DE602006013014D1 - Durch wärme härtbare harzzusammensetzung auf basis carboxylierter polyurethane enthaltend silikonpulver - Google Patents

Durch wärme härtbare harzzusammensetzung auf basis carboxylierter polyurethane enthaltend silikonpulver

Info

Publication number
DE602006013014D1
DE602006013014D1 DE200660013014 DE602006013014T DE602006013014D1 DE 602006013014 D1 DE602006013014 D1 DE 602006013014D1 DE 200660013014 DE200660013014 DE 200660013014 DE 602006013014 T DE602006013014 T DE 602006013014T DE 602006013014 D1 DE602006013014 D1 DE 602006013014D1
Authority
DE
Germany
Prior art keywords
resin composition
resistant resin
composition based
containing silicone
silicone powder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE200660013014
Other languages
English (en)
Inventor
Kazuya Kimura
Hiroshi Uchida
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Holdings Corp
Original Assignee
Showa Denko KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Showa Denko KK filed Critical Showa Denko KK
Publication of DE602006013014D1 publication Critical patent/DE602006013014D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C08K7/04—Fibres or whiskers inorganic
    • C08K7/10—Silicon-containing compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/08—Processes
    • C08G18/0804—Manufacture of polymers containing ionic or ionogenic groups
    • C08G18/0819—Manufacture of polymers containing ionic or ionogenic groups containing anionic or anionogenic groups
    • C08G18/0823—Manufacture of polymers containing ionic or ionogenic groups containing anionic or anionogenic groups containing carboxylate salt groups or groups forming them
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/08—Processes
    • C08G18/0838—Manufacture of polymers in the presence of non-reactive compounds
    • C08G18/0842—Manufacture of polymers in the presence of non-reactive compounds in the presence of liquid diluents
    • C08G18/0847—Manufacture of polymers in the presence of non-reactive compounds in the presence of liquid diluents in the presence of solvents for the polymers
    • C08G18/0852—Manufacture of polymers in the presence of non-reactive compounds in the presence of liquid diluents in the presence of solvents for the polymers the solvents being organic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/08—Processes
    • C08G18/10—Prepolymer processes involving reaction of isocyanates or isothiocyanates with compounds having active hydrogen in a first reaction step
    • C08G18/12—Prepolymer processes involving reaction of isocyanates or isothiocyanates with compounds having active hydrogen in a first reaction step using two or more compounds having active hydrogen in the first polymerisation step
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/30—Low-molecular-weight compounds
    • C08G18/34—Carboxylic acids; Esters thereof with monohydroxyl compounds
    • C08G18/348—Hydroxycarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/40—High-molecular-weight compounds
    • C08G18/42—Polycondensates having carboxylic or carbonic ester groups in the main chain
    • C08G18/44—Polycarbonates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/65—Low-molecular-weight compounds having active hydrogen with high-molecular-weight compounds having active hydrogen
    • C08G18/66—Compounds of groups C08G18/42, C08G18/48, or C08G18/52
    • C08G18/6633—Compounds of group C08G18/42
    • C08G18/6659—Compounds of group C08G18/42 with compounds of group C08G18/34
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
    • C08G18/72—Polyisocyanates or polyisothiocyanates
    • C08G18/74—Polyisocyanates or polyisothiocyanates cyclic
    • C08G18/75—Polyisocyanates or polyisothiocyanates cyclic cycloaliphatic
    • C08G18/758—Polyisocyanates or polyisothiocyanates cyclic cycloaliphatic containing two or more cycloaliphatic rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/16—Solid spheres
    • C08K7/18—Solid spheres inorganic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L75/00—Compositions of polyureas or polyurethanes; Compositions of derivatives of such polymers
    • C08L75/04—Polyurethanes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0162—Silicon containing polymer, e.g. silicone
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0212—Resin particles
DE200660013014 2005-10-07 2006-10-04 Durch wärme härtbare harzzusammensetzung auf basis carboxylierter polyurethane enthaltend silikonpulver Active DE602006013014D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005295276A JP5399603B2 (ja) 2005-10-07 2005-10-07 シリコーンパウダーを含む熱硬化性樹脂組成物
PCT/JP2006/320233 WO2007043536A2 (en) 2005-10-07 2006-10-04 Heat-curable resin composition including silicone powder

Publications (1)

Publication Number Publication Date
DE602006013014D1 true DE602006013014D1 (de) 2010-04-29

Family

ID=37745832

Family Applications (1)

Application Number Title Priority Date Filing Date
DE200660013014 Active DE602006013014D1 (de) 2005-10-07 2006-10-04 Durch wärme härtbare harzzusammensetzung auf basis carboxylierter polyurethane enthaltend silikonpulver

Country Status (8)

Country Link
US (1) US20090133905A1 (de)
EP (1) EP1937776B1 (de)
JP (1) JP5399603B2 (de)
KR (1) KR100941561B1 (de)
CN (1) CN101278010B (de)
DE (1) DE602006013014D1 (de)
TW (1) TW200734400A (de)
WO (1) WO2007043536A2 (de)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5265854B2 (ja) * 2005-12-08 2013-08-14 昭和電工株式会社 熱硬化性樹脂組成物、熱可塑性樹脂溶液および皮膜形成材料ならびにこれらの硬化物
CN101432368A (zh) * 2006-04-28 2009-05-13 昭和电工株式会社 热固化性树脂组合物及其用途
JP4998725B2 (ja) * 2007-07-06 2012-08-15 宇部興産株式会社 テープキャリアパッケージ用柔軟性配線板
WO2009011304A1 (ja) * 2007-07-18 2009-01-22 Showa Denko K. K. 熱硬化性樹脂組成物
CN101945952B (zh) * 2008-03-21 2013-03-27 昭和电工株式会社 树脂组合物和其固化膜
JP2009275146A (ja) * 2008-05-15 2009-11-26 Nitto Denko Corp 半導体封止用エポキシ樹脂組成物およびそれを用いた半導体装置
US8791173B2 (en) * 2008-06-13 2014-07-29 Dic Corporation Ink composition for forming insulating film and insulating film formed from the ink composition
CN102257081B (zh) * 2008-12-19 2014-08-20 昭和电工株式会社 热固性墨组合物
JP5796961B2 (ja) 2008-12-26 2015-10-21 昭和電工株式会社 硬化性組成物
KR101114318B1 (ko) * 2009-04-16 2012-03-14 삼성전기주식회사 박리 강도가 강화된 인쇄회로기판용 난연성 수지 조성물, 이를 이용한 인쇄회로기판 및 그 제조 방법
JP5464949B2 (ja) * 2009-09-15 2014-04-09 パナソニック株式会社 保護膜の形成方法および実装構造体、ならびに実装構造体のリペア方法
JP5507212B2 (ja) * 2009-11-13 2014-05-28 東レ・ダウコーニング株式会社 シリコーンパウダーを含有するオイル組成物の製造方法
JP5757777B2 (ja) * 2011-04-15 2015-07-29 パナソニック株式会社 基板塗布方法及び基板塗布装置並びに同方法を用いた有機エレクトロルミネッセント素子の製造方法
JP2013023661A (ja) * 2011-07-25 2013-02-04 Nitto Denko Corp 半導体封止用エポキシ樹脂組成物およびそれを用いた半導体装置
US9663664B2 (en) 2013-02-27 2017-05-30 Asahi Rubber Inc. Ink for white reflective film, powder coating material for white reflective film, production method of white reflective film, white reflective film, light source mount, and lighting device shade
JPWO2017081909A1 (ja) 2015-11-09 2018-08-30 昭和電工株式会社 硬化性組成物およびその用途
CN113692417A (zh) * 2019-02-15 2021-11-23 艾利丹尼森公司 聚氨酯合成
JP7184002B2 (ja) * 2019-09-13 2022-12-06 味の素株式会社 樹脂組成物
CN117126565B (zh) * 2023-09-01 2024-02-20 鹤山市炎墨科技有限公司 一种基于dcpd酚醛环氧树脂的防焊油墨及其制备方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3052146B2 (ja) * 1990-02-09 2000-06-12 住友化学工業株式会社 熱硬化性樹脂組成物
JPH05202153A (ja) * 1992-01-28 1993-08-10 Shin Etsu Polymer Co Ltd 紫外線硬化性樹脂組成物
US20030152779A1 (en) * 2000-07-21 2003-08-14 Toshio Kondo Functional urethane resin film and laminated film by use of the same
JP3954330B2 (ja) * 2001-06-18 2007-08-08 信越化学工業株式会社 液状樹脂組成物及びこれを硬化してなる半導体装置保護用材料
JP2003212954A (ja) * 2002-01-21 2003-07-30 Showa Denko Kk リン含有ウレタン（メタ）アクリレート化合物および感光性組成物
JP2005238497A (ja) * 2004-02-24 2005-09-08 Matsushita Electric Works Ltd 銅張積層板とその製造方法
JP2005264037A (ja) * 2004-03-19 2005-09-29 Kyocera Chemical Corp 封止用エポキシ樹脂組成物と樹脂封止型半導体装置
TW200613903A (en) * 2004-05-26 2006-05-01 Showa Denko Kk Photosensitive resin composition, and cured product and use thereof
TWI388584B (zh) * 2005-03-04 2013-03-11 Showa Denko Kk The film is formed with a paste
WO2007105781A1 (en) * 2006-03-09 2007-09-20 Showa Denko K.K. Thermosetting resin composition and uses thereof

Also Published As

Publication number Publication date
CN101278010A (zh) 2008-10-01
WO2007043536A3 (en) 2007-09-13
JP5399603B2 (ja) 2014-01-29
TW200734400A (en) 2007-09-16
WO2007043536A9 (en) 2007-06-07
KR20080065638A (ko) 2008-07-14
US20090133905A1 (en) 2009-05-28
CN101278010B (zh) 2011-02-02
EP1937776B1 (de) 2010-03-17
JP2007100038A (ja) 2007-04-19
EP1937776A2 (de) 2008-07-02
WO2007043536A2 (en) 2007-04-19
KR100941561B1 (ko) 2010-02-10

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