JP4144563B2
(ja)
*
|
2003-07-11 |
2008-09-03 |
ティアック株式会社 |
ディスク装置
|
JP4406250B2
(ja)
*
|
2003-09-24 |
2010-01-27 |
株式会社東芝 |
スピントンネルトランジスタ
|
US20110140217A1
(en)
*
|
2004-02-26 |
2011-06-16 |
Grandis, Inc. |
Spin transfer magnetic element with free layers having high perpendicular anisotropy and in-plane equilibrium magnetization
|
US6992359B2
(en)
*
|
2004-02-26 |
2006-01-31 |
Grandis, Inc. |
Spin transfer magnetic element with free layers having high perpendicular anisotropy and in-plane equilibrium magnetization
|
US7672086B1
(en)
*
|
2004-04-28 |
2010-03-02 |
Western Digital (Fremont), Llc |
Method and system for providing a magnetic element having a current confined layer
|
US7576956B2
(en)
*
|
2004-07-26 |
2009-08-18 |
Grandis Inc. |
Magnetic tunnel junction having diffusion stop layer
|
US7224601B2
(en)
*
|
2005-08-25 |
2007-05-29 |
Grandis Inc. |
Oscillating-field assisted spin torque switching of a magnetic tunnel junction memory element
|
US7777261B2
(en)
|
2005-09-20 |
2010-08-17 |
Grandis Inc. |
Magnetic device having stabilized free ferromagnetic layer
|
US7973349B2
(en)
*
|
2005-09-20 |
2011-07-05 |
Grandis Inc. |
Magnetic device having multilayered free ferromagnetic layer
|
US7859034B2
(en)
*
|
2005-09-20 |
2010-12-28 |
Grandis Inc. |
Magnetic devices having oxide antiferromagnetic layer next to free ferromagnetic layer
|
US20070085068A1
(en)
*
|
2005-10-14 |
2007-04-19 |
Dmytro Apalkov |
Spin transfer based magnetic storage cells utilizing granular free layers and magnetic memories using such cells
|
JP5040105B2
(ja)
*
|
2005-12-01 |
2012-10-03 |
ソニー株式会社 |
記憶素子、メモリ
|
JP5049491B2
(ja)
*
|
2005-12-22 |
2012-10-17 |
パナソニック株式会社 |
電気素子,メモリ装置,および半導体集積回路
|
US7430135B2
(en)
*
|
2005-12-23 |
2008-09-30 |
Grandis Inc. |
Current-switched spin-transfer magnetic devices with reduced spin-transfer switching current density
|
US8063459B2
(en)
*
|
2007-02-12 |
2011-11-22 |
Avalanche Technologies, Inc. |
Non-volatile magnetic memory element with graded layer
|
US8183652B2
(en)
*
|
2007-02-12 |
2012-05-22 |
Avalanche Technology, Inc. |
Non-volatile magnetic memory with low switching current and high thermal stability
|
US8018011B2
(en)
*
|
2007-02-12 |
2011-09-13 |
Avalanche Technology, Inc. |
Low cost multi-state magnetic memory
|
US8058696B2
(en)
*
|
2006-02-25 |
2011-11-15 |
Avalanche Technology, Inc. |
High capacity low cost multi-state magnetic memory
|
US7732881B2
(en)
*
|
2006-11-01 |
2010-06-08 |
Avalanche Technology, Inc. |
Current-confined effect of magnetic nano-current-channel (NCC) for magnetic random access memory (MRAM)
|
US8508984B2
(en)
*
|
2006-02-25 |
2013-08-13 |
Avalanche Technology, Inc. |
Low resistance high-TMR magnetic tunnel junction and process for fabrication thereof
|
US8084835B2
(en)
*
|
2006-10-20 |
2011-12-27 |
Avalanche Technology, Inc. |
Non-uniform switching based non-volatile magnetic based memory
|
US20080246104A1
(en)
*
|
2007-02-12 |
2008-10-09 |
Yadav Technology |
High Capacity Low Cost Multi-State Magnetic Memory
|
US8363457B2
(en)
*
|
2006-02-25 |
2013-01-29 |
Avalanche Technology, Inc. |
Magnetic memory sensing circuit
|
US8535952B2
(en)
*
|
2006-02-25 |
2013-09-17 |
Avalanche Technology, Inc. |
Method for manufacturing non-volatile magnetic memory
|
US20070253245A1
(en)
*
|
2006-04-27 |
2007-11-01 |
Yadav Technology |
High Capacity Low Cost Multi-Stacked Cross-Line Magnetic Memory
|
US20070246787A1
(en)
*
|
2006-03-29 |
2007-10-25 |
Lien-Chang Wang |
On-plug magnetic tunnel junction devices based on spin torque transfer switching
|
JP4758812B2
(ja)
*
|
2006-04-26 |
2011-08-31 |
株式会社日立製作所 |
スピン流狭窄層を備えたスピン蓄積素子及びその作製方法
|
US8120949B2
(en)
*
|
2006-04-27 |
2012-02-21 |
Avalanche Technology, Inc. |
Low-cost non-volatile flash-RAM memory
|
US7782577B2
(en)
*
|
2006-06-06 |
2010-08-24 |
Infineon Technologies Ag |
MRAM structure using sacrificial layer for anti-ferromagnet and method of manufacture
|
US7851840B2
(en)
*
|
2006-09-13 |
2010-12-14 |
Grandis Inc. |
Devices and circuits based on magnetic tunnel junctions utilizing a multilayer barrier
|
JP4380693B2
(ja)
*
|
2006-12-12 |
2009-12-09 |
ソニー株式会社 |
記憶素子、メモリ
|
US7508042B2
(en)
|
2006-12-22 |
2009-03-24 |
Magic Technologies, Inc. |
Spin transfer MRAM device with magnetic biasing
|
JP2008166608A
(ja)
*
|
2006-12-28 |
2008-07-17 |
Tdk Corp |
スピンデバイス
|
US7869266B2
(en)
*
|
2007-10-31 |
2011-01-11 |
Avalanche Technology, Inc. |
Low current switching magnetic tunnel junction design for magnetic memory using domain wall motion
|
US8542524B2
(en)
*
|
2007-02-12 |
2013-09-24 |
Avalanche Technology, Inc. |
Magnetic random access memory (MRAM) manufacturing process for a small magnetic tunnel junction (MTJ) design with a low programming current requirement
|
US20090218645A1
(en)
*
|
2007-02-12 |
2009-09-03 |
Yadav Technology Inc. |
multi-state spin-torque transfer magnetic random access memory
|
JP5143444B2
(ja)
*
|
2007-02-13 |
2013-02-13 |
株式会社日立製作所 |
磁気抵抗効果素子、それを用いた磁気メモリセル及び磁気ランダムアクセスメモリ
|
JP5157268B2
(ja)
*
|
2007-06-13 |
2013-03-06 |
株式会社日立製作所 |
スピン蓄積磁化反転型のメモリ素子及びスピンram
|
US7957179B2
(en)
*
|
2007-06-27 |
2011-06-07 |
Grandis Inc. |
Magnetic shielding in magnetic multilayer structures
|
US7982275B2
(en)
|
2007-08-22 |
2011-07-19 |
Grandis Inc. |
Magnetic element having low saturation magnetization
|
US8100228B2
(en)
*
|
2007-10-12 |
2012-01-24 |
D B Industries, Inc. |
Portable anchorage assembly
|
US20090097303A1
(en)
*
|
2007-10-15 |
2009-04-16 |
Honeywell International Inc. |
MRAM with Resistive Property Adjustment
|
US7688615B2
(en)
*
|
2007-12-04 |
2010-03-30 |
Macronix International Co., Ltd. |
Magnetic random access memory, manufacturing method and programming method thereof
|
FR2925725B1
(fr)
*
|
2007-12-21 |
2011-03-25 |
Commissariat Energie Atomique |
Procede de modelisation d'une jonction tunnel magnetique a ecriture par courant polarise en spin
|
US8013406B2
(en)
*
|
2008-01-02 |
2011-09-06 |
The Hong Kong University Of Science And Technology |
Method and apparatus for generating giant spin-dependent chemical potential difference in non-magnetic materials
|
US8802451B2
(en)
|
2008-02-29 |
2014-08-12 |
Avalanche Technology Inc. |
Method for manufacturing high density non-volatile magnetic memory
|
FR2929041B1
(fr)
*
|
2008-03-18 |
2012-11-30 |
Crocus Technology |
Element magnetique a ecriture assistee thermiquement
|
US7936597B2
(en)
*
|
2008-03-25 |
2011-05-03 |
Seagate Technology Llc |
Multilevel magnetic storage device
|
US8659852B2
(en)
|
2008-04-21 |
2014-02-25 |
Seagate Technology Llc |
Write-once magentic junction memory array
|
US7999336B2
(en)
*
|
2008-04-24 |
2011-08-16 |
Seagate Technology Llc |
ST-RAM magnetic element configurations to reduce switching current
|
US7855911B2
(en)
|
2008-05-23 |
2010-12-21 |
Seagate Technology Llc |
Reconfigurable magnetic logic device using spin torque
|
US7852663B2
(en)
|
2008-05-23 |
2010-12-14 |
Seagate Technology Llc |
Nonvolatile programmable logic gates and adders
|
US20090303779A1
(en)
*
|
2008-06-05 |
2009-12-10 |
Young-Shying Chen |
Spin Torque Transfer MTJ Devices with High Thermal Stability and Low Write Currents
|
US7804709B2
(en)
|
2008-07-18 |
2010-09-28 |
Seagate Technology Llc |
Diode assisted switching spin-transfer torque memory unit
|
US8054677B2
(en)
|
2008-08-07 |
2011-11-08 |
Seagate Technology Llc |
Magnetic memory with strain-assisted exchange coupling switch
|
US8223532B2
(en)
|
2008-08-07 |
2012-07-17 |
Seagate Technology Llc |
Magnetic field assisted STRAM cells
|
US7935435B2
(en)
*
|
2008-08-08 |
2011-05-03 |
Seagate Technology Llc |
Magnetic memory cell construction
|
US7881098B2
(en)
|
2008-08-26 |
2011-02-01 |
Seagate Technology Llc |
Memory with separate read and write paths
|
US7894248B2
(en)
*
|
2008-09-12 |
2011-02-22 |
Grandis Inc. |
Programmable and redundant circuitry based on magnetic tunnel junction (MTJ)
|
US8482966B2
(en)
*
|
2008-09-24 |
2013-07-09 |
Qualcomm Incorporated |
Magnetic element utilizing protective sidewall passivation
|
US9929211B2
(en)
*
|
2008-09-24 |
2018-03-27 |
Qualcomm Incorporated |
Reducing spin pumping induced damping of a free layer of a memory device
|
US7940551B2
(en)
*
|
2008-09-29 |
2011-05-10 |
Seagate Technology, Llc |
STRAM with electronically reflective insulative spacer
|
US7985994B2
(en)
|
2008-09-29 |
2011-07-26 |
Seagate Technology Llc |
Flux-closed STRAM with electronically reflective insulative spacer
|
US7826256B2
(en)
*
|
2008-09-29 |
2010-11-02 |
Seagate Technology Llc |
STRAM with compensation element
|
US8102700B2
(en)
|
2008-09-30 |
2012-01-24 |
Micron Technology, Inc. |
Unidirectional spin torque transfer magnetic memory cell structure
|
US7746687B2
(en)
|
2008-09-30 |
2010-06-29 |
Seagate Technology, Llc |
Thermally assisted multi-bit MRAM
|
US8310861B2
(en)
*
|
2008-09-30 |
2012-11-13 |
Micron Technology, Inc. |
STT-MRAM cell structure incorporating piezoelectric stress material
|
US7876603B2
(en)
|
2008-09-30 |
2011-01-25 |
Micron Technology, Inc. |
Spin current generator for STT-MRAM or other spintronics applications
|
US8169810B2
(en)
|
2008-10-08 |
2012-05-01 |
Seagate Technology Llc |
Magnetic memory with asymmetric energy barrier
|
US8487390B2
(en)
*
|
2008-10-08 |
2013-07-16 |
Seagate Technology Llc |
Memory cell with stress-induced anisotropy
|
US8039913B2
(en)
|
2008-10-09 |
2011-10-18 |
Seagate Technology Llc |
Magnetic stack with laminated layer
|
US7880209B2
(en)
*
|
2008-10-09 |
2011-02-01 |
Seagate Technology Llc |
MRAM cells including coupled free ferromagnetic layers for stabilization
|
US8089132B2
(en)
*
|
2008-10-09 |
2012-01-03 |
Seagate Technology Llc |
Magnetic memory with phonon glass electron crystal material
|
US8217478B2
(en)
|
2008-10-10 |
2012-07-10 |
Seagate Technology Llc |
Magnetic stack with oxide to reduce switching current
|
US20100091564A1
(en)
*
|
2008-10-10 |
2010-04-15 |
Seagate Technology Llc |
Magnetic stack having reduced switching current
|
US9165625B2
(en)
*
|
2008-10-30 |
2015-10-20 |
Seagate Technology Llc |
ST-RAM cells with perpendicular anisotropy
|
US7829964B2
(en)
*
|
2008-10-31 |
2010-11-09 |
Industrial Technology Research Institute |
Magnetic memory element utilizing spin transfer switching
|
US7944738B2
(en)
|
2008-11-05 |
2011-05-17 |
Micron Technology, Inc. |
Spin torque transfer cell structure utilizing field-induced antiferromagnetic or ferromagnetic coupling
|
US8045366B2
(en)
|
2008-11-05 |
2011-10-25 |
Seagate Technology Llc |
STRAM with composite free magnetic element
|
US8043732B2
(en)
|
2008-11-11 |
2011-10-25 |
Seagate Technology Llc |
Memory cell with radial barrier
|
US7826181B2
(en)
|
2008-11-12 |
2010-11-02 |
Seagate Technology Llc |
Magnetic memory with porous non-conductive current confinement layer
|
US8289756B2
(en)
|
2008-11-25 |
2012-10-16 |
Seagate Technology Llc |
Non volatile memory including stabilizing structures
|
US7940600B2
(en)
|
2008-12-02 |
2011-05-10 |
Seagate Technology Llc |
Non-volatile memory with stray magnetic field compensation
|
US7859892B2
(en)
|
2008-12-03 |
2010-12-28 |
Seagate Technology Llc |
Magnetic random access memory with dual spin torque reference layers
|
US8184476B2
(en)
*
|
2008-12-26 |
2012-05-22 |
Everspin Technologies, Inc. |
Random access memory architecture including midpoint reference
|
US8553449B2
(en)
|
2009-01-09 |
2013-10-08 |
Micron Technology, Inc. |
STT-MRAM cell structures
|
US7957182B2
(en)
*
|
2009-01-12 |
2011-06-07 |
Micron Technology, Inc. |
Memory cell having nonmagnetic filament contact and methods of operating and fabricating the same
|
US7826259B2
(en)
|
2009-01-29 |
2010-11-02 |
Seagate Technology Llc |
Staggered STRAM cell
|
US8120126B2
(en)
|
2009-03-02 |
2012-02-21 |
Qualcomm Incorporated |
Magnetic tunnel junction device and fabrication
|
US8053255B2
(en)
|
2009-03-03 |
2011-11-08 |
Seagate Technology Llc |
STRAM with compensation element and method of making the same
|
US7834410B2
(en)
*
|
2009-04-13 |
2010-11-16 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
Spin torque transfer magnetic tunnel junction structure
|
US7936598B2
(en)
*
|
2009-04-28 |
2011-05-03 |
Seagate Technology |
Magnetic stack having assist layer
|
US8455267B2
(en)
|
2009-05-14 |
2013-06-04 |
Qualcomm Incorporated |
Magnetic tunnel junction device and fabrication
|
US8363459B2
(en)
*
|
2009-06-11 |
2013-01-29 |
Qualcomm Incorporated |
Magnetic tunnel junction device and fabrication
|
US7999338B2
(en)
*
|
2009-07-13 |
2011-08-16 |
Seagate Technology Llc |
Magnetic stack having reference layers with orthogonal magnetization orientation directions
|
US8183653B2
(en)
*
|
2009-07-13 |
2012-05-22 |
Seagate Technology Llc |
Magnetic tunnel junction having coherent tunneling structure
|
US20110031569A1
(en)
*
|
2009-08-10 |
2011-02-10 |
Grandis, Inc. |
Method and system for providing magnetic tunneling junction elements having improved performance through capping layer induced perpendicular anisotropy and memories using such magnetic elements
|
US8913350B2
(en)
*
|
2009-08-10 |
2014-12-16 |
Grandis, Inc. |
Method and system for providing magnetic tunneling junction elements having improved performance through capping layer induced perpendicular anisotropy and memories using such magnetic elements
|
US10446209B2
(en)
|
2009-08-10 |
2019-10-15 |
Samsung Semiconductor Inc. |
Method and system for providing magnetic tunneling junction elements having improved performance through capping layer induced perpendicular anisotropy and memories using such magnetic elements
|
US8558331B2
(en)
|
2009-12-08 |
2013-10-15 |
Qualcomm Incorporated |
Magnetic tunnel junction device
|
US8238143B2
(en)
*
|
2009-12-15 |
2012-08-07 |
Qualcomm Incorporated |
Magnetic tunnel junction device and fabrication
|
US8513749B2
(en)
*
|
2010-01-14 |
2013-08-20 |
Qualcomm Incorporated |
Composite hardmask architecture and method of creating non-uniform current path for spin torque driven magnetic tunnel junction
|
KR101684915B1
(ko)
|
2010-07-26 |
2016-12-12 |
삼성전자주식회사 |
자기 기억 소자
|
KR101676809B1
(ko)
|
2010-08-13 |
2016-11-16 |
삼성전자주식회사 |
발진기 및 그 동작방법
|
KR101676808B1
(ko)
|
2010-08-25 |
2016-11-17 |
삼성전자 주식회사 |
발진기 및 그 동작방법
|
KR101701979B1
(ko)
|
2010-09-02 |
2017-02-03 |
삼성전자 주식회사 |
발진기 및 그 동작방법
|
KR101740485B1
(ko)
|
2010-09-16 |
2017-05-29 |
삼성전자 주식회사 |
발진기와 그 제조 및 동작방법
|
US8399941B2
(en)
|
2010-11-05 |
2013-03-19 |
Grandis, Inc. |
Magnetic junction elements having an easy cone anisotropy and a magnetic memory using such magnetic junction elements
|
KR101777264B1
(ko)
|
2010-11-09 |
2017-09-12 |
삼성전자 주식회사 |
발진기 및 상기 발진기의 동작 방법
|
US8405171B2
(en)
|
2010-11-16 |
2013-03-26 |
Seagate Technology Llc |
Memory cell with phonon-blocking insulating layer
|
US8508973B2
(en)
|
2010-11-16 |
2013-08-13 |
Seagate Technology Llc |
Method of switching out-of-plane magnetic tunnel junction cells
|
US8432009B2
(en)
|
2010-12-31 |
2013-04-30 |
Grandis, Inc. |
Method and system for providing magnetic layers having insertion layers for use in spin transfer torque memories
|
US9478730B2
(en)
|
2010-12-31 |
2016-10-25 |
Samsung Electronics Co., Ltd. |
Method and system for providing magnetic layers having insertion layers for use in spin transfer torque memories
|
CN102298962A
(zh)
*
|
2011-03-29 |
2011-12-28 |
清华大学 |
一种复合自由层stt-ram存储单元
|
US8766383B2
(en)
|
2011-07-07 |
2014-07-01 |
Samsung Electronics Co., Ltd. |
Method and system for providing a magnetic junction using half metallic ferromagnets
|
US8576519B1
(en)
*
|
2012-10-11 |
2013-11-05 |
HGST Netherlands B.V. |
Current-perpendicular-to-the-plane (CPP) magnetoresistive (MR) sensor with magnetic damping material at the sensor edges
|
JP6182993B2
(ja)
*
|
2013-06-17 |
2017-08-23 |
ソニー株式会社 |
記憶素子、記憶装置、記憶素子の製造方法、磁気ヘッド
|
US20170200767A1
(en)
*
|
2014-09-11 |
2017-07-13 |
Agency For Science, Technology And Research |
Magnetic element and method of fabrication thereof
|
US9734850B1
(en)
*
|
2016-06-28 |
2017-08-15 |
Western Digital Technologies, Inc. |
Magnetic tunnel junction (MTJ) free layer damping reduction
|
CN106783809B
(zh)
*
|
2016-11-23 |
2019-03-01 |
华东师范大学 |
一种同轴自旋电容及制备方法
|
US10522745B2
(en)
*
|
2017-12-14 |
2019-12-31 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
Low resistance MgO capping layer for perpendicularly magnetized magnetic tunnel junctions
|
US10541269B2
(en)
*
|
2018-06-26 |
2020-01-21 |
Taiwan Semiconductor Manufacturing Co., Ltd. |
Magnetic random access memory and manufacturing method thereof
|
US10797225B2
(en)
*
|
2018-09-18 |
2020-10-06 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
Dual magnetic tunnel junction (DMTJ) stack design
|
US10700125B2
(en)
*
|
2018-09-28 |
2020-06-30 |
Taiwan Semiconductor Manufacturing Co., Ltd. |
Integrated system chip with magnetic module
|
CN112490354A
(zh)
*
|
2019-09-11 |
2021-03-12 |
上海磁宇信息科技有限公司 |
一种磁性随机存储器存储单元及磁性随机存储器
|
CN112490353A
(zh)
*
|
2019-09-11 |
2021-03-12 |
上海磁宇信息科技有限公司 |
一种磁性随机存储器存储单元及磁性随机存储器
|
CN112635654A
(zh)
*
|
2019-10-08 |
2021-04-09 |
上海磁宇信息科技有限公司 |
磁性隧道结结构及磁性随机存储器
|
CN112635649A
(zh)
*
|
2019-10-08 |
2021-04-09 |
上海磁宇信息科技有限公司 |
磁性隧道结结构及磁性随机存储器
|
CN112652703A
(zh)
*
|
2019-10-10 |
2021-04-13 |
上海磁宇信息科技有限公司 |
磁性隧道结结构及其磁性存储器
|
CN112864307A
(zh)
*
|
2019-11-28 |
2021-05-28 |
上海磁宇信息科技有限公司 |
一种磁性随机存储器存储单元及磁性随机存储器
|
KR20220053248A
(ko)
*
|
2020-10-22 |
2022-04-29 |
삼성전자주식회사 |
자기 소자
|
US11957063B2
(en)
*
|
2021-08-28 |
2024-04-09 |
Yimin Guo |
Magnetoresistive element having a nano-current-channel structure
|