DE602004003612D1 - Kompaktes Kameramodul - Google Patents

Kompaktes Kameramodul

Info

Publication number
DE602004003612D1
DE602004003612D1 DE602004003612T DE602004003612T DE602004003612D1 DE 602004003612 D1 DE602004003612 D1 DE 602004003612D1 DE 602004003612 T DE602004003612 T DE 602004003612T DE 602004003612 T DE602004003612 T DE 602004003612T DE 602004003612 D1 DE602004003612 D1 DE 602004003612D1
Authority
DE
Germany
Prior art keywords
camera module
compact camera
compact
module
camera
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE602004003612T
Other languages
English (en)
Other versions
DE602004003612T2 (de
Inventor
Masahiro Saito
Satoshi Ajiki
Kazuhiro Yaegashi
Hironori Nakajo
Michio Sasaki
Yukihiro Furusawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsumi Electric Co Ltd
Original Assignee
Toshiba Corp
Mitsumi Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Mitsumi Electric Co Ltd filed Critical Toshiba Corp
Publication of DE602004003612D1 publication Critical patent/DE602004003612D1/de
Application granted granted Critical
Publication of DE602004003612T2 publication Critical patent/DE602004003612T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/0006—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00 with means to keep optical surfaces clean, e.g. by preventing or removing dirt, stains, contamination, condensation
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
    • G02B7/022—Mountings, adjusting means, or light-tight connections, for optical elements for lenses lens and mount having complementary engagement means, e.g. screw/thread
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14618—Containers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14625—Optical elements or arrangements associated with the device
    • H01L27/14627—Microlenses
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Optics & Photonics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electromagnetism (AREA)
  • Studio Devices (AREA)
  • Lens Barrels (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Camera Bodies And Camera Details Or Accessories (AREA)
DE602004003612T 2003-03-31 2004-03-30 Kompaktes Kameramodul Expired - Lifetime DE602004003612T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003096348 2003-03-31
JP2003096348A JP4223851B2 (ja) 2003-03-31 2003-03-31 小型カメラモジュール

Publications (2)

Publication Number Publication Date
DE602004003612D1 true DE602004003612D1 (de) 2007-01-25
DE602004003612T2 DE602004003612T2 (de) 2007-04-26

Family

ID=32844645

Family Applications (2)

Application Number Title Priority Date Filing Date
DE602004008325T Expired - Lifetime DE602004008325T2 (de) 2003-03-31 2004-03-30 Kompaktes Kameramodul
DE602004003612T Expired - Lifetime DE602004003612T2 (de) 2003-03-31 2004-03-30 Kompaktes Kameramodul

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE602004008325T Expired - Lifetime DE602004008325T2 (de) 2003-03-31 2004-03-30 Kompaktes Kameramodul

Country Status (5)

Country Link
US (1) US7515202B2 (de)
EP (2) EP1465411B1 (de)
JP (1) JP4223851B2 (de)
CN (1) CN100393108C (de)
DE (2) DE602004008325T2 (de)

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TWI298805B (en) 2005-02-15 2008-07-11 Sony Corp Lens unit and imaging apparatus
TW200632506A (en) * 2005-03-02 2006-09-16 Premier Image Technology Corp Camera module and its manufacturing process
CN1828354A (zh) * 2005-03-04 2006-09-06 普立尔科技股份有限公司 照相机模块及其制备方法
JP4585409B2 (ja) 2005-08-24 2010-11-24 株式会社東芝 小型カメラモジュール
US20070058069A1 (en) * 2005-09-14 2007-03-15 Po-Hung Chen Packaging structure of a light sensation module
JP2007134850A (ja) * 2005-11-09 2007-05-31 Alps Electric Co Ltd カメラモジュール
JP2007181043A (ja) * 2005-12-28 2007-07-12 Mitsumi Electric Co Ltd カメラモジュール
TWI437301B (zh) * 2006-02-03 2014-05-11 Hitachi Maxell Camera module
JP2007235276A (ja) * 2006-02-27 2007-09-13 Kyocera Corp 撮像デバイス
US8092102B2 (en) * 2006-05-31 2012-01-10 Flextronics Ap Llc Camera module with premolded lens housing and method of manufacture
DE102006050235B4 (de) * 2006-10-17 2014-02-13 Pilz Gmbh & Co. Kg Kamerasystem zum Überwachen eines Raumbereichs
CN101165527A (zh) * 2006-10-18 2008-04-23 鸿富锦精密工业（深圳）有限公司 便携式电子装置
WO2008129460A1 (en) * 2007-04-20 2008-10-30 Penta Optics B.V. Camera module
US8605208B2 (en) * 2007-04-24 2013-12-10 Digitaloptics Corporation Small form factor modules using wafer level optics with bottom cavity and flip-chip assembly
JP2008278287A (ja) * 2007-05-01 2008-11-13 Jai Corporation 光学フィルタ取付構造
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US9118825B2 (en) 2008-02-22 2015-08-25 Nan Chang O-Film Optoelectronics Technology Ltd. Attachment of wafer level optics
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JP5274881B2 (ja) * 2008-04-21 2013-08-28 カンタツ株式会社 撮像レンズモジュール
KR101594831B1 (ko) * 2009-03-26 2016-02-17 삼성전자 주식회사 바이오 드라이브에서의 카메라 모듈 고정 구조
JP5150566B2 (ja) * 2009-06-22 2013-02-20 株式会社東芝 半導体装置およびカメラモジュール
US9419032B2 (en) 2009-08-14 2016-08-16 Nanchang O-Film Optoelectronics Technology Ltd Wafer level camera module with molded housing and method of manufacturing
KR101060951B1 (ko) * 2009-10-23 2011-08-30 삼성전기주식회사 카메라 모듈 패키지
JP5392011B2 (ja) * 2009-11-04 2014-01-22 コニカミノルタ株式会社 撮像装置
US8836845B2 (en) * 2010-03-16 2014-09-16 Konica Minolta Advanced Layers, Inc. Imaging device and portable terminal
KR101779498B1 (ko) * 2010-11-16 2017-09-18 엘지이노텍 주식회사 카메라 모듈
TWI483056B (zh) * 2011-02-21 2015-05-01 Hon Hai Prec Ind Co Ltd 相機模組
WO2012161802A2 (en) 2011-02-24 2012-11-29 Flextronics Ap, Llc Autofocus camera module packaging with circuitry-integrated actuator system
CN102681124A (zh) * 2011-03-07 2012-09-19 鸿富锦精密工业（深圳）有限公司 镜头模组及其组装方法
DE102011014991B4 (de) * 2011-03-25 2014-06-05 Magna Electronics Europe Gmbh & Co. Kg Kamera
JP5776020B2 (ja) * 2011-10-07 2015-09-09 パナソニックＩｐマネジメント株式会社 カメラ装置
US9197796B2 (en) * 2011-11-23 2015-11-24 Lg Innotek Co., Ltd. Camera module
WO2013079082A1 (de) 2011-12-02 2013-06-06 Festo Ag & Co. Kg Optoelektrisches bildaufnahmegerät
TW201426081A (zh) * 2012-12-28 2014-07-01 Hon Hai Prec Ind Co Ltd 影像感測器模組及取像模組
TWI659648B (zh) 2013-03-25 2019-05-11 新力股份有限公司 Solid-state imaging device and camera module, and electronic device
JP6083721B2 (ja) 2013-12-02 2017-02-22 株式会社鷺宮製作所 流体関連機能装置
KR102207162B1 (ko) * 2014-06-11 2021-01-25 삼성전자주식회사 카메라 장치 및 카메라 장치를 구비한 전자 장치
US9980372B2 (en) * 2014-08-26 2018-05-22 Sharp Kabushiki Kaisha Camera module
WO2016200126A1 (ko) * 2015-06-08 2016-12-15 엘지이노텍(주) 카메라 모듈
KR102489948B1 (ko) * 2016-02-18 2023-01-19 삼성전자주식회사 전자 장치 및 전자 장치 제조방법
FR3060851B1 (fr) * 2016-12-20 2018-12-07 3D Plus Module optoelectronique 3d d'imagerie
JP6454754B2 (ja) * 2017-05-12 2019-01-16 マクセル株式会社 レンズユニット
CN107483792B (zh) * 2017-09-20 2020-11-06 信利光电股份有限公司 一种摄像模组及其制作方法
JP6993567B2 (ja) * 2017-09-29 2022-02-03 ミツミ電機株式会社 レンズ駆動装置、カメラモジュール、およびカメラ搭載装置
CN107864327A (zh) * 2017-12-19 2018-03-30 广东欧珀移动通信有限公司 芯片组件、摄像头及电子设备
JP7045894B2 (ja) * 2018-03-26 2022-04-01 三菱電機株式会社 回路基板の製造方法
CN110392187B (zh) * 2018-04-17 2023-01-13 宁波舜宇光电信息有限公司 具有倒角的摄像模组、感光组件、制备方法和电子设备
JP7335261B2 (ja) * 2018-04-17 2023-08-29 ▲寧▼波舜宇光▲電▼信息有限公司 面取りを有する撮像モジュール、感光モジュールおよび電子機器
CN208638454U (zh) * 2018-08-08 2019-03-22 瑞声科技(新加坡)有限公司 镜头模组
CN111123457B (zh) * 2018-10-31 2022-06-24 三赢科技（深圳）有限公司 底座及相机模组
CN209313918U (zh) * 2018-12-15 2019-08-27 三赢科技（深圳）有限公司 镜头模组及电子装置
JP7165894B2 (ja) * 2019-03-08 2022-11-07 パナソニックＩｐマネジメント株式会社 レンズユニットおよび撮像装置
CN115696006A (zh) * 2021-07-27 2023-02-03 晋城三赢精密电子有限公司 镜头模组及电子装置

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Also Published As

Publication number Publication date
CN100393108C (zh) 2008-06-04
JP2004304605A (ja) 2004-10-28
EP1465411A2 (de) 2004-10-06
EP1465411A3 (de) 2005-01-12
CN1534999A (zh) 2004-10-06
DE602004003612T2 (de) 2007-04-26
DE602004008325D1 (de) 2007-09-27
DE602004008325T2 (de) 2007-12-20
EP1686790B1 (de) 2007-08-15
US20040239794A1 (en) 2004-12-02
EP1686790B8 (de) 2007-11-07
US7515202B2 (en) 2009-04-07
JP4223851B2 (ja) 2009-02-12
EP1465411B1 (de) 2006-12-13
EP1686790A1 (de) 2006-08-02

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: MITSUMI ELECTRIC CO., LTD., TAMA, TOKIO/TOKYO, JP