DE60128197D1 - Verbinden von piezoelektrischem Element und Elektrode für einen Mikroaktor - Google Patents

Verbinden von piezoelektrischem Element und Elektrode für einen Mikroaktor

Info

Publication number
DE60128197D1
DE60128197D1 DE60128197T DE60128197T DE60128197D1 DE 60128197 D1 DE60128197 D1 DE 60128197D1 DE 60128197 T DE60128197 T DE 60128197T DE 60128197 T DE60128197 T DE 60128197T DE 60128197 D1 DE60128197 D1 DE 60128197D1
Authority
DE
Germany
Prior art keywords
microactuator
electrode
piezoelectric element
connecting piezoelectric
piezoelectric
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE60128197T
Other languages
English (en)
Other versions
DE60128197T2 (de
Inventor
Masayuki Kitajima
Yutaka Noda
Seiichi Shimoura
Toru Okada
Masanao Fujii
Kenji Iketaki
Hidehiko Kobayashi
Masakazu Takesue
Keiichi Yamamoto
Hisao Tanaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Publication of DE60128197D1 publication Critical patent/DE60128197D1/de
Application granted granted Critical
Publication of DE60128197T2 publication Critical patent/DE60128197T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/48—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed
    • G11B5/54—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed with provision for moving the head into or out of its operative position or across tracks
    • G11B5/55—Track change, selection or acquisition by displacement of the head
    • G11B5/5521—Track change, selection or acquisition by displacement of the head across disk tracks
    • G11B5/5552—Track change, selection or acquisition by displacement of the head across disk tracks using fine positioning means for track acquisition separate from the coarse (e.g. track changing) positioning means
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/48—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed
    • G11B5/54—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed with provision for moving the head into or out of its operative position or across tracks
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/48—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed
    • G11B5/54—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed with provision for moving the head into or out of its operative position or across tracks
    • G11B5/55—Track change, selection or acquisition by displacement of the head
    • G11B5/5521—Track change, selection or acquisition by displacement of the head across disk tracks
    • G11B5/5552—Track change, selection or acquisition by displacement of the head across disk tracks using fine positioning means for track acquisition separate from the coarse (e.g. track changing) positioning means
    • G11B5/5556—Track change, selection or acquisition by displacement of the head across disk tracks using fine positioning means for track acquisition separate from the coarse (e.g. track changing) positioning means with track following after a "seek"
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/06—Forming electrodes or interconnections, e.g. leads or terminals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/20—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators
    • H10N30/208—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators using shear or torsion displacement, e.g. d15 type devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H01L2924/01327—Intermediate phases, i.e. intermetallics compounds
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/42—Piezoelectric device making
DE2001628197 2000-11-02 2001-10-22 Verbinden von piezoelektrischem Element und Elektrode für einen Mikroaktor Expired - Fee Related DE60128197T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2000335867 2000-11-02
JP2000335867A JP2002141576A (ja) 2000-11-02 2000-11-02 ピエゾ素子と電極との接合方法及び該接合方法を使用したピエゾマイクロアクチュエータ

Publications (2)

Publication Number Publication Date
DE60128197D1 true DE60128197D1 (de) 2007-06-14
DE60128197T2 DE60128197T2 (de) 2007-08-23

Family

ID=18811538

Family Applications (1)

Application Number Title Priority Date Filing Date
DE2001628197 Expired - Fee Related DE60128197T2 (de) 2000-11-02 2001-10-22 Verbinden von piezoelektrischem Element und Elektrode für einen Mikroaktor

Country Status (5)

Country Link
US (2) US6541898B2 (de)
EP (1) EP1204153B1 (de)
JP (1) JP2002141576A (de)
KR (1) KR20020034834A (de)
DE (1) DE60128197T2 (de)

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US8085508B2 (en) * 2008-03-28 2011-12-27 Hitachi Global Storage Technologies Netherlands B.V. System, method and apparatus for flexure-integrated microactuator
WO2009157930A1 (en) * 2008-06-26 2009-12-30 Michelin Recherche Et Technique, S.A. Sandwich piezoelectric device with solid copper electrode
US8189301B2 (en) * 2009-04-24 2012-05-29 Magnecomp Corporation Wireless microactuator motor assembly for use in a hard disk drive suspension, and mechanical and electrical connections thereto
JP5416278B2 (ja) * 2009-07-27 2014-02-12 シーティーエス・コーポレーション カプセル型セラミック素子の製作方法
WO2011103113A1 (en) * 2010-02-22 2011-08-25 Cts Corporation Composite ceramic structure and method of making the same
JP2014106993A (ja) * 2012-11-28 2014-06-09 Dainippon Printing Co Ltd サスペンション用基板、サスペンション、ヘッド付サスペンション、ハードディスクドライブ、サスペンション用基板の製造方法及びアクチュエータ素子の実装方法
JP6307832B2 (ja) * 2013-01-22 2018-04-11 三菱マテリアル株式会社 パワーモジュール用基板、ヒートシンク付パワーモジュール用基板、ヒートシンク付パワーモジュール
JP2015076107A (ja) * 2013-10-07 2015-04-20 大日本印刷株式会社 サスペンション用基板、サスペンション、ヘッド付サスペンションおよびハードディスクドライブ
JP6160916B2 (ja) * 2013-10-21 2017-07-12 大日本印刷株式会社 サスペンション用基板、サスペンション、ヘッド付サスペンションおよびハードディスクドライブ
KR102104061B1 (ko) 2013-11-15 2020-04-23 삼성전자 주식회사 금속 패턴 및 압전 패턴을 포함하는 반도체 소자
JP6464855B2 (ja) * 2015-03-20 2019-02-06 Tdk株式会社 磁気ヘッド装置
WO2020194026A1 (en) 2019-03-23 2020-10-01 Secretary, Department Of Atomic Energy Diffusion bonding of piezoelectric crystal to metal wear plate
CN110137338B (zh) * 2019-04-02 2023-05-02 苏州诺莱声科技有限公司 一种压电元件引线焊接方法及具有引脚的压电元件
CN111257995A (zh) * 2020-02-12 2020-06-09 深圳技术大学 一种高折射率差yag单晶异质结构薄膜波导及其制备方法
AT523895B1 (de) 2020-06-10 2023-06-15 Ac2T Res Gmbh Triboakustischer Sensor, dessen Herstellverfahren, Messverfahren und Verwendung

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Also Published As

Publication number Publication date
JP2002141576A (ja) 2002-05-17
EP1204153A2 (de) 2002-05-08
US6744183B2 (en) 2004-06-01
EP1204153B1 (de) 2007-05-02
EP1204153A3 (de) 2005-02-16
US6541898B2 (en) 2003-04-01
US20030137223A1 (en) 2003-07-24
US20020074902A1 (en) 2002-06-20
KR20020034834A (ko) 2002-05-09
DE60128197T2 (de) 2007-08-23

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8339 Ceased/non-payment of the annual fee