JP4926337B2 - 光源 - Google Patents

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Publication number
JP4926337B2
JP4926337B2 JP2001188140A JP2001188140A JP4926337B2 JP 4926337 B2 JP4926337 B2 JP 4926337B2 JP 2001188140 A JP2001188140 A JP 2001188140A JP 2001188140 A JP2001188140 A JP 2001188140A JP 4926337 B2 JP4926337 B2 JP 4926337B2
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JP
Japan
Prior art keywords
substrate
light emitting
emitting diode
recess
light source
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2001188140A
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English (en)
Japanese (ja)
Other versions
JP2002064226A (ja
JP2002064226A5 (https=
Inventor
ハック・ヒム・コーエイ
セオン・チョン・リム
チェン・ホワイ・タン
グービル・シン
チー・ケオン・チョン
スンダー・エイエル・ナタラヤン・ヨガナンダン
Original Assignee
アバゴ・テクノロジーズ・ジェネラル・アイピー（シンガポール）プライベート・リミテッド
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by アバゴ・テクノロジーズ・ジェネラル・アイピー（シンガポール）プライベート・リミテッド filed Critical アバゴ・テクノロジーズ・ジェネラル・アイピー（シンガポール）プライベート・リミテッド
Publication of JP2002064226A publication Critical patent/JP2002064226A/ja
Publication of JP2002064226A5 publication Critical patent/JP2002064226A5/ja
Application granted granted Critical
Publication of JP4926337B2 publication Critical patent/JP4926337B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Led Device Packages (AREA)
  • Transforming Electric Information Into Light Information (AREA)
JP2001188140A 2000-06-28 2001-06-21 光源 Expired - Fee Related JP4926337B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
MYPI20002918 2000-06-28
MYPI20002918 2000-06-28
MY20002918 2000-06-28

Publications (3)

Publication Number Publication Date
JP2002064226A JP2002064226A (ja) 2002-02-28
JP2002064226A5 JP2002064226A5 (https=) 2008-08-07
JP4926337B2 true JP4926337B2 (ja) 2012-05-09

Family

ID=19749463

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001188140A Expired - Fee Related JP4926337B2 (ja) 2000-06-28 2001-06-21 光源

Country Status (4)

Country Link
US (1) US6806583B2 (https=)
EP (1) EP1168461B1 (https=)
JP (1) JP4926337B2 (https=)
DE (1) DE60130520T2 (https=)

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ITMI20022467A1 (it) * 2002-11-20 2004-05-21 St Microelectronics Srl Processo per realizzare un transistore di selezione di byte per
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US7734168B2 (en) * 2003-01-21 2010-06-08 Fujifilm Corporation Lighting apparatus, electronic flash apparatus and camera
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US20040173808A1 (en) * 2003-03-07 2004-09-09 Bor-Jen Wu Flip-chip like light emitting device package
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US6995402B2 (en) * 2003-10-03 2006-02-07 Lumileds Lighting, U.S., Llc Integrated reflector cup for a light emitting device mount
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US7405433B2 (en) * 2005-02-22 2008-07-29 Avago Technologies Ecbu Ip Pte Ltd Semiconductor light emitting device
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US8044412B2 (en) 2006-01-20 2011-10-25 Taiwan Semiconductor Manufacturing Company, Ltd Package for a light emitting element
JP4654942B2 (ja) * 2006-02-28 2011-03-23 ミネベア株式会社 面状照明装置
KR20080032882A (ko) * 2006-10-11 2008-04-16 삼성전기주식회사 발광 다이오드 패키지
US20080246397A1 (en) * 2007-04-04 2008-10-09 Bily Wang Manufacturing method of white light led and structure thereof
DE102007043401A1 (de) * 2007-09-12 2009-03-19 Osram Gesellschaft mit beschränkter Haftung Leuchtvorrichtung und Verfahren zur Herstellung derselben
TWI401820B (zh) * 2007-11-07 2013-07-11 財團法人工業技術研究院 發光元件及其製作方法
US8946987B2 (en) 2007-11-07 2015-02-03 Industrial Technology Research Institute Light emitting device and fabricating method thereof
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US8598602B2 (en) 2009-01-12 2013-12-03 Cree, Inc. Light emitting device packages with improved heat transfer
US8309973B2 (en) * 2009-02-12 2012-11-13 Taiwan Semiconductor Manufacturing Company, Ltd. Silicon-based sub-mount for an opto-electronic device
US8860043B2 (en) * 2009-06-05 2014-10-14 Cree, Inc. Light emitting device packages, systems and methods
US9111778B2 (en) 2009-06-05 2015-08-18 Cree, Inc. Light emitting diode (LED) devices, systems, and methods
JP5612355B2 (ja) * 2009-07-15 2014-10-22 株式会社Ｋａｎｚａｃｃ メッキ構造及び電気材料の製造方法
US8101962B2 (en) * 2009-10-06 2012-01-24 Kuang Hong Precision Co., Ltd. Carrying structure of semiconductor
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US11101408B2 (en) 2011-02-07 2021-08-24 Creeled, Inc. Components and methods for light emitting diode (LED) lighting
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JP2014063967A (ja) * 2012-09-24 2014-04-10 Towa Corp 発光デバイス及びその製造方法、並びに発光デバイス成形用金型
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Also Published As

Publication number Publication date
DE60130520D1 (de) 2007-10-31
EP1168461B1 (en) 2007-09-19
EP1168461A3 (en) 2003-01-22
US20020047130A1 (en) 2002-04-25
JP2002064226A (ja) 2002-02-28
DE60130520T2 (de) 2008-06-26
US6806583B2 (en) 2004-10-19
EP1168461A2 (en) 2002-01-02

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