DE602006006942D1 - Leitfähige Paste für mehrlagigen elektronischen Komponenten und mehrlagigen elektronischen Komponenten damit - Google Patents

Leitfähige Paste für mehrlagigen elektronischen Komponenten und mehrlagigen elektronischen Komponenten damit

Info

Publication number
DE602006006942D1
DE602006006942D1 DE602006006942T DE602006006942T DE602006006942D1 DE 602006006942 D1 DE602006006942 D1 DE 602006006942D1 DE 602006006942 T DE602006006942 T DE 602006006942T DE 602006006942 T DE602006006942 T DE 602006006942T DE 602006006942 D1 DE602006006942 D1 DE 602006006942D1
Authority
DE
Germany
Prior art keywords
multilayer electronic
electronic components
conductive paste
internal electrode
organic solvent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602006006942T
Other languages
English (en)
Inventor
Toshio Yoneima
Kaori Higashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shoei Chemical Inc
Original Assignee
Shoei Chemical Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shoei Chemical Inc filed Critical Shoei Chemical Inc
Publication of DE602006006942D1 publication Critical patent/DE602006006942D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/12—Ceramic dielectrics
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
    • H01L23/49883—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials the conductive materials containing organic materials or pastes, e.g. for thick films
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0783—Using solvent, e.g. for cleaning; Regulating solvent content of pastes or coatings for adjusting the viscosity
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24926—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including ceramic, glass, porcelain or quartz layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Ceramic Capacitors (AREA)
  • Conductive Materials (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
DE602006006942T 2005-07-01 2006-06-28 Leitfähige Paste für mehrlagigen elektronischen Komponenten und mehrlagigen elektronischen Komponenten damit Active DE602006006942D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005194098 2005-07-01
JP2006149388A JP4650794B2 (ja) 2005-07-01 2006-05-30 積層電子部品用導体ペーストおよびそれを用いた積層電子部品

Publications (1)

Publication Number Publication Date
DE602006006942D1 true DE602006006942D1 (de) 2009-07-09

Family

ID=37056906

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602006006942T Active DE602006006942D1 (de) 2005-07-01 2006-06-28 Leitfähige Paste für mehrlagigen elektronischen Komponenten und mehrlagigen elektronischen Komponenten damit

Country Status (9)

Country Link
US (1) US7423220B2 (de)
EP (1) EP1739689B1 (de)
JP (1) JP4650794B2 (de)
KR (1) KR100819303B1 (de)
CN (1) CN1892926B (de)
AT (1) ATE432527T1 (de)
DE (1) DE602006006942D1 (de)
MY (1) MY137841A (de)
TW (1) TWI336480B (de)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4442596B2 (ja) * 2006-09-08 2010-03-31 Ｔｄｋ株式会社 導電性ペースト、積層セラミック電子部品及びその製造方法
JP4622974B2 (ja) * 2006-09-19 2011-02-02 Ｔｄｋ株式会社 導電性ペースト、積層セラミック電子部品及びその製造方法
KR100711505B1 (ko) * 2007-01-30 2007-04-27 (주)이그잭스 도전막 형성을 위한 은 페이스트
US8505804B2 (en) 2007-03-22 2013-08-13 Tanaka Kikinzoku Kogyo K.K. Metal paste for sealing, hermetic sealing method for piezoelectric element, and piezoelectric device
US7999175B2 (en) * 2008-09-09 2011-08-16 Palo Alto Research Center Incorporated Interdigitated back contact silicon solar cells with laser ablated grooves
US9150966B2 (en) * 2008-11-14 2015-10-06 Palo Alto Research Center Incorporated Solar cell metallization using inline electroless plating
JP5567842B2 (ja) * 2010-01-20 2014-08-06 積水化学工業株式会社 積層セラミック電子部品用ペースト
US8962424B2 (en) 2011-03-03 2015-02-24 Palo Alto Research Center Incorporated N-type silicon solar cell with contact/protection structures
KR101141361B1 (ko) * 2011-03-14 2012-05-03 삼성전기주식회사 적층형 세라믹 콘덴서 및 그 제조방법
CN103477727B (zh) * 2011-03-28 2016-08-31 株式会社村田制作所 玻璃陶瓷基板及其制造方法
WO2013111438A1 (ja) * 2012-01-27 2013-08-01 昭栄化学工業株式会社 固体電解コンデンサ素子、その製造方法及び導電ペースト
KR102248526B1 (ko) * 2013-07-23 2021-05-06 삼성전기주식회사 내부 전극용 니켈 분말, 이를 포함하는 적층 세라믹 커패시터 및 전자부품이 실장된 회로기판
KR102004792B1 (ko) 2014-06-24 2019-07-29 삼성전기주식회사 적층 전자부품 및 내부전극용 도전성 페이스트 조성물
KR102613114B1 (ko) * 2017-11-30 2023-12-12 스미토모 긴조쿠 고잔 가부시키가이샤 도전성 페이스트, 전자 부품, 및 적층 세라믹 콘덴서

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Publication number Priority date Publication date Assignee Title
JPS57184296A (en) * 1981-05-09 1982-11-12 Hitachi Ltd Ceramic circuit board
JPS599992A (ja) * 1982-07-08 1984-01-19 株式会社日立製作所 多層配線基板の製造方法
JPS5911700A (ja) * 1982-07-12 1984-01-21 株式会社日立製作所 セラミツク多層配線回路板
JPS60235744A (ja) * 1984-05-04 1985-11-22 Asahi Glass Co Ltd セラミック基板用組成物
US4765929A (en) * 1986-08-29 1988-08-23 Gte Products Corporation Silk-screenable circuit paste
US4985376A (en) * 1989-01-31 1991-01-15 Asahi Glass Company, Ltd. Conductive paste compositions and ceramic substrates
SU1689996A1 (ru) 1989-12-19 1991-11-07 Донецкий государственный университет Органическое св зующее проводниковых и диэлектрических паст
JPH05235497A (ja) * 1992-02-20 1993-09-10 Murata Mfg Co Ltd 銅導電性ペースト
JP2976268B2 (ja) * 1993-07-05 1999-11-10 株式会社村田製作所 導電性ペーストおよびそれを用いた多層セラミック電子部品の製造方法
JPH07240340A (ja) * 1994-02-28 1995-09-12 Sumitomo Metal Mining Co Ltd 積層セラミックコンデンサー内部電極用ペースト
JPH0917687A (ja) * 1995-06-28 1997-01-17 Sumitomo Metal Mining Co Ltd 積層セラミックコンデンサ内部電極用ペーストおよびその製造方法
JP3571957B2 (ja) * 1999-03-30 2004-09-29 松下電器産業株式会社 導体ペーストおよびセラミック多層基板の製造方法
JP3780945B2 (ja) * 2001-03-14 2006-05-31 株式会社村田製作所 セラミック電子部品
ES2792449T3 (es) * 2001-12-20 2020-11-11 Animas Tech Llc Tinta de impresión de pantalla altamente catalítica
US20050013989A1 (en) 2002-05-28 2005-01-20 Yoshiyuki Hirose Aluminum nitride sintered compact having metallized layer and method for preparation thereof
US6841493B2 (en) * 2002-06-04 2005-01-11 E. I. Du Pont De Nemours And Company High K glass and tape composition for use at high frequency
JP4449484B2 (ja) * 2003-02-18 2010-04-14 東レ株式会社 導電性ペーストおよびそれを用いたプラズマディスプレイパネル用部材の製造方法
JP2005035850A (ja) * 2003-07-17 2005-02-10 Asahi Glass Co Ltd 隔壁用ペースト、隔壁付き基板の製造方法、およびプラズマディスプレイパネル
US7189341B2 (en) * 2003-08-15 2007-03-13 Animas Technologies, Llc Electrochemical sensor ink compositions, electrodes, and uses thereof

Also Published As

Publication number Publication date
ATE432527T1 (de) 2009-06-15
CN1892926B (zh) 2010-07-14
EP1739689A1 (de) 2007-01-03
MY137841A (en) 2009-03-31
KR100819303B1 (ko) 2008-04-02
JP2007043092A (ja) 2007-02-15
TW200710877A (en) 2007-03-16
CN1892926A (zh) 2007-01-10
EP1739689B1 (de) 2009-05-27
US7423220B2 (en) 2008-09-09
TWI336480B (en) 2011-01-21
US20070001152A1 (en) 2007-01-04
JP4650794B2 (ja) 2011-03-16
KR20070003614A (ko) 2007-01-05

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