TW200734400A - Heat-curable resin composition including silicone powder - Google Patents

Heat-curable resin composition including silicone powder

Info

Publication number
TW200734400A
TW200734400A TW095137178A TW95137178A TW200734400A TW 200734400 A TW200734400 A TW 200734400A TW 095137178 A TW095137178 A TW 095137178A TW 95137178 A TW95137178 A TW 95137178A TW 200734400 A TW200734400 A TW 200734400A
Authority
TW
Taiwan
Prior art keywords
heat
curable resin
resin composition
silicone powder
composition including
Prior art date
Application number
TW095137178A
Other languages
English (en)
Inventor
Kazuya Kimura
Hiroshi Uchida
Original Assignee
Showa Denko Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Showa Denko Kk filed Critical Showa Denko Kk
Publication of TW200734400A publication Critical patent/TW200734400A/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C08K7/04—Fibres or whiskers inorganic
    • C08K7/10—Silicon-containing compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/08—Processes
    • C08G18/0804—Manufacture of polymers containing ionic or ionogenic groups
    • C08G18/0819—Manufacture of polymers containing ionic or ionogenic groups containing anionic or anionogenic groups
    • C08G18/0823—Manufacture of polymers containing ionic or ionogenic groups containing anionic or anionogenic groups containing carboxylate salt groups or groups forming them
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/08—Processes
    • C08G18/0838—Manufacture of polymers in the presence of non-reactive compounds
    • C08G18/0842—Manufacture of polymers in the presence of non-reactive compounds in the presence of liquid diluents
    • C08G18/0847—Manufacture of polymers in the presence of non-reactive compounds in the presence of liquid diluents in the presence of solvents for the polymers
    • C08G18/0852—Manufacture of polymers in the presence of non-reactive compounds in the presence of liquid diluents in the presence of solvents for the polymers the solvents being organic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/08—Processes
    • C08G18/10—Prepolymer processes involving reaction of isocyanates or isothiocyanates with compounds having active hydrogen in a first reaction step
    • C08G18/12—Prepolymer processes involving reaction of isocyanates or isothiocyanates with compounds having active hydrogen in a first reaction step using two or more compounds having active hydrogen in the first polymerisation step
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/30—Low-molecular-weight compounds
    • C08G18/34—Carboxylic acids; Esters thereof with monohydroxyl compounds
    • C08G18/348—Hydroxycarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/40—High-molecular-weight compounds
    • C08G18/42—Polycondensates having carboxylic or carbonic ester groups in the main chain
    • C08G18/44—Polycarbonates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/65—Low-molecular-weight compounds having active hydrogen with high-molecular-weight compounds having active hydrogen
    • C08G18/66—Compounds of groups C08G18/42, C08G18/48, or C08G18/52
    • C08G18/6633—Compounds of group C08G18/42
    • C08G18/6659—Compounds of group C08G18/42 with compounds of group C08G18/34
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
    • C08G18/72—Polyisocyanates or polyisothiocyanates
    • C08G18/74—Polyisocyanates or polyisothiocyanates cyclic
    • C08G18/75—Polyisocyanates or polyisothiocyanates cyclic cycloaliphatic
    • C08G18/758—Polyisocyanates or polyisothiocyanates cyclic cycloaliphatic containing two or more cycloaliphatic rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/16—Solid spheres
    • C08K7/18—Solid spheres inorganic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L75/00—Compositions of polyureas or polyurethanes; Compositions of derivatives of such polymers
    • C08L75/04—Polyurethanes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0162—Silicon containing polymer, e.g. silicone
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0212—Resin particles

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Polyurethanes Or Polyureas (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
TW095137178A 2005-10-07 2006-10-05 Heat-curable resin composition including silicone powder TW200734400A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005295276A JP5399603B2 (ja) 2005-10-07 2005-10-07 シリコーンパウダーを含む熱硬化性樹脂組成物

Publications (1)

Publication Number Publication Date
TW200734400A true TW200734400A (en) 2007-09-16

Family

ID=37745832

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095137178A TW200734400A (en) 2005-10-07 2006-10-05 Heat-curable resin composition including silicone powder

Country Status (8)

Country Link
US (1) US20090133905A1 (zh)
EP (1) EP1937776B1 (zh)
JP (1) JP5399603B2 (zh)
KR (1) KR100941561B1 (zh)
CN (1) CN101278010B (zh)
DE (1) DE602006013014D1 (zh)
TW (1) TW200734400A (zh)
WO (1) WO2007043536A2 (zh)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5265854B2 (ja) * 2005-12-08 2013-08-14 昭和電工株式会社 熱硬化性樹脂組成物、熱可塑性樹脂溶液および皮膜形成材料ならびにこれらの硬化物
JPWO2007125806A1 (ja) * 2006-04-28 2009-09-10 昭和電工株式会社 熱硬化性樹脂組成物およびその用途
JP4998725B2 (ja) * 2007-07-06 2012-08-15 宇部興産株式会社 テープキャリアパッケージ用柔軟性配線板
CN102924998A (zh) * 2007-07-18 2013-02-13 昭和电工株式会社 热固性树脂组合物
JP5473896B2 (ja) * 2008-03-21 2014-04-16 昭和電工株式会社 樹脂組成物及びその硬化膜
JP2009275146A (ja) * 2008-05-15 2009-11-26 Nitto Denko Corp 半導体封止用エポキシ樹脂組成物およびそれを用いた半導体装置
CN102057000B (zh) * 2008-06-13 2014-05-07 Dic株式会社 绝缘膜形成用油墨组合物、由该油墨组合物形成的绝缘膜
KR101271803B1 (ko) * 2008-12-19 2013-06-07 쇼와 덴코 가부시키가이샤 열경화성 잉크 조성물
KR101254444B1 (ko) 2008-12-26 2013-04-12 쇼와 덴코 가부시키가이샤 경화성 조성물
KR101114318B1 (ko) * 2009-04-16 2012-03-14 삼성전기주식회사 박리 강도가 강화된 인쇄회로기판용 난연성 수지 조성물, 이를 이용한 인쇄회로기판 및 그 제조 방법
JP5464949B2 (ja) * 2009-09-15 2014-04-09 パナソニック株式会社 保護膜の形成方法および実装構造体、ならびに実装構造体のリペア方法
JP5507212B2 (ja) * 2009-11-13 2014-05-28 東レ・ダウコーニング株式会社 シリコーンパウダーを含有するオイル組成物の製造方法
JP5757777B2 (ja) * 2011-04-15 2015-07-29 パナソニック株式会社 基板塗布方法及び基板塗布装置並びに同方法を用いた有機エレクトロルミネッセント素子の製造方法
JP2013023661A (ja) * 2011-07-25 2013-02-04 Nitto Denko Corp 半導体封止用エポキシ樹脂組成物およびそれを用いた半導体装置
JP5996085B2 (ja) * 2013-02-27 2016-09-21 株式会社朝日ラバー 白色反射膜用インク、白色反射膜用粉体塗料及び白色反射膜の製造方法
JPWO2017081909A1 (ja) 2015-11-09 2018-08-30 昭和電工株式会社 硬化性組成物およびその用途
US20220185973A1 (en) * 2019-02-15 2022-06-16 Avery Dennison Corporation Polyurethane synthesis
JP7184002B2 (ja) * 2019-09-13 2022-12-06 味の素株式会社 樹脂組成物
CN117126565B (zh) * 2023-09-01 2024-02-20 鹤山市炎墨科技有限公司 一种基于dcpd酚醛环氧树脂的防焊油墨及其制备方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3052146B2 (ja) * 1990-02-09 2000-06-12 住友化学工業株式会社 熱硬化性樹脂組成物
JPH05202153A (ja) * 1992-01-28 1993-08-10 Shin Etsu Polymer Co Ltd 紫外線硬化性樹脂組成物
US20030152779A1 (en) * 2000-07-21 2003-08-14 Toshio Kondo Functional urethane resin film and laminated film by use of the same
JP3954330B2 (ja) * 2001-06-18 2007-08-08 信越化学工業株式会社 液状樹脂組成物及びこれを硬化してなる半導体装置保護用材料
JP2003212954A (ja) * 2002-01-21 2003-07-30 Showa Denko Kk リン含有ウレタン（メタ）アクリレート化合物および感光性組成物
JP2005238497A (ja) * 2004-02-24 2005-09-08 Matsushita Electric Works Ltd 銅張積層板とその製造方法
JP2005264037A (ja) * 2004-03-19 2005-09-29 Kyocera Chemical Corp 封止用エポキシ樹脂組成物と樹脂封止型半導体装置
TW200613903A (en) * 2004-05-26 2006-05-01 Showa Denko Kk Photosensitive resin composition, and cured product and use thereof
TWI388584B (zh) * 2005-03-04 2013-03-11 Showa Denko Kk The film is formed with a paste
CN101395223A (zh) * 2006-03-09 2009-03-25 昭和电工株式会社 热固性树脂组合物及其用途

Also Published As

Publication number Publication date
JP5399603B2 (ja) 2014-01-29
JP2007100038A (ja) 2007-04-19
EP1937776B1 (en) 2010-03-17
CN101278010A (zh) 2008-10-01
WO2007043536A9 (en) 2007-06-07
CN101278010B (zh) 2011-02-02
KR100941561B1 (ko) 2010-02-10
US20090133905A1 (en) 2009-05-28
WO2007043536A2 (en) 2007-04-19
DE602006013014D1 (de) 2010-04-29
KR20080065638A (ko) 2008-07-14
WO2007043536A3 (en) 2007-09-13
EP1937776A2 (en) 2008-07-02

Similar Documents

Publication Publication Date Title
TW200734400A (en) Heat-curable resin composition including silicone powder
TW200740466A (en) Transparent solid cosmetic powder
TW200635972A (en) Carboxyl group-containing polyurethane and thermosetting resin composition using the same
WO2008101661A8 (en) Radiation curable aqueous composition for low gloss coatings
TW200628062A (en) Electromagnetic interference suppressor, antenna device, and electron information transfer device
TW200732399A (en) Carbon nanotube-containing composition, complex, and production method thereof
TW200722497A (en) Anisotropic conductive adhesive compositions
WO2009011383A1 (ja) 電子部品用接着剤
MXPA03007953A (es) Particulas polimericas que tienen grupos pendientes seleccionados y composicion preparada a partir de las mismas.
MX2008013804A (es) Composicion de revestimiento en polvo curable por calor.
MY140879A (en) Nanoparticle filled underfill
EP1723180A4 (en) ENVIRONMENTALLY FRIENDLY COATING COMPOSITIONS FOR COATING METAL OBJECTS, COATED OBJECTS THEREOF AND METHODS, METHODS AND ARRANGEMENTS FOR COATING THEREWITH
MX2012011531A (es) Composiciones de recubrimiento poliasparticas de dos componentes.
MXPA03009697A (es) Polvos de recubrimiento mejorados de polimeros de fluorocarbono.
MY145053A (en) Epoxy resins comprising a cycloaliphatic diamine curing agent
AU2003205738A1 (en) Water-dispersible coenzyme q10 dry powders
MX2011013773A (es) Composicion termoplastica con novolaca epoxidada.
WO2009041052A1 (ja) 合成樹脂製スラスト滑り軸受
EP1914255A3 (en) Aliphatic polyisocyanate prepolymers and polyurethane resin coating compositions using the same
TW200724570A (en) Thermosetting resin composition and uses thereof
SG179014A1 (en) Modular polymeric emi/rfi seal
TW200726782A (en) Carboxyl group-containing polyurethane and heat-curable polyurethane resin composition
WO2009051243A1 (ja) 光輝性顔料
TW200635703A (en) Water-based polishing pads and methods of manufacture
AU2005262289A8 (en) Powder coating composition