DE60143882D1 - Verfahren zur Herstellung einer MOS-gesteuerten Halbleiteranordnung - Google Patents

Verfahren zur Herstellung einer MOS-gesteuerten Halbleiteranordnung

Info

Publication number
DE60143882D1
DE60143882D1 DE60143882T DE60143882T DE60143882D1 DE 60143882 D1 DE60143882 D1 DE 60143882D1 DE 60143882 T DE60143882 T DE 60143882T DE 60143882 T DE60143882 T DE 60143882T DE 60143882 D1 DE60143882 D1 DE 60143882D1
Authority
DE
Germany
Prior art keywords
mos
producing
semiconductor device
controlled semiconductor
controlled
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60143882T
Other languages
English (en)
Inventor
Christopher Kocon
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fairchild Semiconductor Corp
Original Assignee
Fairchild Semiconductor Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fairchild Semiconductor Corp filed Critical Fairchild Semiconductor Corp
Application granted granted Critical
Publication of DE60143882D1 publication Critical patent/DE60143882D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76—Unipolar devices, e.g. field effect transistors
    • H01L29/772—Field effect transistors
    • H01L29/78—Field effect transistors with field effect produced by an insulated gate
    • H01L29/7801—DMOS transistors, i.e. MISFETs with a channel accommodating body or base region adjoining a drain drift region
    • H01L29/7802—Vertical DMOS transistors, i.e. VDMOS transistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
    • H01L29/0603—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions
    • H01L29/0607—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration
    • H01L29/0611—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse biased devices
    • H01L29/0615—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse biased devices by the doping profile or the shape or the arrangement of the PN junction, or with supplementary regions, e.g. junction termination extension [JTE]
    • H01L29/063—Reduced surface field [RESURF] pn-junction structures
    • H01L29/0634—Multiple reduced surface field (multi-RESURF) structures, e.g. double RESURF, charge compensation, cool, superjunction (SJ), 3D-RESURF, composite buffer (CB) structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76—Unipolar devices, e.g. field effect transistors
    • H01L29/772—Field effect transistors
    • H01L29/78—Field effect transistors with field effect produced by an insulated gate
    • H01L29/7801—DMOS transistors, i.e. MISFETs with a channel accommodating body or base region adjoining a drain drift region
    • H01L29/7802—Vertical DMOS transistors, i.e. VDMOS transistors
    • H01L29/7813—Vertical DMOS transistors, i.e. VDMOS transistors with trench gate electrode, e.g. UMOS transistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
    • H01L29/0603—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions
    • H01L29/0642—Isolation within the component, i.e. internal isolation
    • H01L29/0649—Dielectric regions, e.g. SiO2 regions, air gaps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
    • H01L29/10—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions with semiconductor regions connected to an electrode not carrying current to be rectified, amplified or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
    • H01L29/1095—Body region, i.e. base region, of DMOS transistors or IGBTs

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Ceramic Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Composite Materials (AREA)
  • Manufacturing & Machinery (AREA)
  • Insulated Gate Type Field-Effect Transistor (AREA)
  • Electrodes Of Semiconductors (AREA)
DE60143882T 2000-02-11 2001-01-30 Verfahren zur Herstellung einer MOS-gesteuerten Halbleiteranordnung Expired - Lifetime DE60143882D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/502,712 US6376878B1 (en) 2000-02-11 2000-02-11 MOS-gated devices with alternating zones of conductivity
PCT/US2001/002964 WO2001059848A2 (en) 2000-02-11 2001-01-30 Mos-gated semiconductor device having alternating conductivity type semiconductor regions and methods of making the same

Publications (1)

Publication Number Publication Date
DE60143882D1 true DE60143882D1 (de) 2011-03-03

Family

ID=23999054

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60143882T Expired - Lifetime DE60143882D1 (de) 2000-02-11 2001-01-30 Verfahren zur Herstellung einer MOS-gesteuerten Halbleiteranordnung

Country Status (7)

Country Link
US (1) US6376878B1 (de)
EP (1) EP1256133B1 (de)
JP (2) JP2003523089A (de)
KR (1) KR100692877B1 (de)
AU (1) AU2001234648A1 (de)
DE (1) DE60143882D1 (de)
WO (1) WO2001059848A2 (de)

Families Citing this family (66)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001284584A (ja) * 2000-03-30 2001-10-12 Toshiba Corp 半導体装置及びその製造方法
US7745289B2 (en) * 2000-08-16 2010-06-29 Fairchild Semiconductor Corporation Method of forming a FET having ultra-low on-resistance and low gate charge
US6696726B1 (en) * 2000-08-16 2004-02-24 Fairchild Semiconductor Corporation Vertical MOSFET with ultra-low resistance and low gate charge
US6649975B2 (en) * 2000-11-16 2003-11-18 Silicon Semiconductor Corporation Vertical power devices having trench-based electrodes therein
US6710403B2 (en) * 2002-07-30 2004-03-23 Fairchild Semiconductor Corporation Dual trench power MOSFET
US6818513B2 (en) * 2001-01-30 2004-11-16 Fairchild Semiconductor Corporation Method of forming a field effect transistor having a lateral depletion structure
US6803626B2 (en) * 2002-07-18 2004-10-12 Fairchild Semiconductor Corporation Vertical charge control semiconductor device
US6916745B2 (en) * 2003-05-20 2005-07-12 Fairchild Semiconductor Corporation Structure and method for forming a trench MOSFET having self-aligned features
FI120310B (fi) * 2001-02-13 2009-09-15 Valtion Teknillinen Parannettu menetelmä erittyvien proteiinien tuottamiseksi sienissä
US6756273B2 (en) * 2001-03-12 2004-06-29 Semiconductor Components Industries, L.L.C. Semiconductor component and method of manufacturing
US6512267B2 (en) * 2001-04-12 2003-01-28 International Rectifier Corporation Superjunction device with self compensated trench walls
US6555873B2 (en) * 2001-09-07 2003-04-29 Power Integrations, Inc. High-voltage lateral transistor with a multi-layered extended drain structure
US7061066B2 (en) * 2001-10-17 2006-06-13 Fairchild Semiconductor Corporation Schottky diode using charge balance structure
US6750104B2 (en) * 2001-12-31 2004-06-15 General Semiconductor, Inc. High voltage power MOSFET having a voltage sustaining region that includes doped columns formed by trench etching using an etchant gas that is also a doping source
US6686244B2 (en) * 2002-03-21 2004-02-03 General Semiconductor, Inc. Power semiconductor device having a voltage sustaining region that includes doped columns formed with a single ion implantation step
JP3652322B2 (ja) * 2002-04-30 2005-05-25 Ｎｅｃエレクトロニクス株式会社 縦型ｍｏｓｆｅｔとその製造方法
US7033891B2 (en) * 2002-10-03 2006-04-25 Fairchild Semiconductor Corporation Trench gate laterally diffused MOSFET devices and methods for making such devices
US7576388B1 (en) 2002-10-03 2009-08-18 Fairchild Semiconductor Corporation Trench-gate LDMOS structures
US6710418B1 (en) 2002-10-11 2004-03-23 Fairchild Semiconductor Corporation Schottky rectifier with insulation-filled trenches and method of forming the same
US6870218B2 (en) * 2002-12-10 2005-03-22 Fairchild Semiconductor Corporation Integrated circuit structure with improved LDMOS design
US6979862B2 (en) * 2003-01-23 2005-12-27 International Rectifier Corporation Trench MOSFET superjunction structure and method to manufacture
DE10316710B3 (de) * 2003-04-11 2004-08-12 Infineon Technologies Ag Verfahren zur Herstellung eines eine Kompensationsstruktur aufweisenden Halbleiteiterkörpers
US7638841B2 (en) 2003-05-20 2009-12-29 Fairchild Semiconductor Corporation Power semiconductor devices and methods of manufacture
JP4209260B2 (ja) * 2003-06-04 2009-01-14 Ｎｅｃエレクトロニクス株式会社 半導体装置およびその製造方法
KR100994719B1 (ko) * 2003-11-28 2010-11-16 페어차일드코리아반도체 주식회사 슈퍼정션 반도체장치
JP4903055B2 (ja) * 2003-12-30 2012-03-21 フェアチャイルド・セミコンダクター・コーポレーション パワー半導体デバイスおよびその製造方法
US7368777B2 (en) 2003-12-30 2008-05-06 Fairchild Semiconductor Corporation Accumulation device with charge balance structure and method of forming the same
US20050199918A1 (en) * 2004-03-15 2005-09-15 Daniel Calafut Optimized trench power MOSFET with integrated schottky diode
US7352036B2 (en) 2004-08-03 2008-04-01 Fairchild Semiconductor Corporation Semiconductor power device having a top-side drain using a sinker trench
DE102004046697B4 (de) * 2004-09-24 2020-06-10 Infineon Technologies Ag Hochspannungsfestes Halbleiterbauelement mit vertikal leitenden Halbleiterkörperbereichen und einer Grabenstruktur sowie Verfahren zur Herstellung desselben
AT504998A2 (de) 2005-04-06 2008-09-15 Fairchild Semiconductor Trenched-gate-feldeffekttransistoren und verfahren zum bilden derselben
US7393749B2 (en) * 2005-06-10 2008-07-01 Fairchild Semiconductor Corporation Charge balance field effect transistor
US7446374B2 (en) 2006-03-24 2008-11-04 Fairchild Semiconductor Corporation High density trench FET with integrated Schottky diode and method of manufacture
US7319256B1 (en) 2006-06-19 2008-01-15 Fairchild Semiconductor Corporation Shielded gate trench FET with the shield and gate electrodes being connected together
JP5015762B2 (ja) * 2007-01-09 2012-08-29 株式会社ワイ・ワイ・エル 半導体装置
CN103762243B (zh) 2007-09-21 2017-07-28 飞兆半导体公司 功率器件
TW200921912A (en) * 2007-11-05 2009-05-16 Anpec Electronics Corp Power transistor capable of decreasing capacitance between gate and drain
US7772668B2 (en) 2007-12-26 2010-08-10 Fairchild Semiconductor Corporation Shielded gate trench FET with multiple channels
KR100943498B1 (ko) 2007-12-26 2010-02-22 주식회사 동부하이텍 반도체 소자 및 그 제조방법
US20120273916A1 (en) 2011-04-27 2012-11-01 Yedinak Joseph A Superjunction Structures for Power Devices and Methods of Manufacture
WO2010065428A2 (en) * 2008-12-01 2010-06-10 Maxpower Semiconductor Inc. Mos-gated power devices, methods, and integrated circuits
US7888734B2 (en) * 2008-12-04 2011-02-15 Taiwan Semiconductor Manufacturing Company, Ltd. High-voltage MOS devices having gates extending into recesses of substrates
US8174067B2 (en) * 2008-12-08 2012-05-08 Fairchild Semiconductor Corporation Trench-based power semiconductor devices with increased breakdown voltage characteristics
US8304829B2 (en) * 2008-12-08 2012-11-06 Fairchild Semiconductor Corporation Trench-based power semiconductor devices with increased breakdown voltage characteristics
US8227855B2 (en) * 2009-02-09 2012-07-24 Fairchild Semiconductor Corporation Semiconductor devices with stable and controlled avalanche characteristics and methods of fabricating the same
US8148749B2 (en) * 2009-02-19 2012-04-03 Fairchild Semiconductor Corporation Trench-shielded semiconductor device
US8049276B2 (en) 2009-06-12 2011-11-01 Fairchild Semiconductor Corporation Reduced process sensitivity of electrode-semiconductor rectifiers
GB2479372B (en) * 2010-04-07 2013-07-24 Ge Aviat Systems Ltd Power switches for aircraft
US8432000B2 (en) 2010-06-18 2013-04-30 Fairchild Semiconductor Corporation Trench MOS barrier schottky rectifier with a planar surface using CMP techniques
US8629020B2 (en) * 2010-10-25 2014-01-14 Electronics & Telecommunications Research Institute Semiconductor device and method of fabricating the same
US8836028B2 (en) 2011-04-27 2014-09-16 Fairchild Semiconductor Corporation Superjunction structures for power devices and methods of manufacture
US8786010B2 (en) 2011-04-27 2014-07-22 Fairchild Semiconductor Corporation Superjunction structures for power devices and methods of manufacture
US8772868B2 (en) 2011-04-27 2014-07-08 Fairchild Semiconductor Corporation Superjunction structures for power devices and methods of manufacture
US8673700B2 (en) 2011-04-27 2014-03-18 Fairchild Semiconductor Corporation Superjunction structures for power devices and methods of manufacture
TWI587503B (zh) * 2012-01-11 2017-06-11 世界先進積體電路股份有限公司 半導體裝置及其製造方法
JP2012160753A (ja) * 2012-04-13 2012-08-23 Denso Corp 半導体装置の製造方法
US9099519B2 (en) * 2012-05-23 2015-08-04 Great Wall Semiconductor Corporation Semiconductor device and method of forming junction enhanced trench power MOSFET
US9093520B2 (en) * 2013-08-28 2015-07-28 Taiwan Semiconductor Manufacturing Co., Ltd. High-voltage super junction by trench and epitaxial doping
US10192958B2 (en) * 2014-06-24 2019-01-29 General Electric Company Cellular layout for semiconductor devices
US10199465B2 (en) * 2014-06-24 2019-02-05 General Electric Company Cellular layout for semiconductor devices
CN104599972B (zh) * 2014-12-19 2018-08-14 成都士兰半导体制造有限公司 一种半导体器件及其形成方法
CN106158975A (zh) * 2016-08-30 2016-11-23 扬州扬杰电子科技股份有限公司 一种带屏蔽电极的功率mosfet元胞及其加工工艺
JP6818712B2 (ja) * 2018-03-22 2021-01-20 株式会社東芝 半導体装置
USD915535S1 (en) 2018-07-25 2021-04-06 Parsons Xtreme Golf, LLC Golf club head
US10957791B2 (en) * 2019-03-08 2021-03-23 Infineon Technologies Americas Corp. Power device with low gate charge and low figure of merit
US11271100B2 (en) * 2019-10-15 2022-03-08 Infineon Technologies Austria Ag Narrow semiconductor mesa device

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1019720B (zh) * 1991-03-19 1992-12-30 电子科技大学 半导体功率器件
JP3291957B2 (ja) * 1995-02-17 2002-06-17 富士電機株式会社 縦型トレンチｍｉｓｆｅｔおよびその製造方法
JPH08264772A (ja) * 1995-03-23 1996-10-11 Toyota Motor Corp 電界効果型半導体素子
JPH09266311A (ja) * 1996-01-22 1997-10-07 Fuji Electric Co Ltd 半導体装置及びその製造方法
JPH09213939A (ja) * 1996-01-30 1997-08-15 Nec Corp 半導体装置
JP3938964B2 (ja) * 1997-02-10 2007-06-27 三菱電機株式会社 高耐圧半導体装置およびその製造方法
WO2000068997A1 (en) * 1999-05-06 2000-11-16 C.P. Clare Corporation Mosfet with field reducing trenches in body region
EP1192640A2 (de) * 1999-06-03 2002-04-03 GENERAL SEMICONDUCTOR, Inc. Leistungs-mosfet und verfahren zu dessen herstellung
JP2001345444A (ja) * 1999-10-25 2001-12-14 Seiko Instruments Inc 半導体装置とその製造方法

Also Published As

Publication number Publication date
JP2003523089A (ja) 2003-07-29
KR100692877B1 (ko) 2007-03-12
EP1256133A2 (de) 2002-11-13
AU2001234648A1 (en) 2001-08-20
KR20020075404A (ko) 2002-10-04
WO2001059848A2 (en) 2001-08-16
EP1256133B1 (de) 2011-01-19
US6376878B1 (en) 2002-04-23
JP2012138600A (ja) 2012-07-19
WO2001059848A3 (en) 2002-05-02

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