DE69912376D1 - Verfahren zur herstellung eines halbleiterbauelements - Google Patents
Verfahren zur herstellung eines halbleiterbauelementsInfo
- Publication number
- DE69912376D1 DE69912376D1 DE69912376T DE69912376T DE69912376D1 DE 69912376 D1 DE69912376 D1 DE 69912376D1 DE 69912376 T DE69912376 T DE 69912376T DE 69912376 T DE69912376 T DE 69912376T DE 69912376 D1 DE69912376 D1 DE 69912376D1
- Authority
- DE
- Germany
- Prior art keywords
- producing
- semiconductor component
- semiconductor
- component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
- G01L9/0042—Constructional details associated with semiconductive diaphragm sensors, e.g. etching, or constructional details of non-semiconductive diaphragms
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
- G01L9/0072—Transmitting or indicating the displacement of flexible diaphragms using variations in capacitance
- G01L9/0073—Transmitting or indicating the displacement of flexible diaphragms using variations in capacitance using a semiconductive diaphragm
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/017,494 US6156585A (en) | 1998-02-02 | 1998-02-02 | Semiconductor component and method of manufacture |
US17494 | 1998-02-02 | ||
PCT/US1999/001813 WO1999039170A1 (en) | 1998-02-02 | 1999-01-28 | Method of manufacturing a semiconductor component |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69912376D1 true DE69912376D1 (de) | 2003-12-04 |
DE69912376T2 DE69912376T2 (de) | 2004-05-06 |
Family
ID=21782909
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69912376T Expired - Fee Related DE69912376T2 (de) | 1998-02-02 | 1999-01-28 | Verfahren zur herstellung eines halbleiterbauelements |
Country Status (6)
Country | Link |
---|---|
US (2) | US6156585A (de) |
EP (1) | EP0995094B1 (de) |
JP (1) | JP4376322B2 (de) |
DE (1) | DE69912376T2 (de) |
NO (1) | NO320502B1 (de) |
WO (1) | WO1999039170A1 (de) |
Families Citing this family (42)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19961578A1 (de) * | 1999-12-21 | 2001-06-28 | Bosch Gmbh Robert | Sensor mit zumindest einer mikromechanischen Struktur und Verfahren zur Herstellung |
US6860153B2 (en) * | 2000-02-22 | 2005-03-01 | Simon Fraser University | Gas pressure sensor based on short-distance heat conduction and method for fabricating same |
US6647368B2 (en) | 2001-03-30 | 2003-11-11 | Think-A-Move, Ltd. | Sensor pair for detecting changes within a human ear and producing a signal corresponding to thought, movement, biological function and/or speech |
US6671379B2 (en) | 2001-03-30 | 2003-12-30 | Think-A-Move, Ltd. | Ear microphone apparatus and method |
KR100404904B1 (ko) * | 2001-06-09 | 2003-11-07 | 전자부품연구원 | 차동 용량형 압력센서 및 그 제조방법 |
JP4590791B2 (ja) * | 2001-07-03 | 2010-12-01 | 株式会社デンソー | センサの製造方法 |
WO2003025991A1 (en) * | 2001-09-17 | 2003-03-27 | Advion Biosciences, Inc. | Fabrication of a microchip-based electrospray device |
US6870939B2 (en) * | 2001-11-28 | 2005-03-22 | Industrial Technology Research Institute | SMT-type structure of the silicon-based electret condenser microphone |
US6829814B1 (en) * | 2002-08-29 | 2004-12-14 | Delphi Technologies, Inc. | Process of making an all-silicon microphone |
JP2005064068A (ja) * | 2003-08-19 | 2005-03-10 | Renesas Technology Corp | 半導体装置及びその製造方法 |
US20070073448A1 (en) * | 2003-08-19 | 2007-03-29 | Renesas Technology Corp. | Semiconductor device having a hole or a step of normal mesa shape as viewed from any cross-section and manufacturing method of the same |
JP4464125B2 (ja) * | 2003-12-22 | 2010-05-19 | ソニー株式会社 | 構造体の作製方法及びシリコン酸化膜エッチング剤 |
DE102004010295A1 (de) * | 2004-03-03 | 2005-09-22 | Robert Bosch Gmbh | Mikromechanisches Bauelement und entsprechendes Herstellungsverfahren |
FI115487B (fi) * | 2004-05-03 | 2005-05-13 | Vti Technologies Oy | Menetelmä kapasitiivisen paineanturin valmistamiseksi ja kapasitiivinen paineanturi |
JP4548771B2 (ja) * | 2004-06-25 | 2010-09-22 | 株式会社山武 | 容量式圧力センサの製造方法 |
US6923069B1 (en) * | 2004-10-18 | 2005-08-02 | Honeywell International Inc. | Top side reference cavity for absolute pressure sensor |
DE102005004877A1 (de) * | 2005-02-03 | 2006-08-10 | Robert Bosch Gmbh | Mikromechanisches Bauelement und entsprechendes Herstellungsverfahren |
US7449356B2 (en) * | 2005-04-25 | 2008-11-11 | Analog Devices, Inc. | Process of forming a microphone using support member |
US7885423B2 (en) | 2005-04-25 | 2011-02-08 | Analog Devices, Inc. | Support apparatus for microphone diaphragm |
US7825484B2 (en) * | 2005-04-25 | 2010-11-02 | Analog Devices, Inc. | Micromachined microphone and multisensor and method for producing same |
US7683429B2 (en) * | 2005-05-31 | 2010-03-23 | Semiconductor Energy Laboratory Co., Ltd. | Microstructure and manufacturing method of the same |
US7317234B2 (en) * | 2005-07-20 | 2008-01-08 | Douglas G Marsh | Means of integrating a microphone in a standard integrated circuit process |
TWI272671B (en) * | 2005-10-03 | 2007-02-01 | Touch Micro System Tech | Method of forming a cavity by two-step etching and method of reducing dimension of an MEMS device |
US7983433B2 (en) | 2005-11-08 | 2011-07-19 | Think-A-Move, Ltd. | Earset assembly |
US7297567B2 (en) * | 2006-01-10 | 2007-11-20 | Knowles Electronics, Llc. | Method for singulating a released microelectromechanical system wafer |
US7502484B2 (en) | 2006-06-14 | 2009-03-10 | Think-A-Move, Ltd. | Ear sensor assembly for speech processing |
WO2008014324A2 (en) * | 2006-07-25 | 2008-01-31 | Analog Devices, Inc. | Multiple microphone system |
DE102006047203B4 (de) * | 2006-10-05 | 2013-01-31 | Austriamicrosystems Ag | Mikrophonanordnung und Verfahren zu deren Herstellung |
JP4144640B2 (ja) | 2006-10-13 | 2008-09-03 | オムロン株式会社 | 振動センサの製造方法 |
TW200847827A (en) * | 2006-11-30 | 2008-12-01 | Analog Devices Inc | Microphone system with silicon microphone secured to package lid |
US20080247573A1 (en) * | 2007-04-06 | 2008-10-09 | Novusonic Corporation | Miniature capacitive acoustic sensor with stress-relieved actively clamped diaphragm |
TW200919593A (en) * | 2007-10-18 | 2009-05-01 | Asia Pacific Microsystems Inc | Elements and modules with micro caps and wafer level packaging method thereof |
US20090155948A1 (en) * | 2007-12-18 | 2009-06-18 | National Applied Research Laboratories | Methods for manufacturing cmos compatible bio-sensors |
WO2010029656A2 (en) | 2008-09-10 | 2010-03-18 | Panasonic Corporation | Mems device and method for manufacturing the same |
US7923379B2 (en) * | 2008-11-12 | 2011-04-12 | Taiwan Semiconductor Manufacturing Company, Ltd. | Multi-step process for forming high-aspect-ratio holes for MEMS devices |
US8263426B2 (en) * | 2008-12-03 | 2012-09-11 | Electronics And Telecommunications Research Institute | High-sensitivity z-axis vibration sensor and method of fabricating the same |
US7875482B2 (en) * | 2009-03-19 | 2011-01-25 | Robert Bosch Gmbh | Substrate with multiple encapsulated pressures |
US9290067B2 (en) | 2012-08-30 | 2016-03-22 | Freescale Semiconductor, Inc. | Pressure sensor with differential capacitive output |
US9502995B2 (en) * | 2012-12-04 | 2016-11-22 | The Regents Of The University Of Michigan | Micro-hydraulic device |
DE102013217726B4 (de) * | 2013-09-05 | 2021-07-29 | Robert Bosch Gmbh | Mikromechanisches Bauteil für eine kapazitive Sensorvorrichtung und Herstellungsverfahren für ein mikromechanisches Bauteil für eine kapazitive Sensorvorrichtung |
WO2015153938A1 (en) | 2014-04-04 | 2015-10-08 | Robert Bosch Gmbh | Membrane-based sensor and method for robust manufacture of a membrane-based sensor |
CN111189562A (zh) * | 2019-12-31 | 2020-05-22 | 中国科学院微电子研究所 | 具有usb输出的高精度差分电容式压力检测装置 |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE691677C (de) * | 1938-07-19 | 1940-06-03 | Ver Spielwarenfabriken Andreas | Elektrisches Eisenbahnspielzeug mit fernsteuerbaren Fahrzeugen |
US3853650A (en) * | 1973-02-12 | 1974-12-10 | Honeywell Inc | Stress sensor diaphragms over recessed substrates |
JPS5516228A (en) * | 1978-07-21 | 1980-02-04 | Hitachi Ltd | Capacity type sensor |
GB2198611B (en) * | 1986-12-13 | 1990-04-04 | Spectrol Reliance Ltd | Method of forming a sealed diaphragm on a substrate |
US4784721A (en) * | 1988-02-22 | 1988-11-15 | Honeywell Inc. | Integrated thin-film diaphragm; backside etch |
US5320705A (en) * | 1988-06-08 | 1994-06-14 | Nippondenso Co., Ltd. | Method of manufacturing a semiconductor pressure sensor |
GB8921722D0 (en) * | 1989-09-26 | 1989-11-08 | British Telecomm | Micromechanical switch |
US4961821A (en) * | 1989-11-22 | 1990-10-09 | Xerox Corporation | Ode through holes and butt edges without edge dicing |
JP2517467B2 (ja) * | 1990-10-05 | 1996-07-24 | 山武ハネウエル株式会社 | 静電容量式圧力センサ |
US5189777A (en) * | 1990-12-07 | 1993-03-02 | Wisconsin Alumni Research Foundation | Method of producing micromachined differential pressure transducers |
JP2896725B2 (ja) * | 1991-12-26 | 1999-05-31 | 株式会社山武 | 静電容量式圧力センサ |
US5323656A (en) * | 1992-05-12 | 1994-06-28 | The Foxboro Company | Overpressure-protected, polysilicon, capacitive differential pressure sensor and method of making the same |
US5332469A (en) * | 1992-11-12 | 1994-07-26 | Ford Motor Company | Capacitive surface micromachined differential pressure sensor |
US5369544A (en) * | 1993-04-05 | 1994-11-29 | Ford Motor Company | Silicon-on-insulator capacitive surface micromachined absolute pressure sensor |
US5424650A (en) * | 1993-09-24 | 1995-06-13 | Rosemont Inc. | Capacitive pressure sensor having circuitry for eliminating stray capacitance |
EP0657718B1 (de) * | 1993-12-07 | 1998-08-26 | Matsushita Electric Industrial Co., Ltd. | Kapazitiver Sensor und Verfahren zur Herstellung |
DE4424015A1 (de) * | 1994-07-08 | 1996-01-11 | Ant Nachrichtentech | Verfahren zur Erhöhung der lateralen Unterätzung einer strukturierten Schicht |
US5479827A (en) * | 1994-10-07 | 1996-01-02 | Yamatake-Honeywell Co., Ltd. | Capacitive pressure sensor isolating electrodes from external environment |
JP3114570B2 (ja) * | 1995-05-26 | 2000-12-04 | オムロン株式会社 | 静電容量型圧力センサ |
US5888845A (en) * | 1996-05-02 | 1999-03-30 | National Semiconductor Corporation | Method of making high sensitivity micro-machined pressure sensors and acoustic transducers |
US6069392A (en) * | 1997-04-11 | 2000-05-30 | California Institute Of Technology | Microbellows actuator |
-
1998
- 1998-02-02 US US09/017,494 patent/US6156585A/en not_active Expired - Fee Related
-
1999
- 1999-01-28 JP JP53949299A patent/JP4376322B2/ja not_active Expired - Lifetime
- 1999-01-28 DE DE69912376T patent/DE69912376T2/de not_active Expired - Fee Related
- 1999-01-28 WO PCT/US1999/001813 patent/WO1999039170A1/en active IP Right Grant
- 1999-01-28 EP EP99904374A patent/EP0995094B1/de not_active Expired - Lifetime
- 1999-10-04 NO NO19994814A patent/NO320502B1/no unknown
-
2000
- 2000-07-31 US US09/629,611 patent/US6426239B1/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JP4376322B2 (ja) | 2009-12-02 |
EP0995094A1 (de) | 2000-04-26 |
NO994814L (no) | 1999-10-04 |
EP0995094B1 (de) | 2003-10-29 |
NO994814D0 (no) | 1999-10-04 |
NO320502B1 (no) | 2005-12-12 |
US6426239B1 (en) | 2002-07-30 |
US6156585A (en) | 2000-12-05 |
WO1999039170A1 (en) | 1999-08-05 |
JP2001519915A (ja) | 2001-10-23 |
DE69912376T2 (de) | 2004-05-06 |
WO1999039170B1 (en) | 1999-09-23 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8327 | Change in the person/name/address of the patent owner |
Owner name: FREESCALE SEMICONDUCTOR, INC., AUSTIN, TEX., US |
|
8339 | Ceased/non-payment of the annual fee |