DE602005010411D1 - Halbleiterspeicher mit redundanten Zeilen und Spalten und flexibler Redundanzarchitektur - Google Patents
Halbleiterspeicher mit redundanten Zeilen und Spalten und flexibler RedundanzarchitekturInfo
- Publication number
- DE602005010411D1 DE602005010411D1 DE602005010411T DE602005010411T DE602005010411D1 DE 602005010411 D1 DE602005010411 D1 DE 602005010411D1 DE 602005010411 T DE602005010411 T DE 602005010411T DE 602005010411 T DE602005010411 T DE 602005010411T DE 602005010411 D1 DE602005010411 D1 DE 602005010411D1
- Authority
- DE
- Germany
- Prior art keywords
- columns
- semiconductor memory
- redundant rows
- redundancy architecture
- flexible redundancy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
- G11C29/70—Masking faults in memories by using spares or by reconfiguring
- G11C29/78—Masking faults in memories by using spares or by reconfiguring using programmable devices
- G11C29/80—Masking faults in memories by using spares or by reconfiguring using programmable devices with improved layout
- G11C29/808—Masking faults in memories by using spares or by reconfiguring using programmable devices with improved layout using a flexible replacement scheme
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
- G11C29/70—Masking faults in memories by using spares or by reconfiguring
- G11C29/78—Masking faults in memories by using spares or by reconfiguring using programmable devices
- G11C29/838—Masking faults in memories by using spares or by reconfiguring using programmable devices with substitution of defective spares
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005191333A JP4607685B2 (ja) | 2005-06-30 | 2005-06-30 | 半導体メモリ |
Publications (1)
Publication Number | Publication Date |
---|---|
DE602005010411D1 true DE602005010411D1 (de) | 2008-11-27 |
Family
ID=37085843
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE602005010411T Active DE602005010411D1 (de) | 2005-06-30 | 2005-10-26 | Halbleiterspeicher mit redundanten Zeilen und Spalten und flexibler Redundanzarchitektur |
Country Status (7)
Country | Link |
---|---|
US (2) | US7196951B2 (de) |
EP (2) | EP1887582B1 (de) |
JP (1) | JP4607685B2 (de) |
KR (1) | KR100756258B1 (de) |
CN (2) | CN101430937B (de) |
DE (1) | DE602005010411D1 (de) |
TW (1) | TWI287235B (de) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101063571B1 (ko) * | 2008-12-08 | 2011-09-07 | 주식회사 하이닉스반도체 | 페이지 버퍼 회로 및 이를 구비한 불휘발성 메모리 소자와 그 동작 방법 |
US8238178B2 (en) | 2010-02-12 | 2012-08-07 | Taiwan Semiconductor Manufacturing Company, Ltd. | Redundancy circuits and operating methods thereof |
KR102597291B1 (ko) * | 2016-11-07 | 2023-11-06 | 에스케이하이닉스 주식회사 | 리페어 제어 장치 및 이를 포함하는 반도체 장치 |
US11568229B2 (en) * | 2018-07-11 | 2023-01-31 | Silicon Storage Technology, Inc. | Redundant memory access for rows or columns containing faulty memory cells in analog neural memory in deep learning artificial neural network |
JP6804493B2 (ja) | 2018-07-19 | 2020-12-23 | 華邦電子股▲ふん▼有限公司Winbond Electronics Corp. | メモリデバイス及びメモリ周辺回路 |
TWI713044B (zh) * | 2018-08-16 | 2020-12-11 | 華邦電子股份有限公司 | 記憶體裝置以及記憶體周邊電路 |
CN110867205B (zh) * | 2018-08-27 | 2021-10-08 | 华邦电子股份有限公司 | 存储器装置以及存储器周边电路 |
CN111192621A (zh) * | 2018-11-14 | 2020-05-22 | 长鑫存储技术有限公司 | 字线控制方法、字线控制电路装置以及半导体存储器 |
KR20200101651A (ko) * | 2019-02-20 | 2020-08-28 | 에스케이하이닉스 주식회사 | 메모리 및 메모리의 동작 방법 |
KR102669502B1 (ko) | 2019-07-09 | 2024-05-27 | 삼성전자주식회사 | 반도체 메모리 장치 및 반도체 메모리 장치의 동작 방법 |
CN112149548B (zh) * | 2020-09-17 | 2022-10-21 | 宁夏宁电电力设计有限公司 | 一种适用于端子排的cad图纸智能录入和识别方法及其装置 |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5265055A (en) * | 1988-10-07 | 1993-11-23 | Hitachi, Ltd. | Semiconductor memory having redundancy circuit |
KR950015041B1 (ko) * | 1992-11-23 | 1995-12-21 | 삼성전자주식회사 | 로우리던던시회로를 가지는 고집적 반도체 메모리 장치 |
JP3020077B2 (ja) * | 1993-03-03 | 2000-03-15 | 株式会社日立製作所 | 半導体メモリ |
JP3774500B2 (ja) * | 1995-05-12 | 2006-05-17 | 株式会社ルネサステクノロジ | 半導体記憶装置 |
JP3557022B2 (ja) * | 1995-12-08 | 2004-08-25 | 株式会社東芝 | 半導体記憶装置 |
JPH10275493A (ja) * | 1997-03-31 | 1998-10-13 | Nec Corp | 半導体記憶装置 |
US5831914A (en) * | 1997-03-31 | 1998-11-03 | International Business Machines Corporation | Variable size redundancy replacement architecture to make a memory fault-tolerant |
JPH10326496A (ja) * | 1997-05-26 | 1998-12-08 | Hitachi Ltd | 半導体記憶装置 |
JPH10334690A (ja) * | 1997-05-27 | 1998-12-18 | Nec Corp | 半導体記憶装置 |
JPH11250691A (ja) * | 1998-02-27 | 1999-09-17 | Toshiba Corp | 半導体記憶装置 |
DE59903253D1 (de) | 1998-04-17 | 2002-12-05 | Infineon Technologies Ag | Speicheranordnung mit redundanten speicherzellen und verfahren zum zugriff auf redundante speicherzellen |
US6052318A (en) * | 1998-12-22 | 2000-04-18 | Siemens Aktiengesellschaft | Repairable semiconductor memory circuit having parrel redundancy replacement wherein redundancy elements replace failed elements |
JP2000235800A (ja) * | 1999-02-12 | 2000-08-29 | Mitsubishi Electric Corp | 半導体記憶装置 |
JP2000268598A (ja) * | 1999-03-18 | 2000-09-29 | Toshiba Corp | 半導体メモリのリダンダンシイ回路 |
JP2001093294A (ja) * | 1999-09-24 | 2001-04-06 | Hitachi Ltd | 半導体装置 |
US6421284B1 (en) * | 2000-05-26 | 2002-07-16 | Hitachi, Limited | Semiconductor device |
JP2002008390A (ja) * | 2000-06-16 | 2002-01-11 | Fujitsu Ltd | 冗長セルを有するメモリデバイス |
TW594775B (en) * | 2001-06-04 | 2004-06-21 | Toshiba Corp | Semiconductor memory device |
KR100408714B1 (ko) | 2001-06-28 | 2003-12-11 | 주식회사 하이닉스반도체 | 반도체 메모리 장치의 컬럼 리페어회로 및 방법 |
JP2003208796A (ja) * | 2002-01-15 | 2003-07-25 | Mitsubishi Electric Corp | 薄膜磁性体記憶装置 |
-
2005
- 2005-06-30 JP JP2005191333A patent/JP4607685B2/ja not_active Expired - Fee Related
- 2005-10-24 TW TW094137151A patent/TWI287235B/zh not_active IP Right Cessation
- 2005-10-26 DE DE602005010411T patent/DE602005010411D1/de active Active
- 2005-10-26 EP EP07121234A patent/EP1887582B1/de not_active Expired - Fee Related
- 2005-10-26 EP EP05292263A patent/EP1742228B1/de not_active Expired - Fee Related
- 2005-10-27 US US11/258,936 patent/US7196951B2/en not_active Expired - Fee Related
- 2005-11-03 KR KR1020050104851A patent/KR100756258B1/ko active IP Right Grant
- 2005-11-15 CN CN2008101804264A patent/CN101430937B/zh not_active Expired - Fee Related
- 2005-11-15 CN CNB2005101232755A patent/CN100527271C/zh not_active Expired - Fee Related
-
2007
- 2007-03-07 US US11/714,766 patent/US7362630B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
TW200701250A (en) | 2007-01-01 |
KR100756258B1 (ko) | 2007-09-07 |
CN101430937B (zh) | 2012-09-05 |
EP1887582A3 (de) | 2008-04-23 |
EP1887582A2 (de) | 2008-02-13 |
US7362630B2 (en) | 2008-04-22 |
US20070002647A1 (en) | 2007-01-04 |
EP1742228B1 (de) | 2008-10-15 |
US7196951B2 (en) | 2007-03-27 |
TWI287235B (en) | 2007-09-21 |
CN1892903A (zh) | 2007-01-10 |
EP1887582B1 (de) | 2011-10-19 |
US20070195620A1 (en) | 2007-08-23 |
KR20070003512A (ko) | 2007-01-05 |
CN100527271C (zh) | 2009-08-12 |
CN101430937A (zh) | 2009-05-13 |
JP4607685B2 (ja) | 2011-01-05 |
EP1742228A1 (de) | 2007-01-10 |
JP2007012165A (ja) | 2007-01-18 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8327 | Change in the person/name/address of the patent owner |
Owner name: FUJITSU MICROELECTRONICS LTD., TOKYO, JP |
|
8364 | No opposition during term of opposition | ||
8327 | Change in the person/name/address of the patent owner |
Owner name: FUJITSU SEMICONDUCTOR LTD., YOKOHAMA, KANAGAWA, JP |
|
8328 | Change in the person/name/address of the agent |
Representative=s name: SEEGER SEEGER LINDNER PARTNERSCHAFT PATENTANWAELTE |