DE60140362D1 - Verfahren zur herstellung eines halbleiterbauelements - Google Patents

Verfahren zur herstellung eines halbleiterbauelements

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Publication number
DE60140362D1
DE60140362D1 DE60140362T DE60140362T DE60140362D1 DE 60140362 D1 DE60140362 D1 DE 60140362D1 DE 60140362 T DE60140362 T DE 60140362T DE 60140362 T DE60140362 T DE 60140362T DE 60140362 D1 DE60140362 D1 DE 60140362D1
Authority
DE
Germany
Prior art keywords
producing
semiconductor component
semiconductor
component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60140362T
Other languages
English (en)
Inventor
Tadatomo Suga
K Saijo
S Ohsawa
H Okamoto
K Yoshida
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toyo Kohan Co Ltd
Original Assignee
Toyo Kohan Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyo Kohan Co Ltd filed Critical Toyo Kohan Co Ltd
Application granted granted Critical
Publication of DE60140362D1 publication Critical patent/DE60140362D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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DE60140362T 2000-04-19 2001-03-27 Verfahren zur herstellung eines halbleiterbauelements Expired - Lifetime DE60140362D1 (de)

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PCT/JP2001/002437 WO2001080299A1 (fr) 2000-04-19 2001-03-27 Dispositif semi-conducteur et son procede de fabrication

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EP1291906A1 (de) 2003-03-12
US20030155662A1 (en) 2003-08-21
CN1194394C (zh) 2005-03-23
WO2001080299A1 (fr) 2001-10-25
TW518921B (en) 2003-01-21
US7183190B2 (en) 2007-02-27
JP2001308095A (ja) 2001-11-02
KR100746862B1 (ko) 2007-08-07
EP1291906A4 (de) 2005-08-31

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