DE69902860D1 - Verfahren zur Herstellung eines integrierten Halbleiterbauelements - Google Patents

Verfahren zur Herstellung eines integrierten Halbleiterbauelements

Info

Publication number
DE69902860D1
DE69902860D1 DE69902860T DE69902860T DE69902860D1 DE 69902860 D1 DE69902860 D1 DE 69902860D1 DE 69902860 T DE69902860 T DE 69902860T DE 69902860 T DE69902860 T DE 69902860T DE 69902860 D1 DE69902860 D1 DE 69902860D1
Authority
DE
Germany
Prior art keywords
producing
semiconductor component
integrated semiconductor
integrated
component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69902860T
Other languages
English (en)
Other versions
DE69902860T2 (de
Inventor
Koji Hamada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Application granted granted Critical
Publication of DE69902860D1 publication Critical patent/DE69902860D1/de
Publication of DE69902860T2 publication Critical patent/DE69902860T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
    • H01L27/10—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/30604—Chemical etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/3065—Plasma etching; Reactive-ion etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Semiconductor Memories (AREA)
  • Element Separation (AREA)
DE69902860T 1998-11-27 1999-11-24 Verfahren zur Herstellung eines integrierten Halbleiterbauelements Expired - Fee Related DE69902860T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP33780898 1998-11-27

Publications (2)

Publication Number Publication Date
DE69902860D1 true DE69902860D1 (de) 2002-10-17
DE69902860T2 DE69902860T2 (de) 2003-05-28

Family

ID=18312173

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69902860T Expired - Fee Related DE69902860T2 (de) 1998-11-27 1999-11-24 Verfahren zur Herstellung eines integrierten Halbleiterbauelements

Country Status (4)

Country Link
US (1) US6165873A (de)
EP (1) EP1005070B1 (de)
KR (1) KR100319679B1 (de)
DE (1) DE69902860T2 (de)

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KR100338771B1 (ko) * 1999-11-12 2002-05-30 윤종용 수소 어닐링 단계를 포함하는 공정이 간단한 트렌치소자분리방법
DE10124144B4 (de) * 2001-05-17 2007-12-13 Qimonda Ag Verfahren zur Eliminierung morphologischer und kristallografischer Defekte in Halbleiteroberflächen
US7145739B1 (en) * 2002-03-07 2006-12-05 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Lightweight optical mirrors formed in single crystal substrate
US6611449B1 (en) * 2002-09-24 2003-08-26 Infineon Technologies Aktiengesellschaft Contact for memory cells
JP4860113B2 (ja) * 2003-12-26 2012-01-25 ルネサスエレクトロニクス株式会社 半導体集積回路装置の製造方法
US20100186804A1 (en) * 2009-01-29 2010-07-29 Emcore Solar Power, Inc. String Interconnection of Inverted Metamorphic Multijunction Solar Cells on Flexible Perforated Carriers
US10170656B2 (en) 2009-03-10 2019-01-01 Solaero Technologies Corp. Inverted metamorphic multijunction solar cell with a single metamorphic layer
US20100122724A1 (en) 2008-11-14 2010-05-20 Emcore Solar Power, Inc. Four Junction Inverted Metamorphic Multijunction Solar Cell with Two Metamorphic Layers
US20100229913A1 (en) * 2009-01-29 2010-09-16 Emcore Solar Power, Inc. Contact Layout and String Interconnection of Inverted Metamorphic Multijunction Solar Cells
US20090078309A1 (en) * 2007-09-24 2009-03-26 Emcore Corporation Barrier Layers In Inverted Metamorphic Multijunction Solar Cells
US20090078310A1 (en) * 2007-09-24 2009-03-26 Emcore Corporation Heterojunction Subcells In Inverted Metamorphic Multijunction Solar Cells
US20100229926A1 (en) 2009-03-10 2010-09-16 Emcore Solar Power, Inc. Four Junction Inverted Metamorphic Multijunction Solar Cell with a Single Metamorphic Layer
US20100203730A1 (en) * 2009-02-09 2010-08-12 Emcore Solar Power, Inc. Epitaxial Lift Off in Inverted Metamorphic Multijunction Solar Cells
US20100047959A1 (en) * 2006-08-07 2010-02-25 Emcore Solar Power, Inc. Epitaxial Lift Off on Film Mounted Inverted Metamorphic Multijunction Solar Cells
US20080245409A1 (en) * 2006-12-27 2008-10-09 Emcore Corporation Inverted Metamorphic Solar Cell Mounted on Flexible Film
US20080188277A1 (en) 2007-02-01 2008-08-07 Ritter Janice E Electronic Game Device And Method Of Using The Same
US10381505B2 (en) 2007-09-24 2019-08-13 Solaero Technologies Corp. Inverted metamorphic multijunction solar cells including metamorphic layers
US8895342B2 (en) 2007-09-24 2014-11-25 Emcore Solar Power, Inc. Heterojunction subcells in inverted metamorphic multijunction solar cells
US20090155952A1 (en) * 2007-12-13 2009-06-18 Emcore Corporation Exponentially Doped Layers In Inverted Metamorphic Multijunction Solar Cells
US20100012175A1 (en) 2008-07-16 2010-01-21 Emcore Solar Power, Inc. Ohmic n-contact formed at low temperature in inverted metamorphic multijunction solar cells
US20090272430A1 (en) * 2008-04-30 2009-11-05 Emcore Solar Power, Inc. Refractive Index Matching in Inverted Metamorphic Multijunction Solar Cells
US20090272438A1 (en) * 2008-05-05 2009-11-05 Emcore Corporation Strain Balanced Multiple Quantum Well Subcell In Inverted Metamorphic Multijunction Solar Cell
US20100012174A1 (en) * 2008-07-16 2010-01-21 Emcore Corporation High band gap contact layer in inverted metamorphic multijunction solar cells
US9287438B1 (en) * 2008-07-16 2016-03-15 Solaero Technologies Corp. Method for forming ohmic N-contacts at low temperature in inverted metamorphic multijunction solar cells with contaminant isolation
US8263853B2 (en) * 2008-08-07 2012-09-11 Emcore Solar Power, Inc. Wafer level interconnection of inverted metamorphic multijunction solar cells
US8236600B2 (en) 2008-11-10 2012-08-07 Emcore Solar Power, Inc. Joining method for preparing an inverted metamorphic multijunction solar cell
US20100122764A1 (en) * 2008-11-14 2010-05-20 Emcore Solar Power, Inc. Surrogate Substrates for Inverted Metamorphic Multijunction Solar Cells
US9018521B1 (en) 2008-12-17 2015-04-28 Solaero Technologies Corp. Inverted metamorphic multijunction solar cell with DBR layer adjacent to the top subcell
US10541349B1 (en) 2008-12-17 2020-01-21 Solaero Technologies Corp. Methods of forming inverted multijunction solar cells with distributed Bragg reflector
US20100159699A1 (en) * 2008-12-19 2010-06-24 Yoshimi Takahashi Sandblast etching for through semiconductor vias
US7960201B2 (en) * 2009-01-29 2011-06-14 Emcore Solar Power, Inc. String interconnection and fabrication of inverted metamorphic multijunction solar cells
US8778199B2 (en) 2009-02-09 2014-07-15 Emoore Solar Power, Inc. Epitaxial lift off in inverted metamorphic multijunction solar cells
US20100206365A1 (en) * 2009-02-19 2010-08-19 Emcore Solar Power, Inc. Inverted Metamorphic Multijunction Solar Cells on Low Density Carriers
US20100229933A1 (en) * 2009-03-10 2010-09-16 Emcore Solar Power, Inc. Inverted Metamorphic Multijunction Solar Cells with a Supporting Coating
US9018519B1 (en) 2009-03-10 2015-04-28 Solaero Technologies Corp. Inverted metamorphic multijunction solar cells having a permanent supporting substrate
US20100282288A1 (en) * 2009-05-06 2010-11-11 Emcore Solar Power, Inc. Solar Cell Interconnection on a Flexible Substrate
US8263856B2 (en) * 2009-08-07 2012-09-11 Emcore Solar Power, Inc. Inverted metamorphic multijunction solar cells with back contacts
US8187907B1 (en) 2010-05-07 2012-05-29 Emcore Solar Power, Inc. Solder structures for fabrication of inverted metamorphic multijunction solar cells
US9490368B2 (en) 2010-05-20 2016-11-08 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method of the same
KR101974538B1 (ko) 2012-07-17 2019-05-08 에스케이하이닉스 주식회사 반도체 장치 제조 방법
US10153388B1 (en) 2013-03-15 2018-12-11 Solaero Technologies Corp. Emissivity coating for space solar cell arrays

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JP3419792B2 (ja) * 1991-03-15 2003-06-23 ソニー株式会社 半導体装置の製造方法
JP3187109B2 (ja) * 1992-01-31 2001-07-11 キヤノン株式会社 半導体部材およびその製造方法
US5256599A (en) * 1992-06-01 1993-10-26 Motorola, Inc. Semiconductor wafer wax mounting and thinning process
US5304509A (en) * 1992-08-24 1994-04-19 Midwest Research Institute Back-side hydrogenation technique for defect passivation in silicon solar cells
US6008110A (en) * 1994-07-21 1999-12-28 Kabushiki Kaisha Toshiba Semiconductor substrate and method of manufacturing same
JPH08264552A (ja) * 1995-03-24 1996-10-11 Toshiba Ceramics Co Ltd シリコンウエーハの製造方法
JPH0964194A (ja) * 1995-08-22 1997-03-07 Nippon Steel Corp 半導体装置の製造方法
JP3250722B2 (ja) * 1995-12-12 2002-01-28 キヤノン株式会社 Ｓｏｉ基板の製造方法および製造装置
JPH09270398A (ja) * 1996-04-01 1997-10-14 Sony Corp Ｓｏｉ基板の形成方法
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Also Published As

Publication number Publication date
KR100319679B1 (ko) 2002-01-09
US6165873A (en) 2000-12-26
DE69902860T2 (de) 2003-05-28
EP1005070A3 (de) 2000-10-18
KR20000035696A (ko) 2000-06-26
EP1005070B1 (de) 2002-09-11
EP1005070A2 (de) 2000-05-31

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee