DE60120036D1 - Verfahren zur Herstellung von Metallpulver durch thermischer Zersetzung - Google Patents
Verfahren zur Herstellung von Metallpulver durch thermischer ZersetzungInfo
- Publication number
- DE60120036D1 DE60120036D1 DE60120036T DE60120036T DE60120036D1 DE 60120036 D1 DE60120036 D1 DE 60120036D1 DE 60120036 T DE60120036 T DE 60120036T DE 60120036 T DE60120036 T DE 60120036T DE 60120036 D1 DE60120036 D1 DE 60120036D1
- Authority
- DE
- Germany
- Prior art keywords
- metal compound
- powder
- metal
- compound powder
- metal powder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F9/00—Making metallic powder or suspensions thereof
- B22F9/16—Making metallic powder or suspensions thereof using chemical processes
- B22F9/30—Making metallic powder or suspensions thereof using chemical processes with decomposition of metal compounds, e.g. by pyrolysis
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
- H01L23/49883—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials the conductive materials containing organic materials or pastes, e.g. for thick films
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000133576 | 2000-05-02 | ||
JP2000133576 | 2000-05-02 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE60120036D1 true DE60120036D1 (de) | 2006-07-06 |
DE60120036T2 DE60120036T2 (de) | 2006-11-02 |
Family
ID=18642044
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60120036T Expired - Lifetime DE60120036T2 (de) | 2000-05-02 | 2001-04-26 | Verfahren zur Herstellung von Metallpulver durch thermischer Zersetzung |
Country Status (10)
Country | Link |
---|---|
US (2) | US6530972B2 (de) |
EP (1) | EP1151817B1 (de) |
KR (2) | KR100481783B1 (de) |
CN (1) | CN1166476C (de) |
AT (1) | ATE327852T1 (de) |
CA (1) | CA2345804C (de) |
DE (1) | DE60120036T2 (de) |
MY (1) | MY131753A (de) |
SG (1) | SG94805A1 (de) |
TW (1) | TW506869B (de) |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
SG94805A1 (en) * | 2000-05-02 | 2003-03-18 | Shoei Chemical Ind Co | Method for preparing metal powder |
US6679938B1 (en) * | 2001-01-26 | 2004-01-20 | University Of Maryland | Method of producing metal particles by spray pyrolysis using a co-solvent and apparatus therefor |
JP3772967B2 (ja) * | 2001-05-30 | 2006-05-10 | Tdk株式会社 | 磁性金属粉末の製造方法 |
CA2359347A1 (en) | 2001-10-18 | 2003-04-18 | Cesur Celik | Laminated ceramic capacitor internal electrode material |
US7416697B2 (en) | 2002-06-14 | 2008-08-26 | General Electric Company | Method for preparing a metallic article having an other additive constituent, without any melting |
JP4186529B2 (ja) * | 2002-07-09 | 2008-11-26 | 昭栄化学工業株式会社 | 高結晶性複酸化物粉末の製造方法 |
JP3812523B2 (ja) * | 2002-09-10 | 2006-08-23 | 昭栄化学工業株式会社 | 金属粉末の製造方法 |
US7510680B2 (en) * | 2002-12-13 | 2009-03-31 | General Electric Company | Method for producing a metallic alloy by dissolution, oxidation and chemical reduction |
US7531021B2 (en) | 2004-11-12 | 2009-05-12 | General Electric Company | Article having a dispersion of ultrafine titanium boride particles in a titanium-base matrix |
TWI381897B (zh) * | 2004-12-22 | 2013-01-11 | Taiyo Nippon Sanso Corp | 金屬超微粉之製造方法 |
GB2432582A (en) * | 2005-11-18 | 2007-05-30 | Pains Wessex Ltd | Decoy countermeasure |
JP4978237B2 (ja) * | 2006-04-27 | 2012-07-18 | 昭栄化学工業株式会社 | ニッケル粉末の製造方法 |
JP4807581B2 (ja) * | 2007-03-12 | 2011-11-02 | 昭栄化学工業株式会社 | ニッケル粉末、その製造方法、導体ペーストおよびそれを用いた積層セラミック電子部品 |
JP5679204B2 (ja) * | 2011-09-02 | 2015-03-04 | 昭栄化学工業株式会社 | 金属粉末の製造方法、それにより製造された金属粉末、導体ペースト、セラミック積層電子部品 |
CN102528075B (zh) * | 2012-03-15 | 2013-12-18 | 中南大学 | 以硝酸银直接热分解制备超细银粉的方法 |
JP5668879B1 (ja) * | 2014-03-07 | 2015-02-12 | 住友金属鉱山株式会社 | ニッケル粉末 |
CN109305917B (zh) * | 2017-07-28 | 2021-11-12 | 中国石油化工股份有限公司 | 一种卤代苯胺的合成方法 |
CN108526490B (zh) * | 2018-05-14 | 2021-05-25 | 六盘水中联工贸实业有限公司 | 一种用氯化铜或氯化亚铜生产金属铜粉的方法 |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0623405B2 (ja) * | 1985-09-17 | 1994-03-30 | 川崎製鉄株式会社 | 球状銅微粉の製造方法 |
JPS6331522A (ja) | 1986-07-25 | 1988-02-10 | Kao Corp | 吸湿剤 |
JPH01171601A (ja) * | 1987-12-26 | 1989-07-06 | Kyocera Corp | 液体蒸発装置 |
US5853451A (en) * | 1990-06-12 | 1998-12-29 | Kawasaki Steel Corporation | Ultrafine spherical nickel powder for use as an electrode of laminated ceramic capacitors |
US5250101A (en) * | 1991-04-08 | 1993-10-05 | Mitsubishi Gas Chemical Company, Inc. | Process for the production of fine powder |
TW256798B (de) * | 1992-10-05 | 1995-09-11 | Du Pont | |
TW261554B (de) * | 1992-10-05 | 1995-11-01 | Du Pont | |
US5429657A (en) * | 1994-01-05 | 1995-07-04 | E. I. Du Pont De Nemours And Company | Method for making silver-palladium alloy powders by aerosol decomposition |
AT403775B (de) | 1995-10-31 | 1998-05-25 | Plansee Ag | Verfahren zur reduktion von metallverbindungen |
DE19545455C1 (de) * | 1995-12-06 | 1997-01-23 | Degussa | Verfahren zur Herstellung von Edelmetallpulvern |
JP3277823B2 (ja) * | 1996-09-25 | 2002-04-22 | 昭栄化学工業株式会社 | 金属粉末の製造方法 |
US6159267A (en) * | 1997-02-24 | 2000-12-12 | Superior Micropowders Llc | Palladium-containing particles, method and apparatus of manufacture, palladium-containing devices made therefrom |
US6316100B1 (en) * | 1997-02-24 | 2001-11-13 | Superior Micropowders Llc | Nickel powders, methods for producing powders and devices fabricated from same |
US6159620A (en) * | 1997-03-31 | 2000-12-12 | The Regents Of The University Of California | Single-electron solid state electronic device |
US5928405A (en) * | 1997-05-21 | 1999-07-27 | Degussa Corporation | Method of making metallic powders by aerosol thermolysis |
JP3475749B2 (ja) * | 1997-10-17 | 2003-12-08 | 昭栄化学工業株式会社 | ニッケル粉末及びその製造方法 |
US6090179A (en) * | 1998-07-30 | 2000-07-18 | Remptech Ltd. | Process for manufacturing of metallic power |
SG94805A1 (en) * | 2000-05-02 | 2003-03-18 | Shoei Chemical Ind Co | Method for preparing metal powder |
-
2001
- 2001-04-12 SG SG200102116A patent/SG94805A1/en unknown
- 2001-04-17 US US09/836,766 patent/US6530972B2/en not_active Expired - Lifetime
- 2001-04-18 MY MYPI20011853A patent/MY131753A/en unknown
- 2001-04-26 CA CA002345804A patent/CA2345804C/en not_active Expired - Lifetime
- 2001-04-26 EP EP01110030A patent/EP1151817B1/de not_active Expired - Lifetime
- 2001-04-26 AT AT01110030T patent/ATE327852T1/de active
- 2001-04-26 DE DE60120036T patent/DE60120036T2/de not_active Expired - Lifetime
- 2001-04-27 KR KR10-2001-0022891A patent/KR100481783B1/ko active IP Right Grant
- 2001-04-30 TW TW090110277A patent/TW506869B/zh not_active IP Right Cessation
- 2001-04-30 CN CNB011167866A patent/CN1166476C/zh not_active Expired - Lifetime
-
2003
- 2003-01-14 US US10/341,952 patent/US20030131687A1/en not_active Abandoned
- 2003-06-27 KR KR10-2003-0042386A patent/KR100414552B1/ko active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
ATE327852T1 (de) | 2006-06-15 |
KR100481783B1 (ko) | 2005-04-11 |
KR20010100920A (ko) | 2001-11-14 |
CA2345804A1 (en) | 2001-11-02 |
US6530972B2 (en) | 2003-03-11 |
EP1151817B1 (de) | 2006-05-31 |
US20030131687A1 (en) | 2003-07-17 |
MY131753A (en) | 2007-08-30 |
CN1323671A (zh) | 2001-11-28 |
CN1166476C (zh) | 2004-09-15 |
DE60120036T2 (de) | 2006-11-02 |
KR20030060856A (ko) | 2003-07-16 |
EP1151817A3 (de) | 2005-03-09 |
US20020000137A1 (en) | 2002-01-03 |
TW506869B (en) | 2002-10-21 |
KR100414552B1 (ko) | 2004-01-07 |
SG94805A1 (en) | 2003-03-18 |
CA2345804C (en) | 2003-11-25 |
EP1151817A2 (de) | 2001-11-07 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |