DE602008001266D1 - Piezoelektrische Vorrichtung, Herstellungsverfahren dafür und Flüssigkeitsentladungsvorrichtung - Google Patents
Piezoelektrische Vorrichtung, Herstellungsverfahren dafür und FlüssigkeitsentladungsvorrichtungInfo
- Publication number
- DE602008001266D1 DE602008001266D1 DE200860001266 DE602008001266T DE602008001266D1 DE 602008001266 D1 DE602008001266 D1 DE 602008001266D1 DE 200860001266 DE200860001266 DE 200860001266 DE 602008001266 T DE602008001266 T DE 602008001266T DE 602008001266 D1 DE602008001266 D1 DE 602008001266D1
- Authority
- DE
- Germany
- Prior art keywords
- manufacturing
- liquid discharge
- discharge device
- piezoelectric
- piezoelectric device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000007788 liquid Substances 0.000 title 1
- 238000004519 manufacturing process Methods 0.000 title 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14201—Structure of print heads with piezoelectric elements
- B41J2/14233—Structure of print heads with piezoelectric elements of film type, deformed by bending and disposed on a diaphragm
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/07—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
- H10N30/074—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing
- H10N30/076—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing by vapour phase deposition
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/20—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators
- H10N30/204—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators using bending displacement, e.g. unimorph, bimorph or multimorph cantilever or membrane benders
- H10N30/2047—Membrane type
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/85—Piezoelectric or electrostrictive active materials
- H10N30/853—Ceramic compositions
- H10N30/8548—Lead-based oxides
- H10N30/8554—Lead-zirconium titanate [PZT] based
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/87—Electrodes or interconnections, e.g. leads or terminals
- H10N30/875—Further connection or lead arrangements, e.g. flexible wiring boards, terminal pins
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/87—Electrodes or interconnections, e.g. leads or terminals
- H10N30/877—Conductive materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/87—Electrodes or interconnections, e.g. leads or terminals
- H10N30/877—Conductive materials
- H10N30/878—Conductive materials the principal material being non-metallic, e.g. oxide or carbon based
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2202/00—Embodiments of or processes related to ink-jet or thermal heads
- B41J2202/01—Embodiments of or processes related to ink-jet heads
- B41J2202/03—Specific materials used
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/42—Piezoelectric device making
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
- Physical Vapour Deposition (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007055664 | 2007-03-06 |
Publications (1)
Publication Number | Publication Date |
---|---|
DE602008001266D1 true DE602008001266D1 (de) | 2010-07-01 |
Family
ID=39540695
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE200860001266 Active DE602008001266D1 (de) | 2007-03-06 | 2008-03-05 | Piezoelektrische Vorrichtung, Herstellungsverfahren dafür und Flüssigkeitsentladungsvorrichtung |
Country Status (4)
Country | Link |
---|---|
US (2) | US20080218559A1 (de) |
EP (1) | EP1968128B1 (de) |
JP (1) | JP2008252071A (de) |
DE (1) | DE602008001266D1 (de) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4829165B2 (ja) * | 2007-03-30 | 2011-12-07 | 富士フイルム株式会社 | 圧電素子製造方法及び液体吐出ヘッド製造方法 |
JP5288530B2 (ja) * | 2007-03-30 | 2013-09-11 | 富士フイルム株式会社 | 圧電素子製造方法及び液体吐出ヘッド製造方法 |
JP2009273838A (ja) * | 2008-05-19 | 2009-11-26 | Fujifilm Corp | 超音波探触子、超音波診断装置及び超音波内視鏡装置 |
JP4524000B1 (ja) * | 2009-01-20 | 2010-08-11 | パナソニック株式会社 | 圧電体薄膜とその製造方法、インクジェットヘッド、インクジェットヘッドを用いて画像を形成する方法、角速度センサ、角速度センサを用いて角速度を測定する方法、圧電発電素子ならびに圧電発電素子を用いた発電方法 |
JP5599203B2 (ja) * | 2010-03-02 | 2014-10-01 | キヤノン株式会社 | 圧電薄膜、圧電素子、圧電素子の製造方法、液体吐出ヘッドおよび超音波モータ |
KR101771717B1 (ko) * | 2011-03-31 | 2017-08-25 | 삼성전기주식회사 | 수정 진동자 및 수정 진동자의 전극 구조 |
DE102012105036A1 (de) * | 2012-06-12 | 2013-12-12 | Pyreos Ltd. | Verfahren zum Herstellen eines Mikrosystems |
JP5711710B2 (ja) * | 2012-09-25 | 2015-05-07 | 富士フイルム株式会社 | エッチング液、圧電素子の製造方法およびエッチング方法 |
KR101465366B1 (ko) | 2013-10-21 | 2014-11-25 | 성균관대학교산학협력단 | 신축성을 갖는 에너지 발전 소자 및 이의 제작 방법 |
JP5843081B2 (ja) * | 2014-06-05 | 2016-01-13 | セイコーエプソン株式会社 | 圧電素子、液体噴射ヘッドおよび液体噴射装置 |
JP6258241B2 (ja) | 2015-02-27 | 2018-01-10 | 富士フイルム株式会社 | 圧電アクチュエータ |
WO2016161013A1 (en) * | 2015-03-30 | 2016-10-06 | Alveo Energy, Inc. | Synthetic methods for transition metal coordination compounds |
JP6686444B2 (ja) * | 2016-01-07 | 2020-04-22 | 株式会社リコー | Pzt膜積層構造体、液体吐出ヘッド、液体吐出ユニット、液体を吐出する装置及びpzt膜積層構造体の製造方法 |
CN108701754B (zh) * | 2016-02-18 | 2022-07-26 | 柯尼卡美能达株式会社 | 压电元件的制造方法和压电元件 |
JP6868228B2 (ja) * | 2019-08-01 | 2021-05-12 | ブラザー工業株式会社 | 液体吐出装置及び液体吐出装置の製造方法 |
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US4500397A (en) * | 1981-07-27 | 1985-02-19 | Sony Corporation | Method for the preparation of a pyroelectric material |
JPS5855198A (ja) | 1981-09-30 | 1983-04-01 | Kobe Steel Ltd | 被覆ア−ク溶接棒のフラツクス塗装方法 |
JPS58194206A (ja) * | 1982-05-10 | 1983-11-12 | オムロン株式会社 | 強誘電体薄膜の製造方法 |
JPH07118554B2 (ja) | 1986-01-16 | 1995-12-18 | 日本電装株式会社 | 積層型の圧電体装置 |
JPS6355198A (ja) * | 1986-08-25 | 1988-03-09 | Nec Corp | 誘電体薄膜デバイス用基板 |
WO1992001955A1 (en) * | 1990-07-16 | 1992-02-06 | Atlantic Richfield Company | Torsional force transducer and method of operation |
US6158847A (en) * | 1995-07-14 | 2000-12-12 | Seiko Epson Corporation | Laminated ink-jet recording head, a process for production thereof and a printer equipped with the recording head |
JPH1060653A (ja) * | 1996-08-19 | 1998-03-03 | Canon Inc | 高周波プラズマcvd法による堆積膜形成方法 |
US6204525B1 (en) | 1997-09-22 | 2001-03-20 | Murata Manufacturing Co., Ltd. | Ferroelectric thin film device and method of producing the same |
JP3633304B2 (ja) * | 1997-09-22 | 2005-03-30 | 株式会社村田製作所 | 強誘電体薄膜素子の製造方法 |
US6231779B1 (en) * | 1997-10-20 | 2001-05-15 | Massachusetts Institute Of Technology | Piezoelectric actuators and method of making same |
JP4066518B2 (ja) * | 1998-06-01 | 2008-03-26 | 宇部興産株式会社 | 圧電結晶薄膜とその製造方法、および圧電体素子 |
JP3611198B2 (ja) * | 2000-02-16 | 2005-01-19 | 松下電器産業株式会社 | アクチュエータとこれを用いた情報記録再生装置 |
JP3944341B2 (ja) * | 2000-03-28 | 2007-07-11 | 株式会社東芝 | 酸化物エピタキシャル歪格子膜の製造法 |
JP4182329B2 (ja) * | 2001-09-28 | 2008-11-19 | セイコーエプソン株式会社 | 圧電体薄膜素子およびその製造方法、ならびにこれを用いた液体吐出ヘッド及び液体吐出装置 |
JP4451610B2 (ja) * | 2002-06-20 | 2010-04-14 | パナソニック株式会社 | 圧電素子、インクジェットヘッド、角速度センサ及びこれらの製造方法、並びにインクジェット式記録装置 |
US7083270B2 (en) | 2002-06-20 | 2006-08-01 | Matsushita Electric Industrial Co., Ltd. | Piezoelectric element, ink jet head, angular velocity sensor, method for manufacturing the same, and ink jet recording apparatus |
JP3971279B2 (ja) * | 2002-09-20 | 2007-09-05 | キヤノン株式会社 | 圧電体素子の製造方法 |
JP4328854B2 (ja) * | 2003-01-22 | 2009-09-09 | 独立行政法人産業技術総合研究所 | 圧電素子およびその製造方法 |
JP4328853B2 (ja) | 2003-01-22 | 2009-09-09 | 独立行政法人産業技術総合研究所 | 圧電素子およびその製造方法 |
JP3951997B2 (ja) * | 2003-09-25 | 2007-08-01 | ブラザー工業株式会社 | 液体移送装置 |
JP3952010B2 (ja) * | 2003-12-03 | 2007-08-01 | セイコーエプソン株式会社 | インクジェットヘッドの製造方法 |
JP2005209912A (ja) | 2004-01-23 | 2005-08-04 | Seiko Epson Corp | 圧電素子及び液体噴射ヘッド並びに圧電素子の製造方法 |
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JP3956950B2 (ja) * | 2004-03-30 | 2007-08-08 | 富士フイルム株式会社 | 吐出ヘッド駆動方法及び吐出ヘッド製造方法並びに液吐出装置 |
JP4849432B2 (ja) * | 2004-03-30 | 2012-01-11 | ブラザー工業株式会社 | 圧電膜の製造方法、基板と圧電膜との積層構造、圧電アクチュエータおよびその製造方法 |
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JP4224709B2 (ja) * | 2004-05-17 | 2009-02-18 | セイコーエプソン株式会社 | 圧電素子、圧電アクチュエーター、インクジェット式記録ヘッド、インクジェットプリンター、表面弾性波素子、周波数フィルタ、発振器、電子回路、薄膜圧電共振器、および電子機器 |
JP2005354582A (ja) * | 2004-06-14 | 2005-12-22 | Seiko Epson Corp | 超音波トランスデューサ及びこれを用いた超音波スピーカ |
JP2006013839A (ja) * | 2004-06-25 | 2006-01-12 | Ube Ind Ltd | 薄膜圧電共振器と薄膜圧電フィルタ |
US7419252B2 (en) | 2004-07-13 | 2008-09-02 | Brother Kogyo Kabushiki Kaisha | Ink jet head, piezo-electric actuator, and method of manufacturing them |
EP1616700A1 (de) * | 2004-07-13 | 2006-01-18 | Brother Kogyo Kabushiki Kaisha | Piezoelektrischer Aktor, Tintenstrahlkopf und dazugehöriges Herstellungsverfahren |
KR100573876B1 (ko) | 2004-07-13 | 2006-04-25 | 한국과학기술원 | 태양 복사 압력을 이용하여 타원 궤도에 있는 위성 자세제어 방법 |
JP2006054442A (ja) * | 2004-07-13 | 2006-02-23 | Brother Ind Ltd | 圧電アクチュエータ及びインクジェットヘッドの製造方法、圧電アクチュエータ及びインクジェットヘッド |
CN100402293C (zh) | 2004-07-13 | 2008-07-16 | 兄弟工业株式会社 | 压电致动器和喷墨头以及其制造方法 |
US7618129B2 (en) * | 2004-09-15 | 2009-11-17 | Fujifilm Corporation | Liquid ejection head and image forming apparatus comprising same |
JP2006239958A (ja) * | 2005-03-01 | 2006-09-14 | Fuji Photo Film Co Ltd | 液体吐出ヘッドの製造方法 |
JP5266609B2 (ja) * | 2005-03-28 | 2013-08-21 | 富士ゼロックス株式会社 | 圧電素子、液滴吐出ヘッド、液滴吐出装置 |
US7785747B2 (en) * | 2005-04-11 | 2010-08-31 | Worldwide Energy, Inc. Of Delaware | Stack configurations for tubular solid oxide fuel cells |
JP2006340007A (ja) * | 2005-06-01 | 2006-12-14 | Kyocera Corp | 薄膜バルク音響波共振子およびフィルタならびに通信装置 |
JP2006344618A (ja) * | 2005-06-07 | 2006-12-21 | Fujifilm Holdings Corp | 機能性膜含有構造体、及び、機能性膜の製造方法 |
JP4142705B2 (ja) * | 2006-09-28 | 2008-09-03 | 富士フイルム株式会社 | 成膜方法、圧電膜、圧電素子、及び液体吐出装置 |
-
2008
- 2008-02-20 JP JP2008038359A patent/JP2008252071A/ja active Pending
- 2008-03-05 DE DE200860001266 patent/DE602008001266D1/de active Active
- 2008-03-05 EP EP20080004108 patent/EP1968128B1/de not_active Not-in-force
- 2008-03-05 US US12/042,999 patent/US20080218559A1/en not_active Abandoned
-
2012
- 2012-01-10 US US13/347,333 patent/US8733905B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
EP1968128B1 (de) | 2010-05-19 |
EP1968128A1 (de) | 2008-09-10 |
US20120102696A1 (en) | 2012-05-03 |
JP2008252071A (ja) | 2008-10-16 |
US20080218559A1 (en) | 2008-09-11 |
US8733905B2 (en) | 2014-05-27 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |