DE60116970D1 - Struktur zum Bonden von optischen Elementen - Google Patents
Struktur zum Bonden von optischen ElementenInfo
- Publication number
- DE60116970D1 DE60116970D1 DE60116970T DE60116970T DE60116970D1 DE 60116970 D1 DE60116970 D1 DE 60116970D1 DE 60116970 T DE60116970 T DE 60116970T DE 60116970 T DE60116970 T DE 60116970T DE 60116970 D1 DE60116970 D1 DE 60116970D1
- Authority
- DE
- Germany
- Prior art keywords
- optical elements
- bonding optical
- bonding
- elements
- optical
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4236—Fixing or mounting methods of the aligned elements
- G02B6/4239—Adhesive bonding; Encapsulation with polymer material
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4228—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements
- G02B6/423—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements using guiding surfaces for the alignment
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4234—Passive alignment along the optical axis and active alignment perpendicular to the optical axis
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/26—Optical coupling means
- G02B6/30—Optical coupling means for use between fibre and thin-film device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/2612—Auxiliary members for layer connectors, e.g. spacers
- H01L2224/26152—Auxiliary members for layer connectors, e.g. spacers being formed on an item to be connected not being a semiconductor or solid-state body
- H01L2224/26175—Flow barriers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Optical Couplings Of Light Guides (AREA)
- Semiconductor Lasers (AREA)
- Optical Modulation, Optical Deflection, Nonlinear Optics, Optical Demodulation, Optical Logic Elements (AREA)
- Mounting And Adjusting Of Optical Elements (AREA)
- Light Receiving Elements (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000298844 | 2000-09-29 | ||
JP2000298844A JP4450965B2 (ja) | 2000-09-29 | 2000-09-29 | 光学部品の接着構造 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE60116970D1 true DE60116970D1 (de) | 2006-04-13 |
DE60116970T2 DE60116970T2 (de) | 2006-09-21 |
Family
ID=18780746
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60116970T Expired - Lifetime DE60116970T2 (de) | 2000-09-29 | 2001-09-28 | Struktur zum Bonden von optischen Elementen |
Country Status (4)
Country | Link |
---|---|
US (1) | US6640032B2 (de) |
EP (1) | EP1193517B1 (de) |
JP (1) | JP4450965B2 (de) |
DE (1) | DE60116970T2 (de) |
Families Citing this family (38)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW594119B (en) * | 2001-12-21 | 2004-06-21 | Au Optronics Corp | Backlight module for thin film transistor liquid crystal display |
US20030135552A1 (en) * | 2002-01-14 | 2003-07-17 | Blackstock Michael A. | Method for discovering and discriminating devices on local collaborative networks to facilitate collaboration among users |
JP4512330B2 (ja) * | 2002-07-12 | 2010-07-28 | 株式会社リコー | 複合光学素子、及び光トランシーバー |
US7494286B2 (en) * | 2002-11-12 | 2009-02-24 | Panasonic Corporation | Laser module and method for manufacturing the same |
JP4219677B2 (ja) * | 2002-12-26 | 2009-02-04 | 株式会社リコー | 光学装置の製造方法 |
JP3698147B2 (ja) * | 2003-04-22 | 2005-09-21 | セイコーエプソン株式会社 | 実装ケース入り電気光学装置及び投射型表示装置並びに実装ケース |
DE102004038093A1 (de) * | 2004-05-28 | 2005-12-22 | Osram Opto Semiconductors Gmbh | Anordnung eines mikrooptischen Bauelements auf einem Substrat, Verfahren zur Justierung der Anordnung und optisches System mit der Anordnung |
JP4683916B2 (ja) * | 2004-06-29 | 2011-05-18 | 京セラ株式会社 | 光アイソレータ |
KR100637929B1 (ko) * | 2004-11-03 | 2006-10-24 | 한국전자통신연구원 | 하이브리드형 광소자 |
US20060192328A1 (en) * | 2004-12-16 | 2006-08-31 | Carl Zeiss Smt Ag | Composite body |
JP2006303122A (ja) * | 2005-04-19 | 2006-11-02 | Citizen Electronics Co Ltd | チップ型led |
JP2007027398A (ja) * | 2005-07-15 | 2007-02-01 | Fuji Xerox Co Ltd | 光学部品実装用サブマウント、及び光送受信モジュール |
JP4855152B2 (ja) * | 2006-06-09 | 2012-01-18 | 日本電信電話株式会社 | 光半導体サブモジュールおよび光半導体サブモジュール製造方法 |
JP4846515B2 (ja) * | 2006-10-18 | 2011-12-28 | 株式会社東芝 | 光半導体装置及び光半導体装置の製造方法 |
JP2008170528A (ja) * | 2007-01-09 | 2008-07-24 | Fujitsu Ltd | 光モジュール及びその製造方法 |
US20080260330A1 (en) * | 2007-04-19 | 2008-10-23 | Em4, Inc. | Alignment with thin bonding layer of optical components |
JP4576438B2 (ja) * | 2008-03-14 | 2010-11-10 | 日本碍子株式会社 | 高調波発生素子の製造方法 |
JP2010008901A (ja) * | 2008-06-30 | 2010-01-14 | Fujitsu Ltd | 光学部品の接着面構造 |
JP5310660B2 (ja) * | 2010-07-01 | 2013-10-09 | 富士電機株式会社 | 半導体装置 |
JP2012034070A (ja) * | 2010-07-29 | 2012-02-16 | Casio Comput Co Ltd | 基板の接着方法、基板の実装構造、電子機器、及び基板 |
JP5351850B2 (ja) * | 2010-07-30 | 2013-11-27 | 日立電線株式会社 | 光モジュール |
DE102010041576B4 (de) | 2010-09-29 | 2015-02-26 | Carl Zeiss Smt Gmbh | Verfahren zum Verbinden von Körpern, Verbundkörper sowie dessen Verwendung |
CN102087399B (zh) * | 2010-12-30 | 2012-09-19 | 中国科学院长春光学精密机械与物理研究所 | 一种棱镜的固定方法 |
DE102011114641B4 (de) * | 2011-09-30 | 2021-08-12 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Optoelektronisches Halbleiterbauelement und Verfahren zur Herstellung eines optoelektronischen Halbleiterbauelements |
CN103035482B (zh) * | 2012-08-15 | 2016-04-13 | 上海华虹宏力半导体制造有限公司 | 硅片的临时键合方法 |
US9243784B2 (en) | 2012-12-20 | 2016-01-26 | International Business Machines Corporation | Semiconductor photonic package |
JP5811111B2 (ja) * | 2013-01-31 | 2015-11-11 | 住友大阪セメント株式会社 | 光変調器 |
US9400356B2 (en) | 2013-03-14 | 2016-07-26 | International Business Machines Corporation | Fiber pigtail with integrated lid |
US9656439B2 (en) * | 2013-07-10 | 2017-05-23 | Lumentum Operations Llc | Assembly of components having different coefficients of thermal expansion |
ES2837798T3 (es) * | 2013-11-29 | 2021-07-01 | Zeiss Carl Vision Int Gmbh | Procedimiento para fabricar una lente para gafas y lente para gafas |
KR102179088B1 (ko) * | 2013-12-12 | 2020-11-18 | 메스 메디컬 일렉트로닉 시스템즈 리미티드 | 홈 테스팅 장치 |
US9285542B2 (en) * | 2014-07-09 | 2016-03-15 | International Business Machines Corporation | Fiber optic interface with adhesive fill system |
EP3373055A1 (de) * | 2017-03-10 | 2018-09-12 | Siemens Aktiengesellschaft | Elektrooptische schaltung mit einer optischen übertragungsstrecke, elektrooptische baugruppe zum einbau in eine solche elektrooptische schaltung und verfahren zum erzeugen einer optischen schnittstelle einer elektrooptischen schaltung |
KR102462487B1 (ko) * | 2017-12-28 | 2022-11-02 | 엘지디스플레이 주식회사 | 백라이트 유닛 및 액정표시장치 |
JP7103059B2 (ja) * | 2018-08-24 | 2022-07-20 | 日本電信電話株式会社 | 光モジュール |
US11686906B1 (en) * | 2020-10-12 | 2023-06-27 | Poet Technologies, Inc. | Self-aligned structure and method on interposer-based PIC |
CN116368700A (zh) * | 2020-11-26 | 2023-06-30 | 松下知识产权经营株式会社 | 激光模块 |
CN114810761B (zh) * | 2021-03-26 | 2024-01-26 | 郑州思昆生物工程有限公司 | 一种荧光显微成像系统及其安装方法、粘接结构 |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59159110A (ja) * | 1983-02-28 | 1984-09-08 | Sumitomo Electric Ind Ltd | 光学部品の接着構造 |
JPS60217281A (ja) * | 1984-04-12 | 1985-10-30 | Nippon Pillar Packing Co Ltd | 接着部の剥離防止方法 |
US4857130A (en) | 1987-12-03 | 1989-08-15 | Hughes Aircraft Company | Temperature stable optical bonding method and apparatus obtained thereby |
US5119452A (en) * | 1989-06-13 | 1992-06-02 | Ricoh Company, Ltd. | High efficiency prism coupling device and method for producing the same |
JPH04125445U (ja) * | 1991-04-26 | 1992-11-16 | 沖電気工業株式会社 | 試料貼付台 |
JP2762792B2 (ja) * | 1991-08-30 | 1998-06-04 | 日本電気株式会社 | 光半導体装置 |
JPH06201936A (ja) * | 1992-12-28 | 1994-07-22 | Matsushita Electric Ind Co Ltd | 光ファイバアレイ及びその製造方法 |
JP3129028B2 (ja) * | 1993-05-28 | 2001-01-29 | 松下電器産業株式会社 | 短波長レーザ光源 |
DE4424013C1 (de) * | 1994-07-08 | 1995-07-13 | Ant Nachrichtentech | Verfahren und Anordnung zum Befüllen von Vertiefungen mit einer Flüssigkeit, insbesondere mit einem Kleber |
JP3853866B2 (ja) | 1995-02-21 | 2006-12-06 | 日本碍子株式会社 | 光ファイバー固定用基板 |
JPH08335744A (ja) * | 1995-06-06 | 1996-12-17 | Hitachi Ltd | 光半導体モジュール及びその組み立て方法 |
US5669997A (en) | 1995-07-13 | 1997-09-23 | Hughes Danbury Optical Systems, Inc. | Method of bonding optical members together |
JPH10213717A (ja) * | 1997-01-13 | 1998-08-11 | Sumitomo Electric Ind Ltd | 光導波路モジュール及びその製造方法 |
JP3570882B2 (ja) * | 1997-03-13 | 2004-09-29 | 日本電信電話株式会社 | 光素子実装基板、該実装基板を用いた光モジュール、およびそれらの製造方法 |
DE19964228B4 (de) | 1998-09-08 | 2008-11-13 | Fujitsu Ltd., Kawasaki | Verfahren zur Herstellung eines Reflexionsfilms und Herstellung optischer Vorrichtungen die einen Reflexionsfilm verwenden |
JP2000249874A (ja) * | 1999-02-25 | 2000-09-14 | Nhk Spring Co Ltd | 光送受信モジュール |
JP2000275488A (ja) * | 1999-03-25 | 2000-10-06 | Fuji Photo Film Co Ltd | 光学部材固定方法及び光学部材の支持部材 |
US6467972B2 (en) * | 2000-02-29 | 2002-10-22 | Kyocera Corporation | Optical interconnection module |
JP2001242363A (ja) | 2000-03-01 | 2001-09-07 | Ngk Insulators Ltd | 光学部品の接着構造 |
-
2000
- 2000-09-29 JP JP2000298844A patent/JP4450965B2/ja not_active Expired - Lifetime
-
2001
- 2001-09-24 US US09/961,786 patent/US6640032B2/en not_active Expired - Lifetime
- 2001-09-28 DE DE60116970T patent/DE60116970T2/de not_active Expired - Lifetime
- 2001-09-28 EP EP01308297A patent/EP1193517B1/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JP4450965B2 (ja) | 2010-04-14 |
US6640032B2 (en) | 2003-10-28 |
EP1193517A3 (de) | 2003-07-02 |
EP1193517A2 (de) | 2002-04-03 |
US20020114577A1 (en) | 2002-08-22 |
DE60116970T2 (de) | 2006-09-21 |
JP2002107594A (ja) | 2002-04-10 |
EP1193517B1 (de) | 2006-02-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |