JP3782372B2 - 耐摩耗性導電フィルムおよびガスケット - Google Patents

耐摩耗性導電フィルムおよびガスケット Download PDF

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Publication number
JP3782372B2
JP3782372B2 JP2002115494A JP2002115494A JP3782372B2 JP 3782372 B2 JP3782372 B2 JP 3782372B2 JP 2002115494 A JP2002115494 A JP 2002115494A JP 2002115494 A JP2002115494 A JP 2002115494A JP 3782372 B2 JP3782372 B2 JP 3782372B2
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JP
Japan
Prior art keywords
gasket
conductive
metal
layer
film
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2002115494A
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English (en)
Japanese (ja)
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JP2003037386A5 (https=
JP2003037386A (ja
Inventor
アール、ミスカ スタンリー
Original Assignee
シュレーゲル システムズ，インコーポレイテッド
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Publication of JP2003037386A publication Critical patent/JP2003037386A/ja
Publication of JP2003037386A5 publication Critical patent/JP2003037386A5/ja
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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/0015—Gaskets or seals
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S277/00—Seal for a joint or juncture
    • Y10S277/92—Seal including electromagnetic shielding feature
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49128—Assembling formed circuit to base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Non-Insulated Conductors (AREA)
  • Gasket Seals (AREA)
  • Laminated Bodies (AREA)
JP2002115494A 2001-03-13 2002-03-13 耐摩耗性導電フィルムおよびガスケット Expired - Fee Related JP3782372B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US805324 2001-03-13
US09/805,324 US6541698B2 (en) 2001-03-13 2001-03-13 Abrasion resistant conductive film and gasket
CA2376408A CA2376408C (en) 2001-03-13 2002-03-14 Abrasion resistant conductive film and gasket

Publications (3)

Publication Number Publication Date
JP2003037386A JP2003037386A (ja) 2003-02-07
JP2003037386A5 JP2003037386A5 (https=) 2004-08-19
JP3782372B2 true JP3782372B2 (ja) 2006-06-07

Family

ID=32313416

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002115494A Expired - Fee Related JP3782372B2 (ja) 2001-03-13 2002-03-13 耐摩耗性導電フィルムおよびガスケット

Country Status (7)

Country Link
US (2) US6541698B2 (https=)
EP (1) EP1250036B1 (https=)
JP (1) JP3782372B2 (https=)
CA (1) CA2376408C (https=)
DE (1) DE60213151T2 (https=)
ES (1) ES2267942T3 (https=)
TW (1) TW547003B (https=)

Families Citing this family (37)

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US7105234B2 (en) * 2001-03-30 2006-09-12 Schlegel Systems, Inc. Flame retardant corrosive resistant conductive fabric article and method
FI20012507A7 (fi) * 2001-12-19 2003-06-20 Perlos Oyj Sähköä johtava tiiviste
CN1444439A (zh) * 2002-03-11 2003-09-24 赫尔穆特·卡尔 带有导电涂覆的屏蔽密封层或屏蔽壁的设备罩
US6686263B1 (en) * 2002-12-09 2004-02-03 Advanced Micro Devices, Inc. Selective formation of top memory electrode by electroless formation of conductive materials
US7326862B2 (en) * 2003-02-13 2008-02-05 Parker-Hannifin Corporation Combination metal and plastic EMI shield
GB0328246D0 (en) * 2003-12-04 2004-06-16 Qinetiq Ltd Improvements relating to electronic circuit packages
US6818822B1 (en) * 2004-04-08 2004-11-16 International Business Machines Corporation Conductive gasket including internal contact-enhancing strip
US6943288B1 (en) 2004-06-04 2005-09-13 Schlegel Systems, Inc. EMI foil laminate gasket
CN1985555B (zh) * 2004-12-15 2010-04-21 Nok株式会社 电磁波屏蔽用垫圈
US8545974B2 (en) * 2005-02-09 2013-10-01 Laird Technologies, Inc. Flame retardant EMI shields
US20100258344A1 (en) * 2005-02-09 2010-10-14 Laird Technologies, Inc. Flame retardant emi shields
DE602006002805D1 (de) * 2005-02-16 2008-10-30 Parker Hannifin Corp Flammwidrige emi-abschirmdichtung
US7922421B2 (en) * 2005-12-15 2011-04-12 Urban Environmental Corp. Shoreline erosion and flood control system and method
JP4944528B2 (ja) * 2006-07-25 2012-06-06 ポリマテック株式会社 緩衝部材
EP1940214A1 (en) * 2006-12-29 2008-07-02 Chao-Jen Wang Flexible foil and method for manufacturing the same
US20080157915A1 (en) * 2007-01-03 2008-07-03 Ethan Lin Flame retardant, electrically-conductive pressure sensitive adhesive materials and methods of making the same
TWI338733B (en) * 2007-07-05 2011-03-11 Formosa Taffeta Co Ltd Method for manufacturing embossed conductive clothes
US20090116208A1 (en) * 2007-11-02 2009-05-07 Nokia Corporation Electronic device electrical shielding
EP2356896B1 (en) * 2008-11-10 2019-09-04 Finisar Corporation Electromagnetic shielding configuration
JP5256079B2 (ja) * 2009-03-03 2013-08-07 アキレス株式会社 電磁波シールド用ガスケット、及び電磁波シールド用ガスケットの製造方法。
DK2454546T3 (en) * 2009-07-16 2015-10-05 Lockheed Corp Spiral rørbundtsarrangementer for heat exchangers
KR20120051685A (ko) 2009-07-17 2012-05-22 록히드 마틴 코포레이션 열 교환기 및 제작 방법
US9777971B2 (en) 2009-10-06 2017-10-03 Lockheed Martin Corporation Modular heat exchanger
USD632259S1 (en) 2010-03-16 2011-02-08 Leppert James B Coaxial cable
CN203136434U (zh) * 2010-05-19 2013-08-14 莫列斯公司 插座组件及emi屏蔽元件
CN103098574A (zh) * 2010-07-20 2013-05-08 布雷迪转换公司 导电接地垫
US9670911B2 (en) 2010-10-01 2017-06-06 Lockheed Martin Corporation Manifolding arrangement for a modular heat-exchange apparatus
US9388798B2 (en) 2010-10-01 2016-07-12 Lockheed Martin Corporation Modular heat-exchange apparatus
KR101048083B1 (ko) * 2010-10-14 2011-07-11 주식회사 이노칩테크놀로지 전자파 차폐 가스켓
WO2012154758A1 (en) * 2011-05-10 2012-11-15 Thermal Conductive Bonding, Inc. Elastomer bonded item and method for debonding
CN202721947U (zh) 2011-11-03 2013-02-06 卢子鬯 电子仪器用之无卤素阻燃电磁干扰防护垫片
US8952258B2 (en) * 2012-09-21 2015-02-10 International Business Machines Corporation Implementing graphene interconnect for high conductivity applications
US9831589B2 (en) * 2012-10-03 2017-11-28 Corad Technology Inc. Compressible pin assembly having frictionlessly connected contact elements
US9332680B2 (en) * 2013-03-15 2016-05-03 Autoliv Asp, Inc. Electrical gasket and electronic module having electrical gasket
WO2016111512A1 (en) 2015-01-09 2016-07-14 Samsung Electronics Co., Ltd. Semiconductor package and method of manufacturing the same
KR102719116B1 (ko) * 2019-08-12 2024-11-20 현대자동차주식회사 차량용 바디웨더스트립
US11500248B2 (en) * 2020-07-31 2022-11-15 Innolux Corporation Sealing structure and an electronic device having the same

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3783173A (en) * 1972-05-19 1974-01-01 Us Army Gasket-electrically conductive
US3833951A (en) 1973-04-02 1974-09-10 Rohm & Haas Cigarette burn resistant mattresses having aluminized polyurethane foam layer
JPS60134067A (ja) 1983-12-19 1985-07-17 豊田合成株式会社 繊維物
US4857668A (en) 1988-04-15 1989-08-15 Schlegel Corporation Multi-function gasket
US4977296A (en) * 1989-02-23 1990-12-11 Hemming Leland H Radio frequency shielding tape
US5039825A (en) * 1989-06-09 1991-08-13 Digital Equipment Corporation Corrugated strip gasket for an electronic enclosure joint to reduce both electromagnetic and radio frequency radiation
US5045635A (en) 1989-06-16 1991-09-03 Schlegel Corporation Conductive gasket with flame and abrasion resistant conductive coating
US5646369A (en) 1995-04-03 1997-07-08 Schlegel Corporation Segmented shielding structure for connector panels
US5656795A (en) 1995-04-03 1997-08-12 Schlegel Corporation Segmented shielding structure for connector panels
US5674606A (en) 1995-04-06 1997-10-07 Parker-Hannifin Corporation Electrically conductive flame retardant materials and methods of manufacture
US5712449A (en) 1995-05-24 1998-01-27 Schlegel Corporation Wide area emi gasket with conductors traversing core
FI991456A7 (fi) * 1999-06-24 2000-12-25 Nokia Corp EMI-tiivistys
US6368682B1 (en) * 1999-10-22 2002-04-09 3M Innovative Properties Company Composition and structures made therefrom

Also Published As

Publication number Publication date
DE60213151T2 (de) 2006-11-23
EP1250036A2 (en) 2002-10-16
TW547003B (en) 2003-08-11
CA2376408A1 (en) 2003-09-14
EP1250036A3 (en) 2003-12-03
ES2267942T3 (es) 2007-03-16
JP2003037386A (ja) 2003-02-07
US6541698B2 (en) 2003-04-01
EP1250036B1 (en) 2006-07-19
US20020129953A1 (en) 2002-09-19
DE60213151D1 (de) 2006-08-31
CA2376408C (en) 2011-02-22
US6901660B2 (en) 2005-06-07
US20020129494A1 (en) 2002-09-19

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