SE0301134D0 - Keramiskt flerskiktssubstrat och förfarande för tillverkning av detsamma - Google Patents

Keramiskt flerskiktssubstrat och förfarande för tillverkning av detsamma

Info

Publication number
SE0301134D0
SE0301134D0 SE0301134A SE0301134A SE0301134D0 SE 0301134 D0 SE0301134 D0 SE 0301134D0 SE 0301134 A SE0301134 A SE 0301134A SE 0301134 A SE0301134 A SE 0301134A SE 0301134 D0 SE0301134 D0 SE 0301134D0
Authority
SE
Sweden
Prior art keywords
external terminal
multilayer substrate
ceramic
ceramic multilayer
connection bar
Prior art date
Application number
SE0301134A
Other languages
English (en)
Other versions
SE524255C2 (sv
SE0301134L (sv
Inventor
Ik Seo Choi
Seok Jun Taek
Young Keun Lee
Original Assignee
Samsung Electro Mech
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electro Mech filed Critical Samsung Electro Mech
Publication of SE0301134D0 publication Critical patent/SE0301134D0/sv
Publication of SE0301134L publication Critical patent/SE0301134L/sv
Publication of SE524255C2 publication Critical patent/SE524255C2/sv

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49805—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers the leads being also applied on the sidewalls or the bottom of the substrate, e.g. leadless packages for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49822—Multilayer substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H05K2201/09181—Notches in edge pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H05K2201/0919—Exposing inner circuit layers or metal planes at the side edge of the PCB or at the walls of large holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09454—Inner lands, i.e. lands around via or plated through-hole in internal layer of multilayer PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H05K3/4061—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in inorganic insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structure Of Printed Boards (AREA)
  • Ceramic Capacitors (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
SE0301134A 2002-11-19 2003-04-16 Keramiskt flerskiktssubstrat och förfarande för tillverkning av detsamma SE524255C2 (sv)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR10-2002-0072026A KR100489820B1 (ko) 2002-11-19 2002-11-19 세라믹 다층기판 및 그 제조방법

Publications (3)

Publication Number Publication Date
SE0301134D0 true SE0301134D0 (sv) 2003-04-16
SE0301134L SE0301134L (sv) 2004-05-20
SE524255C2 SE524255C2 (sv) 2004-07-20

Family

ID=19720688

Family Applications (1)

Application Number Title Priority Date Filing Date
SE0301134A SE524255C2 (sv) 2002-11-19 2003-04-16 Keramiskt flerskiktssubstrat och förfarande för tillverkning av detsamma

Country Status (9)

Country Link
US (2) US6965161B2 (sv)
JP (1) JP2004172561A (sv)
KR (1) KR100489820B1 (sv)
CN (1) CN1324698C (sv)
DE (1) DE10317675B4 (sv)
FI (1) FI20030580A (sv)
FR (1) FR2847385B1 (sv)
GB (1) GB2395604B (sv)
SE (1) SE524255C2 (sv)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109119400A (zh) * 2018-09-25 2019-01-01 中国电子科技集团公司第四十三研究所 高载流能力多层陶瓷基板及其制作方法

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7777321B2 (en) * 2002-04-22 2010-08-17 Gann Keith D Stacked microelectronic layer and module with three-axis channel T-connects
KR100495211B1 (ko) * 2002-11-25 2005-06-14 삼성전기주식회사 세라믹 다층기판 및 그 제조방법
KR100771862B1 (ko) * 2005-08-12 2007-11-01 삼성전자주식회사 메모리 모듈을 위한 인쇄회로기판, 그 제조 방법 및 메모리모듈-소켓 어셈블리
US20080047653A1 (en) * 2006-08-28 2008-02-28 Kan Shih-Wei Method for manufacturing multi-layer ceramic substrate
KR100875234B1 (ko) 2007-08-08 2008-12-19 삼성전기주식회사 세라믹 기판 및 그 제조방법, 그리고 카메라 모듈
US20090126857A1 (en) * 2007-11-15 2009-05-21 Shin Hyun-Ok Manufacturing method of low temperature co-fired ceramics substrate
US7843303B2 (en) * 2008-12-08 2010-11-30 Alpha And Omega Semiconductor Incorporated Multilayer inductor
US8747591B1 (en) * 2009-09-22 2014-06-10 Sandia Corporation Full tape thickness feature conductors for EMI structures
WO2012025888A2 (en) * 2010-08-24 2012-03-01 Colorchip (Israel) Ltd. Light source mount
JP5567445B2 (ja) * 2010-10-08 2014-08-06 スタンレー電気株式会社 セラミック多層配線基板の製造方法
KR20150004118A (ko) * 2013-07-02 2015-01-12 삼성디스플레이 주식회사 표시 장치용 기판, 상기 표시 장치용 기판의 제조 방법, 및 상기 표시 장치용 기판을 포함하는 표시 장치
US9691694B2 (en) * 2015-02-18 2017-06-27 Qualcomm Incorporated Substrate comprising stacks of interconnects, interconnect on solder resist layer and interconnect on side portion of substrate
JP6195085B2 (ja) * 2015-08-24 2017-09-13 株式会社村田製作所 積層電子部品
CN105305041B (zh) * 2015-09-27 2019-11-12 华东交通大学 集成寄生单元与开槽dr结构的宽频带天线
JP6781258B2 (ja) * 2016-07-21 2020-11-04 日本碍子株式会社 センサ素子の製造方法
CN113624394A (zh) * 2020-05-08 2021-11-09 精量电子（深圳）有限公司 压力传感器
CN112038297B (zh) * 2020-08-14 2022-10-25 中国电子科技集团公司第十三研究所 氧化铝瓷件及其制作方法、陶瓷外壳的制作方法

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5615059U (sv) * 1979-07-11 1981-02-09
JPH02166792A (ja) * 1988-12-21 1990-06-27 Nippon Chemicon Corp 多層スルーホールおよびその形成方法
US5140745A (en) * 1990-07-23 1992-08-25 Mckenzie Jr Joseph A Method for forming traces on side edges of printed circuit boards and devices formed thereby
JP2600477B2 (ja) * 1990-10-31 1997-04-16 株式会社村田製作所 積層セラミック電子部品
JP2873645B2 (ja) * 1992-05-25 1999-03-24 国際電気 株式会社 セラミック多層配線基板の製造方法
US5635669A (en) * 1992-07-27 1997-06-03 Murata Manufacturing Co., Ltd. Multilayer electronic component
DE69315907T2 (de) * 1992-07-27 1998-04-16 Murata Manufacturing Co Elektronisches Vielschichtbauteil, Verfahren zur dessen Herstellung und Verfahren zur Messung seiner Charakteristiken
JP3070364B2 (ja) * 1992-11-25 2000-07-31 松下電器産業株式会社 セラミック電子部品の製造方法
KR0127666B1 (ko) * 1992-11-25 1997-12-30 모리시다 요이찌 세라믹전자부품 및 그 제조방법
US5736681A (en) * 1993-09-03 1998-04-07 Kabushiki Kaisha Toshiba Printed wiring board having an interconnection penetrating an insulating layer
US5383095A (en) * 1993-10-29 1995-01-17 The Whitaker Corporation Circuit board and edge-mountable connector therefor, and method of preparing a circuit board edge
JP3223708B2 (ja) 1994-07-21 2001-10-29 株式会社村田製作所 積層電子部品およびその製造方法
US5855995A (en) * 1997-02-21 1999-01-05 Medtronic, Inc. Ceramic substrate for implantable medical devices
JPH10275979A (ja) * 1997-03-28 1998-10-13 Kyocera Corp セラミック基板および分割回路基板
JPH10313157A (ja) * 1997-05-12 1998-11-24 Alps Electric Co Ltd プリント基板
US6249049B1 (en) * 1998-06-12 2001-06-19 Nec Corporation Ceramic package type electronic part which is high in connection strength to electrode
US6256880B1 (en) * 1998-09-17 2001-07-10 Intermedics, Inc. Method for preparing side attach pad traces through buried conductive material
JP3402226B2 (ja) * 1998-11-19 2003-05-06 株式会社村田製作所 チップサーミスタの製造方法
KR100320943B1 (ko) * 1999-06-15 2002-02-06 이형도 칩형 분배기
KR100315751B1 (ko) * 1999-12-31 2001-12-12 송재인 저온 소성 세라믹 다층기판
JP3531573B2 (ja) * 2000-03-17 2004-05-31 株式会社村田製作所 積層型セラミック電子部品およびその製造方法ならびに電子装置
JP4138211B2 (ja) * 2000-07-06 2008-08-27 株式会社村田製作所 電子部品およびその製造方法、集合電子部品、電子部品の実装構造、ならびに電子装置
JP2002141248A (ja) * 2000-11-02 2002-05-17 Murata Mfg Co Ltd セラミック電子部品およびその製造方法
US6462950B1 (en) * 2000-11-29 2002-10-08 Nokia Mobile Phones Ltd. Stacked power amplifier module
US6528875B1 (en) * 2001-04-20 2003-03-04 Amkor Technology, Inc. Vacuum sealed package for semiconductor chip
US6759940B2 (en) * 2002-01-10 2004-07-06 Lamina Ceramics, Inc. Temperature compensating device with integral sheet thermistors

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109119400A (zh) * 2018-09-25 2019-01-01 中国电子科技集团公司第四十三研究所 高载流能力多层陶瓷基板及其制作方法
CN109119400B (zh) * 2018-09-25 2024-04-09 中国电子科技集团公司第四十三研究所 高载流能力多层陶瓷基板及其制作方法

Also Published As

Publication number Publication date
FI20030580A (sv) 2004-05-20
CN1503354A (zh) 2004-06-09
GB0308563D0 (en) 2003-05-21
KR20040043736A (ko) 2004-05-27
GB2395604A (en) 2004-05-26
FR2847385A1 (fr) 2004-05-21
US20050098874A1 (en) 2005-05-12
DE10317675B4 (de) 2006-08-24
SE524255C2 (sv) 2004-07-20
CN1324698C (zh) 2007-07-04
JP2004172561A (ja) 2004-06-17
FI20030580A0 (sv) 2003-04-16
FR2847385B1 (fr) 2006-01-13
KR100489820B1 (ko) 2005-05-16
SE0301134L (sv) 2004-05-20
GB2395604B (en) 2005-11-16
US20040094834A1 (en) 2004-05-20
US6965161B2 (en) 2005-11-15
DE10317675A1 (de) 2004-06-17

Similar Documents

Publication Publication Date Title
SE0301134D0 (sv) Keramiskt flerskiktssubstrat och förfarande för tillverkning av detsamma
EP1881751A4 (en) CERAMIC MULTILAYER PLATE
TW200709740A (en) Multi-layer substrate having conductive pattern and resin film and method for manufacturing the same
ATE307382T1 (de) Keramischer vielschichtkondensatornetzwerk
US20130314194A1 (en) Laminated inductor element and manufacturing method thereof
ATE432527T1 (de) Leitfähige paste für mehrlagigen elektronischen komponenten und mehrlagigen elektronischen komponenten damit
SE0301133D0 (sv) Keramiskt flerskiktssubstrat och förfarande för tillverkning av detsamma
TW200713356A (en) Multilayer ceramic capacitor and method for manufacturing the same
JP2006237078A (ja) 積層電子部品及び積層セラミックコンデンサ
TW200642554A (en) Multilayer circuit board with embedded components and method of manufacture
WO2008129704A1 (ja) 多層プリント配線板及びその製造方法
TW200707484A (en) Laminated ceramic capacitor and manufacturing method therefor
TW200733160A (en) Capacitor to be incorporated in wiring substarate, method for manufacturing the capacitor, and wiring substrate
TW200741770A (en) Production method of multilayer ceramic electronic device
CN102404935B (zh) 多层导通孔叠层结构
TW200606968A (en) Method for manufacturing multilayer electronic component
TW200606967A (en) Method for manufacturing multilayer electronic component
US10181380B2 (en) Multilayer electronic component having first and second internal elctrode patterns alternately stacked, and method of manufacturing the same
JP2012191203A5 (sv)
TW200611620A (en) A manufacturing method of a multi-layer circuit board with embedded passive components
US20130316074A1 (en) Manufacturing method of a retaining wall of an LED
US20200113065A1 (en) Circuit board and method of making same
CN201839516U (zh) 单面双层式电路板及具有该单面双层式电路板的发光装置
JP2007096265A5 (sv)
CN201888020U (zh) 陶瓷印刷电路板结构

Legal Events

Date Code Title Description
NUG Patent has lapsed