DE602007013161D1 - Abstreifer mit Acetal oder Ketal zur Entfernung nach einem Ätzvorgang verbleibenden Photoresists, Ätzpolymers und sonstiger Reste - Google Patents

Abstreifer mit Acetal oder Ketal zur Entfernung nach einem Ätzvorgang verbleibenden Photoresists, Ätzpolymers und sonstiger Reste

Info

Publication number
DE602007013161D1
DE602007013161D1 DE602007013161T DE602007013161T DE602007013161D1 DE 602007013161 D1 DE602007013161 D1 DE 602007013161D1 DE 602007013161 T DE602007013161 T DE 602007013161T DE 602007013161 T DE602007013161 T DE 602007013161T DE 602007013161 D1 DE602007013161 D1 DE 602007013161D1
Authority
DE
Germany
Prior art keywords
ketal
acetal
scrapers
radicals
removal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602007013161T
Other languages
English (en)
Inventor
Matthew I Egbe
Michael Walter Legenza
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Air Products and Chemicals Inc
Original Assignee
Air Products and Chemicals Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Air Products and Chemicals Inc filed Critical Air Products and Chemicals Inc
Publication of DE602007013161D1 publication Critical patent/DE602007013161D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/26—Organic compounds containing oxygen
    • C11D7/264—Aldehydes; Ketones; Acetals or ketals
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/26—Organic compounds containing oxygen
    • C11D7/261—Alcohols; Phenols
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/26—Organic compounds containing oxygen
    • C11D7/263—Ethers
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/32—Organic compounds containing nitrogen
    • C11D7/3281—Heterocyclic compounds
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/50—Solvents
    • C11D7/5004—Organic solvents
    • C11D7/5022—Organic solvents containing oxygen
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
    • C11D2111/10—Objects to be cleaned
    • C11D2111/14—Hard surfaces
    • C11D2111/22—Electronic devices, e.g. PCBs or semiconductors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Wood Science & Technology (AREA)
  • Health & Medical Sciences (AREA)
  • Emergency Medicine (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
DE602007013161T 2006-10-19 2007-10-19 Abstreifer mit Acetal oder Ketal zur Entfernung nach einem Ätzvorgang verbleibenden Photoresists, Ätzpolymers und sonstiger Reste Active DE602007013161D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US85275806P 2006-10-19 2006-10-19
US11/868,469 US20080096785A1 (en) 2006-10-19 2007-10-05 Stripper Containing an Acetal or Ketal for Removing Post-Etched Photo-Resist, Etch Polymer and Residue

Publications (1)

Publication Number Publication Date
DE602007013161D1 true DE602007013161D1 (de) 2011-04-28

Family

ID=38974677

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602007013161T Active DE602007013161D1 (de) 2006-10-19 2007-10-19 Abstreifer mit Acetal oder Ketal zur Entfernung nach einem Ätzvorgang verbleibenden Photoresists, Ätzpolymers und sonstiger Reste

Country Status (7)

Country Link
US (1) US20080096785A1 (de)
EP (1) EP1914296B1 (de)
JP (2) JP4870646B2 (de)
KR (2) KR101009878B1 (de)
AT (1) ATE502100T1 (de)
DE (1) DE602007013161D1 (de)
TW (1) TWI414908B (de)

Families Citing this family (26)

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DE102005011719A1 (de) * 2005-03-15 2006-09-28 Clariant Produkte (Deutschland) Gmbh Wasch- und Reinigungsmittel enthaltend Acetale als organische Lösemittel
US7674755B2 (en) * 2005-12-22 2010-03-09 Air Products And Chemicals, Inc. Formulation for removal of photoresist, etch residue and BARC
WO2008039730A1 (en) * 2006-09-25 2008-04-03 Advanced Technology Materials, Inc. Compositions and methods for the removal of photoresist for a wafer rework application
US8026201B2 (en) * 2007-01-03 2011-09-27 Az Electronic Materials Usa Corp. Stripper for coating layer
JP5206177B2 (ja) * 2008-07-09 2013-06-12 三菱瓦斯化学株式会社 レジスト剥離液組成物およびそれを用いた半導体素子の製造方法
KR101664951B1 (ko) * 2010-01-26 2016-10-11 도미니온 엔지니어링 인코포레이티드 증착물들을 제거하기 위한 방법 및 조성물
JP2013531621A (ja) 2010-05-10 2013-08-08 サジティス・インコーポレイテッド 粒子状固体用の分散剤およびスリップ剤としてのアルキルケタールエステル、その製造法、および使用法
KR101169332B1 (ko) * 2010-05-12 2012-07-30 주식회사 이엔에프테크놀로지 포토레지스트 박리액 조성물
CN103052691B (zh) 2010-08-12 2014-05-28 赛格提斯有限公司 包含羧基酯缩酮聚结物的胶乳涂层组合物、其制备方法和应用
WO2012021824A2 (en) * 2010-08-12 2012-02-16 Segetis, Inc. Carboxy ester ketal removal compositions, methods of manufacture, and uses thereof
CN102221791B (zh) * 2011-04-29 2014-09-03 西安东旺精细化学有限公司 一种光致抗蚀剂的剥离液组合物
EP2557147B1 (de) * 2011-08-09 2015-04-01 Basf Se Wässrige basische Lösung und Verfahren zur Behandlung der Oberfläche von Siliziumsubstraten
DE102011088885A1 (de) * 2011-12-16 2013-06-20 Wacker Chemie Ag Siliconlöser
WO2013122172A1 (ja) * 2012-02-17 2013-08-22 三菱化学株式会社 半導体デバイス用洗浄液及び半導体デバイス用基板の洗浄方法
CN103365121B (zh) * 2012-03-29 2018-10-02 东友精细化工有限公司 抗蚀剂剥离组合物及利用该抗蚀剂剥离组合物剥离抗蚀剂的方法
KR101858755B1 (ko) 2012-06-18 2018-05-16 동우 화인켐 주식회사 유-무기 하이브리드형 배향막 제거 조성물
WO2014047428A1 (en) * 2012-09-21 2014-03-27 Segetis, Inc. Cleaning, surfactant, and personal care compositions
KR101946379B1 (ko) * 2012-11-20 2019-02-11 주식회사 동진쎄미켐 포토레지스트 박리액 조성물 및 포토레지스트의 박리방법
US9156809B2 (en) 2012-11-29 2015-10-13 Segetis, Inc. Carboxy ester ketals, methods of manufacture, and uses thereof
US9460934B2 (en) * 2013-03-15 2016-10-04 Globalfoundries Inc. Wet strip process for an antireflective coating layer
US9580672B2 (en) * 2014-09-26 2017-02-28 Taiwan Semiconductor Manufacturing Company, Ltd. Cleaning composition and method for semiconductor device fabrication
CN104263546A (zh) * 2014-10-02 2015-01-07 济南瑞东实业有限公司 一种高效无污染工业水基全清洗剂及其制备方法
JP6556834B2 (ja) * 2015-04-10 2019-08-07 富士フイルム株式会社 レジスト除去液、レジスト除去方法、再生半導体基板の製造方法
TWI686461B (zh) * 2019-02-01 2020-03-01 才將科技股份有限公司 一種具有高矽／二氧化矽蝕刻的選擇比的矽蝕刻劑及其應用
US11401402B2 (en) 2020-07-10 2022-08-02 Protocol Environmental Solutions, Inc. Compositions and methods for removal of pressure sensitive adhesives
TWI749964B (zh) * 2020-12-24 2021-12-11 達興材料股份有限公司 鹼性清洗組合物、清洗方法和半導體製造方法

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* Cited by examiner, † Cited by third party
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US5484547A (en) * 1992-04-01 1996-01-16 The Dow Chemical Company Low temperature heat transfer fluids
JP3229712B2 (ja) * 1993-06-08 2001-11-19 花王株式会社 洗浄剤組成物
US5466389A (en) * 1994-04-20 1995-11-14 J. T. Baker Inc. PH adjusted nonionic surfactant-containing alkaline cleaner composition for cleaning microelectronics substrates
US6689734B2 (en) * 1997-07-30 2004-02-10 Kyzen Corporation Low ozone depleting brominated compound mixtures for use in solvent and cleaning applications
JP4044219B2 (ja) * 1998-09-09 2008-02-06 花王株式会社 剥離剤組成物
JP4138096B2 (ja) * 1998-09-09 2008-08-20 花王株式会社 剥離剤組成物
JP2001100436A (ja) * 1999-09-28 2001-04-13 Mitsubishi Gas Chem Co Inc レジスト剥離液組成物
JP2001188361A (ja) * 1999-12-28 2001-07-10 Mitsubishi Gas Chem Co Inc エッジビードリムーバ
JP2001181684A (ja) * 1999-12-28 2001-07-03 Mitsubishi Gas Chem Co Inc エッジビードリムーバ
US6911293B2 (en) * 2002-04-11 2005-06-28 Clariant Finance (Bvi) Limited Photoresist compositions comprising acetals and ketals as solvents
JP2004029346A (ja) * 2002-06-25 2004-01-29 Mitsubishi Gas Chem Co Inc レジスト剥離液組成物
AU2003257636A1 (en) * 2002-08-22 2004-03-11 Daikin Industries, Ltd. Removing solution
JP4202859B2 (ja) * 2003-08-05 2008-12-24 花王株式会社 レジスト用剥離剤組成物
US9217929B2 (en) * 2004-07-22 2015-12-22 Air Products And Chemicals, Inc. Composition for removing photoresist and/or etching residue from a substrate and use thereof
US8178482B2 (en) * 2004-08-03 2012-05-15 Avantor Performance Materials, Inc. Cleaning compositions for microelectronic substrates
DE102005011719A1 (de) * 2005-03-15 2006-09-28 Clariant Produkte (Deutschland) Gmbh Wasch- und Reinigungsmittel enthaltend Acetale als organische Lösemittel
US7700533B2 (en) * 2005-06-23 2010-04-20 Air Products And Chemicals, Inc. Composition for removal of residue comprising cationic salts and methods using same

Also Published As

Publication number Publication date
KR20110004341A (ko) 2011-01-13
KR20080035494A (ko) 2008-04-23
JP2012033946A (ja) 2012-02-16
US20080096785A1 (en) 2008-04-24
KR101009878B1 (ko) 2011-01-19
EP1914296A3 (de) 2009-03-04
EP1914296A2 (de) 2008-04-23
TWI414908B (zh) 2013-11-11
EP1914296B1 (de) 2011-03-16
JP4870646B2 (ja) 2012-02-08
ATE502100T1 (de) 2011-04-15
TW200819927A (en) 2008-05-01
JP2008103730A (ja) 2008-05-01

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