DE60233089D1 - Vertikale Waferhaltevorrichtung - Google Patents

Vertikale Waferhaltevorrichtung

Info

Publication number
DE60233089D1
DE60233089D1 DE60233089T DE60233089T DE60233089D1 DE 60233089 D1 DE60233089 D1 DE 60233089D1 DE 60233089 T DE60233089 T DE 60233089T DE 60233089 T DE60233089 T DE 60233089T DE 60233089 D1 DE60233089 D1 DE 60233089D1
Authority
DE
Germany
Prior art keywords
wafer holder
vertical wafer
vertical
holder
wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60233089T
Other languages
English (en)
Inventor
Itsuo Araki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Heraeus Quarzglas GmbH and Co KG
Shin Etsu Quartz Products Co Ltd
Original Assignee
Heraeus Quarzglas GmbH and Co KG
Shin Etsu Quartz Products Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Heraeus Quarzglas GmbH and Co KG, Shin Etsu Quartz Products Co Ltd filed Critical Heraeus Quarzglas GmbH and Co KG
Application granted granted Critical
Publication of DE60233089D1 publication Critical patent/DE60233089D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67303—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements
    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B31/00—Diffusion or doping processes for single crystals or homogeneous polycrystalline material with defined structure; Apparatus therefor
    • C30B31/06—Diffusion or doping processes for single crystals or homogeneous polycrystalline material with defined structure; Apparatus therefor by contacting with diffusion material in the gaseous state
    • C30B31/14—Substrate holders or susceptors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67303—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements
    • H01L21/67309—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements characterized by the substrate support

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
DE60233089T 2001-05-11 2002-05-07 Vertikale Waferhaltevorrichtung Expired - Lifetime DE60233089D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001141379A JP4467028B2 (ja) 2001-05-11 2001-05-11 縦型ウェーハ支持治具

Publications (1)

Publication Number Publication Date
DE60233089D1 true DE60233089D1 (de) 2009-09-10

Family

ID=18987846

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60233089T Expired - Lifetime DE60233089D1 (de) 2001-05-11 2002-05-07 Vertikale Waferhaltevorrichtung

Country Status (4)

Country Link
US (1) US6796439B2 (de)
EP (1) EP1256975B1 (de)
JP (1) JP4467028B2 (de)
DE (1) DE60233089D1 (de)

Families Citing this family (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3377996B1 (ja) * 2001-12-27 2003-02-17 東京エレクトロン株式会社 熱処理用ボート及び縦型熱処理装置
TW553195U (en) * 2002-10-09 2003-09-11 Foxsemicon Integrated Tech Inc Substrate supporting slot plate and substrate cassette using the same
KR100492977B1 (ko) * 2002-12-12 2005-06-07 삼성전자주식회사 다공성 실리카 박막의 소결을 위한 웨이퍼 보트
JP4506125B2 (ja) * 2003-07-16 2010-07-21 信越半導体株式会社 熱処理用縦型ボート及びその製造方法
US7329947B2 (en) * 2003-11-07 2008-02-12 Sumitomo Mitsubishi Silicon Corporation Heat treatment jig for semiconductor substrate
KR100549273B1 (ko) * 2004-01-15 2006-02-03 주식회사 테라세미콘 반도체 제조장치의 기판홀더
US20070275570A1 (en) * 2004-01-20 2007-11-29 Hitachi Kokusai Electric Inc. Heat Treatment Apparatus
DE202004005378U1 (de) * 2004-04-03 2004-07-01 Heraeus Quarzglas Gmbh & Co. Kg Trägerhorde aus Quarzglas für die Aufnahme von scheibenförmigen Substraten aus Halbleiterwerkstoff
JP4534619B2 (ja) * 2004-06-21 2010-09-01 株式会社Ｓｕｍｃｏ 半導体シリコン基板用熱処理治具
KR100852975B1 (ko) * 2004-08-06 2008-08-19 가부시키가이샤 히다치 고쿠사이 덴키 열처리 장치 및 기판의 제조 방법
US7033168B1 (en) * 2005-01-24 2006-04-25 Memc Electronic Materials, Inc. Semiconductor wafer boat for a vertical furnace
JP2008186950A (ja) * 2007-01-29 2008-08-14 Asahi Glass Co Ltd 熱処理用治具の形状測定方法及びその装置
TWI361469B (en) * 2007-03-09 2012-04-01 Rohm & Haas Elect Mat Chemical vapor deposited silicon carbide articles
US20090071918A1 (en) * 2007-09-18 2009-03-19 Panchapakesan Ramanarayanan Vertical semiconductor wafer carrier
US20090162183A1 (en) * 2007-12-19 2009-06-25 Peter Davison Full-contact ring for a large wafer
JP5071217B2 (ja) * 2008-04-17 2012-11-14 信越半導体株式会社 縦型熱処理用ボートおよびそれを用いたシリコンウエーハの熱処理方法
JP5042950B2 (ja) * 2008-09-05 2012-10-03 東京エレクトロン株式会社 縦型熱処理装置及び基板支持具
CN102257165A (zh) * 2008-12-17 2011-11-23 本田技研工业株式会社 运送夹具、制造运送夹具的方法和采用运送夹具热处理金属环的方法
JP5565242B2 (ja) * 2010-09-29 2014-08-06 東京エレクトロン株式会社 縦型熱処理装置
US9530675B2 (en) * 2012-09-19 2016-12-27 Stmicroelectronics Pte Ltd Wafer handling station including cassette members with lateral wafer confining brackets and associated methods
TWD161688S (zh) * 2012-12-27 2014-07-11 日立國際電氣股份有限公司 半導體製造裝置用晶舟
TWD163542S (zh) * 2013-03-22 2014-10-11 日立國際電氣股份有限公司 基板處理裝置用晶舟
TWD166332S (zh) * 2013-03-22 2015-03-01 日立國際電氣股份有限公司 基板處理裝置用晶舟之部分
US10190235B2 (en) * 2013-05-24 2019-01-29 Taiwan Semiconductor Manufacturing Company, Ltd. Wafer supporting structure and method for forming the same
KR20150110207A (ko) * 2014-03-24 2015-10-02 주식회사 테라세미콘 보트
JP1537313S (de) * 2014-11-20 2015-11-09
JP1537312S (de) * 2014-11-20 2015-11-09
JP1537630S (de) * 2014-11-20 2015-11-09
JP1563649S (de) * 2016-02-12 2016-11-21
USD847105S1 (en) * 2018-05-03 2019-04-30 Kokusai Electric Corporation Boat of substrate processing apparatus
USD846514S1 (en) * 2018-05-03 2019-04-23 Kokusai Electric Corporation Boat of substrate processing apparatus
USD908103S1 (en) * 2019-02-20 2021-01-19 Veeco Instruments Inc. Transportable semiconductor wafer rack
USD908102S1 (en) * 2019-02-20 2021-01-19 Veeco Instruments Inc. Transportable semiconductor wafer rack
JP7245071B2 (ja) * 2019-02-21 2023-03-23 株式会社ジェイテクトサーモシステム 基板支持装置
CN111312637B (zh) * 2020-02-28 2023-03-21 北京北方华创微电子装备有限公司 一种晶片承载装置和立式扩散炉
CN111576924A (zh) * 2020-06-21 2020-08-25 厉小勇 一种楼板高度控制器
JP1700777S (de) * 2021-03-15 2021-11-29

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS512161U (de) * 1974-06-24 1976-01-09
US4228902A (en) * 1979-02-21 1980-10-21 Kasper Instruments, Inc. Carrier for semiconductive wafers
US4407654A (en) * 1982-01-21 1983-10-04 The Potters Supply Company Handling and support system for kiln fired ware
US5310339A (en) * 1990-09-26 1994-05-10 Tokyo Electron Limited Heat treatment apparatus having a wafer boat
JP2564640Y2 (ja) 1992-01-31 1998-03-09 信越石英株式会社 縦型ウエーハ収納治具
JPH0645332A (ja) 1992-07-22 1994-02-18 Nec Corp 半導体装置の製造方法
US5458688A (en) * 1993-03-09 1995-10-17 Tokyo Electron Kabushiki Kaisha Heat treatment boat
TW323633U (en) * 1995-09-07 1997-12-21 Samsung Electronics Co Ltd Cassette for loading glasses for liquid crystal display device
KR0155930B1 (ko) * 1995-11-28 1998-12-01 김광호 종형확산로의 보우트-바
KR970053327A (ko) * 1995-12-29 1997-07-31 김광호 크리닝 챔버의 웨이퍼 홀더
JP3122364B2 (ja) * 1996-02-06 2001-01-09 東京エレクトロン株式会社 ウエハボート
EP0884769A1 (de) * 1996-02-29 1998-12-16 Tokyo Electron Limited Wärme behandlungshalter für halbleiterscheiben
JP3388668B2 (ja) 1996-02-29 2003-03-24 東京エレクトロン株式会社 熱処理用ボ−ト及び縦型熱処理装置
TW298337U (en) * 1996-08-19 1997-02-11 guo-min Gao Tilting-type stackable CD rack
JP3212890B2 (ja) * 1996-10-15 2001-09-25 九州日本電気株式会社 ウェハキャリア
KR20000002833A (ko) * 1998-06-23 2000-01-15 윤종용 반도체 웨이퍼 보트
US6171400B1 (en) * 1998-10-02 2001-01-09 Union Oil Company Of California Vertical semiconductor wafer carrier
US6378538B1 (en) * 1999-12-13 2002-04-30 Advanced Micro Devices, Inc. Durable, multi-piece rotor for spray acid tools
US6287112B1 (en) * 2000-03-30 2001-09-11 Asm International, N.V. Wafer boat

Also Published As

Publication number Publication date
JP2002343730A (ja) 2002-11-29
EP1256975A2 (de) 2002-11-13
EP1256975A3 (de) 2003-01-08
US20020187023A1 (en) 2002-12-12
US6796439B2 (en) 2004-09-28
EP1256975B1 (de) 2009-07-29
JP4467028B2 (ja) 2010-05-26

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