DE602007012034D1 - Bei Raumtemperatur härtbare wärmeleitende Silikon-Gummi-Zusammensetzung - Google Patents

Bei Raumtemperatur härtbare wärmeleitende Silikon-Gummi-Zusammensetzung

Info

Publication number
DE602007012034D1
DE602007012034D1 DE200760012034 DE602007012034T DE602007012034D1 DE 602007012034 D1 DE602007012034 D1 DE 602007012034D1 DE 200760012034 DE200760012034 DE 200760012034 DE 602007012034 T DE602007012034 T DE 602007012034T DE 602007012034 D1 DE602007012034 D1 DE 602007012034D1
Authority
DE
Germany
Prior art keywords
room temperature
rubber composition
silicone rubber
temperature curable
thermoconductive silicone
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE200760012034
Other languages
English (en)
Inventor
Jun Horikoshi
Tsuneo Kimura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Chemical Co Ltd
Original Assignee
Shin Etsu Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Chemical Co Ltd filed Critical Shin Etsu Chemical Co Ltd
Publication of DE602007012034D1 publication Critical patent/DE602007012034D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C08G77/16—Polysiloxanes containing silicon bound to oxygen-containing groups to hydroxyl groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C08G77/18—Polysiloxanes containing silicon bound to oxygen-containing groups to alkoxy or aryloxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31652—Of asbestos
    • Y10T428/31663—As siloxane, silicone or silane
DE200760012034 2006-10-18 2007-10-17 Bei Raumtemperatur härtbare wärmeleitende Silikon-Gummi-Zusammensetzung Active DE602007012034D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006283764A JP4787128B2 (ja) 2006-10-18 2006-10-18 室温硬化型熱伝導性シリコーンゴム組成物

Publications (1)

Publication Number Publication Date
DE602007012034D1 true DE602007012034D1 (de) 2011-03-03

Family

ID=38992661

Family Applications (1)

Application Number Title Priority Date Filing Date
DE200760012034 Active DE602007012034D1 (de) 2006-10-18 2007-10-17 Bei Raumtemperatur härtbare wärmeleitende Silikon-Gummi-Zusammensetzung

Country Status (4)

Country Link
US (1) US7601773B2 (de)
EP (1) EP1914271B1 (de)
JP (1) JP4787128B2 (de)
DE (1) DE602007012034D1 (de)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2444255A (en) 2006-11-30 2008-06-04 Formerol Ltd Mouldable one-part RTV silicone elastomer
JP4623322B2 (ja) * 2007-12-26 2011-02-02 信越化学工業株式会社 光半導体ケース形成用白色熱硬化性シリコーン樹脂組成物並びに光半導体ケース及びその成形方法
JP2010021533A (ja) * 2008-06-09 2010-01-28 Shin-Etsu Chemical Co Ltd 光半導体ケース形成用白色熱硬化性シリコーン樹脂組成物及び光半導体ケース
JP2010018786A (ja) * 2008-06-09 2010-01-28 Shin-Etsu Chemical Co Ltd 光半導体ケース形成用白色熱硬化性シリコーン樹脂組成物及び光半導体ケース
DE102010042712A1 (de) * 2010-10-20 2012-04-26 Wacker Chemie Ag Selbsthaftende Härterzusammensetzung
JP2013222836A (ja) * 2012-04-17 2013-10-28 Shin Etsu Chem Co Ltd 放熱性及びリワーク性に優れる電子装置及びその製造方法
CN104471012B (zh) 2012-07-30 2017-03-29 道康宁公司 导热缩合反应可固化聚有机硅氧烷组合物及该组合物的制备和使用方法
JP6468660B2 (ja) 2014-04-09 2019-02-13 東レ・ダウコーニング株式会社 熱伝導性シリコーン組成物および電気・電子機器
JP6439601B2 (ja) * 2015-06-12 2018-12-19 信越化学工業株式会社 難燃性室温硬化型オルガノポリシロキサン組成物及びその製造方法並びに電気電子部品
JP6465037B2 (ja) 2016-01-07 2019-02-06 信越化学工業株式会社 縮合硬化反応と有機過酸化物硬化反応を併用したシリコーン組成物
JP6965870B2 (ja) * 2018-12-25 2021-11-10 信越化学工業株式会社 熱伝導性シリコーン組成物及び半導体装置
JP6965869B2 (ja) * 2018-12-25 2021-11-10 信越化学工業株式会社 熱伝導性シリコーン組成物及び半導体装置
CN111909519A (zh) * 2020-07-27 2020-11-10 深圳市新亚新材料有限公司 一种柔性导热硅橡胶及其制备方法和应用
KR102630098B1 (ko) * 2020-11-11 2024-01-29 주식회사 제이앤씨머트리얼즈 고온에서 안정한 실리콘계 열매개물질 조성물 및 그 제조방법
JP7467017B2 (ja) * 2021-05-25 2024-04-15 信越化学工業株式会社 熱伝導性シリコーン組成物及びその硬化物
CN114921098B (zh) * 2022-05-24 2023-09-26 华南理工大学 一种导热室温硫化硅橡胶及其制备方法和应用

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4732400U (de) 1971-04-21 1972-12-12
JPS591241B2 (ja) * 1978-06-30 1984-01-11 而至歯科工業株式会社 歯科用シリコ−ン組成物およびその使用法
DE3069326D1 (en) 1980-01-04 1984-10-31 Ford Motor Co Polysiloxane elastomer composition and dispensable precursor therefor
JP2623678B2 (ja) * 1988-04-25 1997-06-25 松下電器産業株式会社 導電性物質
JPH0218453A (ja) * 1988-07-06 1990-01-22 Toshiba Silicone Co Ltd 型取材料およびそれを用いた成形型の製造方法
DE4108032A1 (de) * 1991-03-13 1992-09-17 Bayer Ag Palladiumhaltige polymerzusammensetzung sowie verfahren zu ihrer herstellung
KR100245971B1 (ko) * 1995-11-30 2000-03-02 포만 제프리 엘 중합접착제를 금속에 접착시키기 위한 접착력 촉진층을 이용하는 히트싱크어셈블리 및 그 제조방법
US6884314B2 (en) * 1997-02-07 2005-04-26 Henkel Corporation Conducive, silicone-based compositions with improved initial adhesion reduced microvoiding
JP4015722B2 (ja) * 1997-06-20 2007-11-28 東レ・ダウコーニング株式会社 熱伝導性ポリマー組成物
US6534581B1 (en) * 2000-07-20 2003-03-18 Dow Corning Corporation Silicone composition and electrically conductive silicone adhesive formed therefrom
JP2004352947A (ja) * 2003-05-30 2004-12-16 Shin Etsu Chem Co Ltd 室温硬化型熱伝導性シリコーンゴム組成物

Also Published As

Publication number Publication date
US20080096030A1 (en) 2008-04-24
US7601773B2 (en) 2009-10-13
JP4787128B2 (ja) 2011-10-05
JP2008101081A (ja) 2008-05-01
EP1914271B1 (de) 2011-01-19
EP1914271A3 (de) 2009-05-27
EP1914271A2 (de) 2008-04-23

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