DE60130520T2 - Lichtquelle - Google Patents

Lichtquelle Download PDF

Info

Publication number
DE60130520T2
DE60130520T2 DE60130520T DE60130520T DE60130520T2 DE 60130520 T2 DE60130520 T2 DE 60130520T2 DE 60130520 T DE60130520 T DE 60130520T DE 60130520 T DE60130520 T DE 60130520T DE 60130520 T2 DE60130520 T2 DE 60130520T2
Authority
DE
Germany
Prior art keywords
substrate
recess
led chip
led
light source
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60130520T
Other languages
German (de)
English (en)
Other versions
DE60130520D1 (de
Inventor
Huck Khim Georgetown Koay
Chee Keong Seberang Jaya Perai Chong
Seong Choon Sg. Ara Georgetown Lim
Gurbir Georgetown Singh
Cheng Why 14000 Bukit Mertajam Tan
Sundar a/l 11700 Gelugor Natarajan Yoganandan
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Avago Technologies International Sales Pte Ltd
Original Assignee
Avago Technologies General IP Singapore Pte Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Avago Technologies General IP Singapore Pte Ltd filed Critical Avago Technologies General IP Singapore Pte Ltd
Publication of DE60130520D1 publication Critical patent/DE60130520D1/de
Application granted granted Critical
Publication of DE60130520T2 publication Critical patent/DE60130520T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Led Device Packages (AREA)
  • Transforming Electric Information Into Light Information (AREA)
DE60130520T 2000-06-28 2001-06-26 Lichtquelle Expired - Lifetime DE60130520T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
MY0002918 2000-06-28
MYPI20002918 2000-06-28

Publications (2)

Publication Number Publication Date
DE60130520D1 DE60130520D1 (de) 2007-10-31
DE60130520T2 true DE60130520T2 (de) 2008-06-26

Family

ID=19749463

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60130520T Expired - Lifetime DE60130520T2 (de) 2000-06-28 2001-06-26 Lichtquelle

Country Status (4)

Country Link
US (1) US6806583B2 (https=)
EP (1) EP1168461B1 (https=)
JP (1) JP4926337B2 (https=)
DE (1) DE60130520T2 (https=)

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DE10246786A1 (de) * 2002-10-08 2004-04-22 Ultrastar Limited Gehäusekonstruktion einer LED für Oberflächenmontage sowie Verfahren zum Herstellen derselben
ITMI20022467A1 (it) * 2002-11-20 2004-05-21 St Microelectronics Srl Processo per realizzare un transistore di selezione di byte per
TW560697U (en) * 2002-11-26 2003-11-01 Topson Technology Co Ltd Surface-mounting type light-emitting diode structure
JP4281363B2 (ja) * 2003-01-20 2009-06-17 パナソニック電工株式会社 配線板及び発光装置
US7734168B2 (en) * 2003-01-21 2010-06-08 Fujifilm Corporation Lighting apparatus, electronic flash apparatus and camera
JP2004265977A (ja) * 2003-02-28 2004-09-24 Noritsu Koki Co Ltd 発光ダイオード光源ユニット
US20040173808A1 (en) * 2003-03-07 2004-09-09 Bor-Jen Wu Flip-chip like light emitting device package
US7220020B2 (en) * 2003-05-06 2007-05-22 Ji-Mei Tsuei Light source device
US6995402B2 (en) * 2003-10-03 2006-02-07 Lumileds Lighting, U.S., Llc Integrated reflector cup for a light emitting device mount
KR100604602B1 (ko) 2004-05-19 2006-07-24 서울반도체 주식회사 발광 다이오드 렌즈 및 그것을 갖는 발광 다이오드
JP2006093672A (ja) * 2004-08-26 2006-04-06 Toshiba Corp 半導体発光装置
US7405433B2 (en) * 2005-02-22 2008-07-29 Avago Technologies Ecbu Ip Pte Ltd Semiconductor light emitting device
JP4915052B2 (ja) * 2005-04-01 2012-04-11 パナソニック株式会社 Ｌｅｄ部品およびその製造方法
WO2006106901A1 (ja) * 2005-04-01 2006-10-12 Matsushita Electric Industrial Co., Ltd. Ｌｅｄ部品およびその製造方法
CA2617314A1 (en) * 2005-04-05 2006-10-12 Tir Technology Lp Mounting assembly for optoelectronic devices
KR100691174B1 (ko) 2005-05-24 2007-03-09 삼성전기주식회사 측면형 발광 다이오드 및 그 제조방법
US7105863B1 (en) 2005-06-03 2006-09-12 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. Light source with improved life
JP2007088155A (ja) * 2005-09-21 2007-04-05 Stanley Electric Co Ltd 表面実装型ｌｅｄ基板
US8011082B2 (en) * 2005-11-09 2011-09-06 Koninklijke Philips Electronics N.V. Method of manufacturing a package carrier
US8044412B2 (en) 2006-01-20 2011-10-25 Taiwan Semiconductor Manufacturing Company, Ltd Package for a light emitting element
JP4654942B2 (ja) * 2006-02-28 2011-03-23 ミネベア株式会社 面状照明装置
KR20080032882A (ko) * 2006-10-11 2008-04-16 삼성전기주식회사 발광 다이오드 패키지
US20080246397A1 (en) * 2007-04-04 2008-10-09 Bily Wang Manufacturing method of white light led and structure thereof
DE102007043401A1 (de) * 2007-09-12 2009-03-19 Osram Gesellschaft mit beschränkter Haftung Leuchtvorrichtung und Verfahren zur Herstellung derselben
TWI401820B (zh) * 2007-11-07 2013-07-11 財團法人工業技術研究院 發光元件及其製作方法
US8946987B2 (en) 2007-11-07 2015-02-03 Industrial Technology Research Institute Light emitting device and fabricating method thereof
GB2458345B (en) * 2008-03-12 2012-05-23 Dialight Lumidrives Ltd Method and apparatus for providing illumination
US7923739B2 (en) 2009-06-05 2011-04-12 Cree, Inc. Solid state lighting device
US8598602B2 (en) 2009-01-12 2013-12-03 Cree, Inc. Light emitting device packages with improved heat transfer
US8309973B2 (en) * 2009-02-12 2012-11-13 Taiwan Semiconductor Manufacturing Company, Ltd. Silicon-based sub-mount for an opto-electronic device
US8860043B2 (en) * 2009-06-05 2014-10-14 Cree, Inc. Light emitting device packages, systems and methods
US9111778B2 (en) 2009-06-05 2015-08-18 Cree, Inc. Light emitting diode (LED) devices, systems, and methods
JP5612355B2 (ja) * 2009-07-15 2014-10-22 株式会社Ｋａｎｚａｃｃ メッキ構造及び電気材料の製造方法
US8101962B2 (en) * 2009-10-06 2012-01-24 Kuang Hong Precision Co., Ltd. Carrying structure of semiconductor
CN102237466B (zh) * 2010-04-28 2013-11-06 展晶科技(深圳)有限公司 发光组件封装结构及其制程
EP2390909A1 (en) * 2010-05-24 2011-11-30 Jerry Hu Miniature packaging for discrete circuit components
US8269244B2 (en) 2010-06-28 2012-09-18 Cree, Inc. LED package with efficient, isolated thermal path
US11101408B2 (en) 2011-02-07 2021-08-24 Creeled, Inc. Components and methods for light emitting diode (LED) lighting
TW201251140A (en) 2011-01-31 2012-12-16 Cree Inc High brightness light emitting diode (LED) packages, systems and methods with improved resin filling and high adhesion
JP2014063967A (ja) * 2012-09-24 2014-04-10 Towa Corp 発光デバイス及びその製造方法、並びに発光デバイス成形用金型
KR101912290B1 (ko) * 2017-12-06 2018-10-29 삼성전기 주식회사 팬-아웃 반도체 패키지

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JP3432113B2 (ja) * 1997-07-07 2003-08-04 シャープ株式会社 光半導体装置
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Also Published As

Publication number Publication date
DE60130520D1 (de) 2007-10-31
EP1168461B1 (en) 2007-09-19
EP1168461A3 (en) 2003-01-22
US20020047130A1 (en) 2002-04-25
JP2002064226A (ja) 2002-02-28
JP4926337B2 (ja) 2012-05-09
US6806583B2 (en) 2004-10-19
EP1168461A2 (en) 2002-01-02

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Representative=s name: DILG HAEUSLER SCHINDELMANN PATENTANWALTSGESELLSCHA

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