DE602006003433D1 - Härtbare organopolysiloxanzusammensetzung - Google Patents

Härtbare organopolysiloxanzusammensetzung

Info

Publication number
DE602006003433D1
DE602006003433D1 DE602006003433T DE602006003433T DE602006003433D1 DE 602006003433 D1 DE602006003433 D1 DE 602006003433D1 DE 602006003433 T DE602006003433 T DE 602006003433T DE 602006003433 T DE602006003433 T DE 602006003433T DE 602006003433 D1 DE602006003433 D1 DE 602006003433D1
Authority
DE
Germany
Prior art keywords
organopolysiloxane
molecule
alkoxysilyl
silicon
bonded
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602006003433T
Other languages
German (de)
English (en)
Inventor
Yoshito Ushio
Osamu Mitani
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DuPont Toray Specialty Materials KK
Original Assignee
Dow Corning Toray Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Corning Toray Co Ltd filed Critical Dow Corning Toray Co Ltd
Publication of DE602006003433D1 publication Critical patent/DE602006003433D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04Polysiloxanes
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/54Silicon-containing compounds
    • C08K5/541Silicon-containing compounds containing oxygen
    • C08K5/5415Silicon-containing compounds containing oxygen containing at least one Si—O bond
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/14Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Adhesives Or Adhesive Processes (AREA)
DE602006003433T 2005-06-15 2006-06-09 Härtbare organopolysiloxanzusammensetzung Active DE602006003433D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005174430A JP5025917B2 (ja) 2005-06-15 2005-06-15 硬化性オルガノポリシロキサン組成物
PCT/JP2006/312088 WO2006135036A1 (en) 2005-06-15 2006-06-09 Curable organopolysiloxane composition

Publications (1)

Publication Number Publication Date
DE602006003433D1 true DE602006003433D1 (de) 2008-12-11

Family

ID=36954445

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602006003433T Active DE602006003433D1 (de) 2005-06-15 2006-06-09 Härtbare organopolysiloxanzusammensetzung

Country Status (8)

Country Link
US (1) US7781560B2 (https=)
EP (1) EP1891160B1 (https=)
JP (1) JP5025917B2 (https=)
KR (1) KR101244204B1 (https=)
CN (1) CN101198655B (https=)
AT (1) ATE412706T1 (https=)
DE (1) DE602006003433D1 (https=)
WO (1) WO2006135036A1 (https=)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4839041B2 (ja) 2005-08-29 2011-12-14 東レ・ダウコーニング株式会社 絶縁性液状ダイボンディング剤および半導体装置
JP4955984B2 (ja) 2005-11-04 2012-06-20 東レ・ダウコーニング株式会社 有機ケイ素重合体およびその製造方法
JP4965111B2 (ja) 2005-11-09 2012-07-04 東レ・ダウコーニング株式会社 硬化性シリコーン組成物
TW200720359A (en) 2005-11-17 2007-06-01 Dow Corning Toray Co Ltd Method of controlling oil-absorbing properties of a silicone rubber powder
JP5469874B2 (ja) * 2008-09-05 2014-04-16 東レ・ダウコーニング株式会社 硬化性オルガノポリシロキサン組成物、光半導体素子封止剤および光半導体装置
WO2013037105A1 (en) * 2011-09-13 2013-03-21 Dow Corning (China) Holding Co., Ltd. Filled silicone composition, preparation and uses thereof
CN103930490B (zh) * 2011-09-13 2016-05-18 道康宁(中国)投资有限公司 填充的有机硅组合物及其制备和用途
JP6052140B2 (ja) * 2013-11-08 2016-12-27 信越化学工業株式会社 ビスシリルアミノ基を有するオルガノキシシラン化合物及びその製造方法
JP2017500393A (ja) 2013-12-27 2017-01-05 東レ・ダウコーニング株式会社 室温硬化性シリコーンゴム組成物およびその用途
JP6574771B2 (ja) * 2013-12-27 2019-09-11 ダウ・東レ株式会社 室温硬化性シリコーンゴム組成物、その用途、および電子機器の補修方法
EP3130643A4 (en) * 2014-04-09 2017-12-13 Dow Corning Toray Co., Ltd. Curable organopolysiloxane composition, and protective-agent or adhesive-agent composition for electrical/electronic components
JP6468660B2 (ja) * 2014-04-09 2019-02-13 東レ・ダウコーニング株式会社 熱伝導性シリコーン組成物および電気・電子機器
WO2018043270A1 (ja) 2016-09-01 2018-03-08 東レ・ダウコーニング株式会社 硬化性オルガノポリシロキサン組成物および電気・電子部品の保護剤または接着剤組成物
WO2018111365A1 (en) 2016-12-15 2018-06-21 Dow Silicones Corporation Condensation-curable electrically conductive silicone adhesive composition
KR102537899B1 (ko) 2017-04-24 2023-05-31 헨켈 아게 운트 코. 카게아아 중부가 실리콘 제제를 위한 접착 촉진제
US20220119677A1 (en) * 2019-01-31 2022-04-21 Elkem Silicones Shanghai Co., Ltd. Curable silicone composition with a good flame resistance
KR20210148204A (ko) 2019-03-29 2021-12-07 다우 도레이 캄파니 리미티드 다성분형 열전도성 실리콘 겔 조성물, 열전도성 부재 및 방열 구조체
WO2020203597A1 (ja) 2019-04-01 2020-10-08 信越化学工業株式会社 自己接着性シリコーンゲル組成物及びその硬化物からなるシリコーンゲル
WO2021132349A1 (ja) 2019-12-26 2021-07-01 ダウ・東レ株式会社 硬化性オルガノポリシロキサン組成物及びその硬化物、保護剤又は接着剤、並びに電気・電子機器
CN114945634A (zh) 2019-12-26 2022-08-26 陶氏东丽株式会社 固化性聚有机硅氧烷组合物和其固化物、保护剂或粘接剂以及电气/电子设备
WO2021186994A1 (ja) * 2020-03-16 2021-09-23 セントラル硝子株式会社 組成物、組成物前駆体の溶液、組成物の製造方法、基板、及びパターン付き基板の製造方法
JP7774044B2 (ja) 2020-09-25 2025-11-20 ダウ シリコーンズ コーポレーション 硬化性シリコーン組成物及びその硬化物

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0684476B2 (ja) * 1986-07-23 1994-10-26 東レ・ダウコ−ニング・シリコ−ン株式会社 硬化性オルガノポリシロキサン組成物
JPH04222871A (ja) * 1990-12-25 1992-08-12 Toray Dow Corning Silicone Co Ltd 硬化性オルガノポリシロキサン組成物
JP3270489B2 (ja) 1991-01-30 2002-04-02 東レ・ダウコーニング・シリコーン株式会社 硬化性オルガノポリシロキサン組成物
JP3461404B2 (ja) * 1995-03-29 2003-10-27 東レ・ダウコーニング・シリコーン株式会社 硬化性オルガノポリシロキサン組成物
JP3828612B2 (ja) * 1996-05-24 2006-10-04 東レ・ダウコーニング株式会社 液状シリコーンゴム組成物およびその製造方法
JP4823431B2 (ja) * 2001-01-30 2011-11-24 東レ・ダウコーニング株式会社 室温硬化性シリコーンゴム組成物
DE10139132A1 (de) * 2001-08-09 2003-02-27 Consortium Elektrochem Ind Alkoxyvernetzende einkomponentige feuchtigkeitshärtende Massen
DE10351804A1 (de) * 2003-11-06 2005-06-09 Wacker-Chemie Gmbh Verfahren zur Erhöhung der Elastizität von feuchtigkeitsgehärteten Elastomeren
JP4647941B2 (ja) 2004-06-23 2011-03-09 東レ・ダウコーニング株式会社 シリコーンレジンとシリコーンゴムの一体化成形体、その製造方法および硬化性シリコーンレジン組成物
JP4676735B2 (ja) 2004-09-22 2011-04-27 東レ・ダウコーニング株式会社 光半導体装置の製造方法および光半導体装置
JP4664032B2 (ja) 2004-10-13 2011-04-06 東レ・ダウコーニング株式会社 シリルアルコキシメチルハライドの製造方法
JP4528613B2 (ja) 2004-12-27 2010-08-18 東レ・ダウコーニング株式会社 シリコーン樹脂とエポキシ樹脂の接着複合体およびその製造方法
JP4849814B2 (ja) 2005-03-29 2012-01-11 東レ・ダウコーニング株式会社 ホットメルト型シリコーン系接着剤

Also Published As

Publication number Publication date
EP1891160B1 (en) 2008-10-29
CN101198655A (zh) 2008-06-11
CN101198655B (zh) 2011-01-19
KR20080021668A (ko) 2008-03-07
EP1891160A1 (en) 2008-02-27
JP2006348119A (ja) 2006-12-28
US20090105441A1 (en) 2009-04-23
JP5025917B2 (ja) 2012-09-12
WO2006135036A1 (en) 2006-12-21
ATE412706T1 (de) 2008-11-15
KR101244204B1 (ko) 2013-03-18
US7781560B2 (en) 2010-08-24

Similar Documents

Publication Publication Date Title
DE602006003433D1 (de) Härtbare organopolysiloxanzusammensetzung
DE602007003724D1 (de) Härtbare organopolysiloxan-zusammensetzung und halbleiterbauelement
TW200736342A (en) Light emitting device encapsulated with silicones and curable silicone compositions for preparing the silicones
GB2453813B (en) Room temperature fast-curing organopolysiloxane compositions, their preparation and use
ATE454430T1 (de) Härtbare organopolysiloxanzusammensetzung und halbleitervorrichtung
ATE441687T1 (de) Durch hydrosilylierung gehärtetes silikonharz mit hoher bruchzähigkeit
TW200700502A (en) Curable resin composition for sealing led element
HRP20041035A2 (en) Epoxy modified organopolysiloxane resin based compositions useful for protective coatings
ATE386772T1 (de) Klebstoffe mit verbesserter chemikalienbeständigkeit und härtbare silikonzusammensetzungen zur herstellung der klebstoffe
MY134509A (en) Curable organopolysiloxane composition and a semiconductor device made with the use of this composition
CA2310283A1 (en) Addition-crosslinkable epoxy-functional organopolysiloxane polymer and coating compositions
ATE479726T1 (de) Härtbare organopolysiloxanharz-zusammensetzungen und daraus geformtes optisches teil
TW200720361A (en) Curable silicone composition
BRPI0815149A2 (pt) Processo para execução de uma hidrólise controlada e condensação de um silano epóxi-funcional, mistura de condensados a base de silano e uso da mesma
MY140964A (en) Addition-curable organopolysiloxane resin composition and an optical material
WO2008045417A3 (en) Extenders for organosiloxane compositions
ATE522577T1 (de) Thermoplastische polyamide mit polyetheraminen
TW200704713A (en) Curable silicone composition and cured product therefrom
DE602004006112D1 (de) Feuchtigkeitshärtende organosiloxanzusammensetzung
WO2009051084A3 (en) Curable silicone composition and cured product thereof
DE602005016594D1 (https=)
DE602005019574D1 (de) Härtbare organopolysiloxanzusammensetzung
TW200613450A (en) Silicon-containing curable composition and its thermally cured material
TW200720357A (en) Addition curable silicone resin composition for light emitting diode
WO2009137144A3 (en) Halogen-free benzoxazine based curable compositions for high tg applications

Legal Events

Date Code Title Description
8364 No opposition during term of opposition