—Assembling bases
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49128—Assembling formed circuit to base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Non-Insulated Conductors (AREA)
- Gasket Seals (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US805324 | 2001-03-13 | ||
| US09/805,324 US6541698B2 (en) | 2001-03-13 | 2001-03-13 | Abrasion resistant conductive film and gasket |
| CA2376408A CA2376408C (en) | 2001-03-13 | 2002-03-14 | Abrasion resistant conductive film and gasket |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DE60213151D1 DE60213151D1 (de) | 2006-08-31 |
| DE60213151T2 true DE60213151T2 (de) | 2006-11-23 |
Family
ID=32313416
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE60213151T Expired - Lifetime DE60213151T2 (de) | 2001-03-13 | 2002-03-13 | Abriebfeste leitende Film und Dichtung |
Country Status (7)
| Country | Link |
|---|---|
| US (2) | US6541698B2 (https=) |
| EP (1) | EP1250036B1 (https=) |
| JP (1) | JP3782372B2 (https=) |
| CA (1) | CA2376408C (https=) |
| DE (1) | DE60213151T2 (https=) |
| ES (1) | ES2267942T3 (https=) |
| TW (1) | TW547003B (https=) |
Families Citing this family (37)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7105234B2 (en) * | 2001-03-30 | 2006-09-12 | Schlegel Systems, Inc. | Flame retardant corrosive resistant conductive fabric article and method |
| FI20012507A7 (fi) * | 2001-12-19 | 2003-06-20 | Perlos Oyj | Sähköä johtava tiiviste |
| CN1444439A (zh) * | 2002-03-11 | 2003-09-24 | 赫尔穆特·卡尔 | 带有导电涂覆的屏蔽密封层或屏蔽壁的设备罩 |
| US6686263B1 (en) * | 2002-12-09 | 2004-02-03 | Advanced Micro Devices, Inc. | Selective formation of top memory electrode by electroless formation of conductive materials |
| US7326862B2 (en) * | 2003-02-13 | 2008-02-05 | Parker-Hannifin Corporation | Combination metal and plastic EMI shield |
| GB0328246D0 (en) * | 2003-12-04 | 2004-06-16 | Qinetiq Ltd | Improvements relating to electronic circuit packages |
| US6818822B1 (en) * | 2004-04-08 | 2004-11-16 | International Business Machines Corporation | Conductive gasket including internal contact-enhancing strip |
| US6943288B1 (en) | 2004-06-04 | 2005-09-13 | Schlegel Systems, Inc. | EMI foil laminate gasket |
| CN1985555B (zh) * | 2004-12-15 | 2010-04-21 | Nok株式会社 | 电磁波屏蔽用垫圈 |
| US8545974B2 (en) * | 2005-02-09 | 2013-10-01 | Laird Technologies, Inc. | Flame retardant EMI shields |
| US20100258344A1 (en) * | 2005-02-09 | 2010-10-14 | Laird Technologies, Inc. | Flame retardant emi shields |
| DE602006002805D1 (de) * | 2005-02-16 | 2008-10-30 | Parker Hannifin Corp | Flammwidrige emi-abschirmdichtung |
| US7922421B2 (en) * | 2005-12-15 | 2011-04-12 | Urban Environmental Corp. | Shoreline erosion and flood control system and method |
| JP4944528B2 (ja) * | 2006-07-25 | 2012-06-06 | ポリマテック株式会社 | 緩衝部材 |
| EP1940214A1 (en) * | 2006-12-29 | 2008-07-02 | Chao-Jen Wang | Flexible foil and method for manufacturing the same |
| US20080157915A1 (en) * | 2007-01-03 | 2008-07-03 | Ethan Lin | Flame retardant, electrically-conductive pressure sensitive adhesive materials and methods of making the same |
| TWI338733B (en) * | 2007-07-05 | 2011-03-11 | Formosa Taffeta Co Ltd | Method for manufacturing embossed conductive clothes |
| US20090116208A1 (en) * | 2007-11-02 | 2009-05-07 | Nokia Corporation | Electronic device electrical shielding |
| EP2356896B1 (en) * | 2008-11-10 | 2019-09-04 | Finisar Corporation | Electromagnetic shielding configuration |
| JP5256079B2 (ja) * | 2009-03-03 | 2013-08-07 | アキレス株式会社 | 電磁波シールド用ガスケット、及び電磁波シールド用ガスケットの製造方法。 |
| DK2454546T3 (en) * | 2009-07-16 | 2015-10-05 | Lockheed Corp | Spiral rørbundtsarrangementer for heat exchangers |
| KR20120051685A (ko) | 2009-07-17 | 2012-05-22 | 록히드 마틴 코포레이션 | 열 교환기 및 제작 방법 |
| US9777971B2 (en) | 2009-10-06 | 2017-10-03 | Lockheed Martin Corporation | Modular heat exchanger |
| USD632259S1 (en) | 2010-03-16 | 2011-02-08 | Leppert James B | Coaxial cable |
| CN203136434U (zh) * | 2010-05-19 | 2013-08-14 | 莫列斯公司 | 插座组件及emi屏蔽元件 |
| CN103098574A (zh) * | 2010-07-20 | 2013-05-08 | 布雷迪转换公司 | 导电接地垫 |
| US9670911B2 (en) | 2010-10-01 | 2017-06-06 | Lockheed Martin Corporation | Manifolding arrangement for a modular heat-exchange apparatus |
| US9388798B2 (en) | 2010-10-01 | 2016-07-12 | Lockheed Martin Corporation | Modular heat-exchange apparatus |
| KR101048083B1 (ko) * | 2010-10-14 | 2011-07-11 | 주식회사 이노칩테크놀로지 | 전자파 차폐 가스켓 |
| WO2012154758A1 (en) * | 2011-05-10 | 2012-11-15 | Thermal Conductive Bonding, Inc. | Elastomer bonded item and method for debonding |
| CN202721947U (zh) | 2011-11-03 | 2013-02-06 | 卢子鬯 | 电子仪器用之无卤素阻燃电磁干扰防护垫片 |
| US8952258B2 (en) * | 2012-09-21 | 2015-02-10 | International Business Machines Corporation | Implementing graphene interconnect for high conductivity applications |
| US9831589B2 (en) * | 2012-10-03 | 2017-11-28 | Corad Technology Inc. | Compressible pin assembly having frictionlessly connected contact elements |
| US9332680B2 (en) * | 2013-03-15 | 2016-05-03 | Autoliv Asp, Inc. | Electrical gasket and electronic module having electrical gasket |
| WO2016111512A1 (en) | 2015-01-09 | 2016-07-14 | Samsung Electronics Co., Ltd. | Semiconductor package and method of manufacturing the same |
| KR102719116B1 (ko) * | 2019-08-12 | 2024-11-20 | 현대자동차주식회사 | 차량용 바디웨더스트립 |
| US11500248B2 (en) * | 2020-07-31 | 2022-11-15 | Innolux Corporation | Sealing structure and an electronic device having the same |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3783173A (en) * | 1972-05-19 | 1974-01-01 | Us Army | Gasket-electrically conductive |
| US3833951A (en) | 1973-04-02 | 1974-09-10 | Rohm & Haas | Cigarette burn resistant mattresses having aluminized polyurethane foam layer |
| JPS60134067A (ja) | 1983-12-19 | 1985-07-17 | 豊田合成株式会社 | 繊維物 |
| US4857668A (en) | 1988-04-15 | 1989-08-15 | Schlegel Corporation | Multi-function gasket |
| US4977296A (en) * | 1989-02-23 | 1990-12-11 | Hemming Leland H | Radio frequency shielding tape |
| US5039825A (en) * | 1989-06-09 | 1991-08-13 | Digital Equipment Corporation | Corrugated strip gasket for an electronic enclosure joint to reduce both electromagnetic and radio frequency radiation |
| US5045635A (en) | 1989-06-16 | 1991-09-03 | Schlegel Corporation | Conductive gasket with flame and abrasion resistant conductive coating |
| US5646369A (en) | 1995-04-03 | 1997-07-08 | Schlegel Corporation | Segmented shielding structure for connector panels |
| US5656795A (en) | 1995-04-03 | 1997-08-12 | Schlegel Corporation | Segmented shielding structure for connector panels |
| US5674606A (en) | 1995-04-06 | 1997-10-07 | Parker-Hannifin Corporation | Electrically conductive flame retardant materials and methods of manufacture |
| US5712449A (en) | 1995-05-24 | 1998-01-27 | Schlegel Corporation | Wide area emi gasket with conductors traversing core |
| FI991456A7 (fi) * | 1999-06-24 | 2000-12-25 | Nokia Corp | EMI-tiivistys |
| US6368682B1 (en) * | 1999-10-22 | 2002-04-09 | 3M Innovative Properties Company | Composition and structures made therefrom |
-
2001
- 2001-03-13 US US09/805,324 patent/US6541698B2/en not_active Expired - Fee Related
-
2002
- 2002-01-11 US US10/044,053 patent/US6901660B2/en not_active Expired - Fee Related
- 2002-03-12 TW TW091104555A patent/TW547003B/zh not_active IP Right Cessation
- 2002-03-13 JP JP2002115494A patent/JP3782372B2/ja not_active Expired - Fee Related
- 2002-03-13 DE DE60213151T patent/DE60213151T2/de not_active Expired - Lifetime
- 2002-03-13 ES ES02251793T patent/ES2267942T3/es not_active Expired - Lifetime
- 2002-03-13 EP EP02251793A patent/EP1250036B1/en not_active Expired - Lifetime
- 2002-03-14 CA CA2376408A patent/CA2376408C/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| EP1250036A2 (en) | 2002-10-16 |
| TW547003B (en) | 2003-08-11 |
| CA2376408A1 (en) | 2003-09-14 |
| EP1250036A3 (en) | 2003-12-03 |
| JP3782372B2 (ja) | 2006-06-07 |
| ES2267942T3 (es) | 2007-03-16 |
| JP2003037386A (ja) | 2003-02-07 |
| US6541698B2 (en) | 2003-04-01 |
| EP1250036B1 (en) | 2006-07-19 |
| US20020129953A1 (en) | 2002-09-19 |
| DE60213151D1 (de) | 2006-08-31 |
| CA2376408C (en) | 2011-02-22 |
| US6901660B2 (en) | 2005-06-07 |
| US20020129494A1 (en) | 2002-09-19 |
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