DE60238291D1 - Wafer-Haltevorrichtung - Google Patents

Wafer-Haltevorrichtung

Info

Publication number
DE60238291D1
DE60238291D1 DE60238291T DE60238291T DE60238291D1 DE 60238291 D1 DE60238291 D1 DE 60238291D1 DE 60238291 T DE60238291 T DE 60238291T DE 60238291 T DE60238291 T DE 60238291T DE 60238291 D1 DE60238291 D1 DE 60238291D1
Authority
DE
Germany
Prior art keywords
wafer stage
wafer
stage
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60238291T
Other languages
English (en)
Inventor
Ikuo Noguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Topcon Corp
Original Assignee
Topcon Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Topcon Corp filed Critical Topcon Corp
Application granted granted Critical
Publication of DE60238291D1 publication Critical patent/DE60238291D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T279/00—Chucks or sockets
    • Y10T279/18—Pivoted jaw

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
DE60238291T 2001-04-23 2002-04-17 Wafer-Haltevorrichtung Expired - Lifetime DE60238291D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001125137A JP4488646B2 (ja) 2001-04-23 2001-04-23 ウェーハ保持装置

Publications (1)

Publication Number Publication Date
DE60238291D1 true DE60238291D1 (de) 2010-12-30

Family

ID=18974410

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60238291T Expired - Lifetime DE60238291D1 (de) 2001-04-23 2002-04-17 Wafer-Haltevorrichtung

Country Status (4)

Country Link
US (1) US6761362B2 (de)
EP (1) EP1253633B1 (de)
JP (1) JP4488646B2 (de)
DE (1) DE60238291D1 (de)

Families Citing this family (49)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6752442B2 (en) * 2001-11-09 2004-06-22 Speedfam-Ipec Corporation Workpiece handling end-effector and a method for processing workpieces using a workpiece handling end-effector
US7032287B1 (en) * 2002-07-19 2006-04-25 Nanometrics Incorporated Edge grip chuck
US7018555B2 (en) * 2002-07-26 2006-03-28 Dainippon Screen Mfg. Co., Ltd. Substrate treatment method and substrate treatment apparatus
US7289198B2 (en) * 2003-01-07 2007-10-30 Intel Corporation Process compensation for step and scan lithography
US6935638B2 (en) 2003-02-21 2005-08-30 Blue29, Llc Universal substrate holder for treating objects in fluids
US7226055B1 (en) * 2003-05-30 2007-06-05 Lam Research Corporation Substrate holding and spinning assembly and methods for making the same
US6860944B2 (en) * 2003-06-16 2005-03-01 Blue29 Llc Microelectronic fabrication system components and method for processing a wafer using such components
DE102004036435B4 (de) * 2003-08-07 2007-08-30 Nanophotonics Ag Haltevorrichtung für scheibenförmige Objekte
JP2005333063A (ja) * 2004-05-21 2005-12-02 Renesas Technology Corp クランプ部材、成膜装置、成膜方法、半導体装置の製造方法
US7703823B2 (en) * 2004-07-12 2010-04-27 Rudolph Technologies, Inc. Wafer holding mechanism
JP4763338B2 (ja) * 2005-05-09 2011-08-31 タツモ株式会社 基板把持機構
US20070145231A1 (en) * 2005-12-21 2007-06-28 Chunghwa Picture Tubes, Ltd Substrate buffer clamp
CN1986874A (zh) * 2005-12-23 2007-06-27 鸿富锦精密工业（深圳）有限公司 阳极板及包括所述阳极板的溅镀装置
US20070215049A1 (en) * 2006-03-14 2007-09-20 Applied Materials, Inc. Transfer of wafers with edge grip
EP1868238B1 (de) 2006-06-14 2013-02-13 ASM Assembly Systems GmbH & Co. KG Klemmvorrichtung für einen Wafer
JP4814731B2 (ja) 2006-08-30 2011-11-16 株式会社日立ハイテクノロジーズ 基板保持装置、検査または処理の装置、基板保持方法、検査または処理の方法および検査装置
EP2095412B1 (de) * 2006-12-14 2016-06-29 Kemet Japan CO., LTD. Disk-haltevorrichtung und vorrichtung zur detektion von defekt-/fremdmaterial
US8042254B1 (en) * 2006-12-22 2011-10-25 Kla-Tencor Corporation Method for improving edge handling chuck aerodynamics
TWI538094B (zh) * 2009-03-31 2016-06-11 蘭研究公司 用以處理盤狀物品的裝置
CN101656223B (zh) * 2009-07-29 2011-11-02 东莞宏威数码机械有限公司 多抓手重复智能抓取释放装置
KR101084268B1 (ko) * 2009-09-25 2011-11-16 삼성모바일디스플레이주식회사 기판 센터링 장치 및 이를 구비한 유기물 증착 시스템
US9130002B2 (en) * 2010-05-07 2015-09-08 Lam Research Ag Device for holding wafer shaped articles
US9218990B2 (en) * 2011-10-07 2015-12-22 Varian Semiconductor Equipment Associates, Inc. Method and apparatus for holding a plurality of substrates for processing
US9038262B2 (en) * 2012-02-23 2015-05-26 Beijing Sevenstar Electronics Co., Ltd. Device for holding disk-shaped articles and method thereof
JP6018404B2 (ja) * 2012-04-25 2016-11-02 株式会社荏原製作所 基板処理装置
CN102945820B (zh) * 2012-10-23 2015-03-18 北京七星华创电子股份有限公司 盘状物夹持装置
US9589818B2 (en) * 2012-12-20 2017-03-07 Lam Research Ag Apparatus for liquid treatment of wafer shaped articles and liquid control ring for use in same
JP6057334B2 (ja) * 2013-03-15 2017-01-11 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
US20140293291A1 (en) * 2013-04-01 2014-10-02 Kla-Tencor Corporation Wafer Shape and Thickness Measurement System Utilizing Shearing Interferometers
JP6255650B2 (ja) * 2013-05-13 2018-01-10 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
JP6179012B2 (ja) * 2013-07-28 2017-08-16 アテル株式会社 ウエハ位置決め装置
US9653338B2 (en) * 2013-12-23 2017-05-16 Kla-Tencor Corporation System and method for non-contact wafer chucking
DE102014119365B4 (de) * 2014-12-22 2023-01-26 VON ARDENNE Asset GmbH & Co. KG Substrathaltevorrichtung, Verfahren zum Bestücken einer Substrathaltevorrichtung und Verfahren zum Herstellen einer Substrathaltevorrichtung
JP6456712B2 (ja) 2015-02-16 2019-01-23 東京エレクトロン株式会社 基板保持機構及びこれを用いた基板処理装置
US9966292B2 (en) * 2016-07-12 2018-05-08 Globalfoundries Inc. Centering fixture for electrostatic chuck system
US10083852B1 (en) * 2017-05-12 2018-09-25 Kla-Tencor Corporation Floating wafer chuck
JP6948860B2 (ja) 2017-07-14 2021-10-13 株式会社荏原製作所 基板保持装置
TWI766105B (zh) * 2017-09-28 2022-06-01 美商魯道夫科技股份有限公司 晶圓級封裝組裝體處置
US11133200B2 (en) * 2017-10-30 2021-09-28 Taiwan Semiconductor Manufacturing Co., Ltd. Substrate vapor drying apparatus and method
JP6946151B2 (ja) * 2017-11-13 2021-10-06 株式会社荏原製作所 基板保持装置および基板保持装置を備える基板処理装置
US10658221B2 (en) * 2017-11-14 2020-05-19 Taiwan Semiconductor Manufacturing Co., Ltd. Semiconductor wafer cleaning apparatus and method for cleaning semiconductor wafer
US10811299B2 (en) 2018-05-04 2020-10-20 Lam Research Corporation Wafer chuck assembly
WO2020183464A1 (en) * 2019-03-13 2020-09-17 Core Flow Ltd. Circular wafer lateral positioning device
US11037809B2 (en) * 2019-07-17 2021-06-15 Taiwan Semiconductor Manufacturing Co., Ltd. Transfer device and method for transferring substrate without unexpected rotation
US11217474B2 (en) * 2019-12-06 2022-01-04 Government Of The United States Of America, As Represented By The Secretary Of Commerce Non-vacuum, non-contact spinner wafer chuck
TWI748560B (zh) * 2020-07-15 2021-12-01 弘塑科技股份有限公司 自動晶圓定位總成
CN113948437A (zh) * 2020-07-15 2022-01-18 弘塑科技股份有限公司 自动晶圆定位总成
KR102637363B1 (ko) * 2021-12-30 2024-02-15 주식회사 에이이엘코리아 매엽식 세정장치의 기판 고정용 클램핑 장치
CN117080155B (zh) * 2023-10-13 2024-04-09 无锡星微科技有限公司 晶圆检测用多自由度移动装置

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5040484A (en) * 1987-05-04 1991-08-20 Varian Associates, Inc. Apparatus for retaining wafers
JPH03128943U (de) * 1990-04-09 1991-12-25
JPH0735395Y2 (ja) * 1990-09-27 1995-08-09 株式会社エンヤシステム スピンチャック
JPH06196543A (ja) * 1992-12-24 1994-07-15 Sumitomo Metal Ind Ltd 試料の搬送装置
JP2862754B2 (ja) * 1993-04-19 1999-03-03 東京エレクトロン株式会社 処理装置及び回転部材
US5775000A (en) 1996-05-13 1998-07-07 Ebara Corporation Substrate gripper device for spin drying
JP3831043B2 (ja) * 1997-01-24 2006-10-11 東京エレクトロン株式会社 回転処理装置
JPH10335287A (ja) * 1997-06-05 1998-12-18 Toshiba Corp 基板処理装置
JPH1167880A (ja) * 1997-08-18 1999-03-09 Toshiba Mach Co Ltd ウエハ回転チャック
US5974681A (en) * 1997-09-10 1999-11-02 Speedfam-Ipec Corp. Apparatus for spin drying a workpiece
JPH1197515A (ja) * 1997-09-22 1999-04-09 Toshiba Corp ウエハ支持用回転テーブル
JPH11283957A (ja) * 1998-03-31 1999-10-15 Kaijo Corp 半導体ウェハの枚葉式スピン乾燥装置
US6217034B1 (en) * 1998-09-24 2001-04-17 Kla-Tencor Corporation Edge handling wafer chuck
US6167893B1 (en) 1999-02-09 2001-01-02 Novellus Systems, Inc. Dynamic chuck for semiconductor wafer or other substrate
JP2000332085A (ja) * 1999-05-19 2000-11-30 Sony Corp ウェーハクランプ装置
US6578853B1 (en) * 2000-12-22 2003-06-17 Lam Research Corporation Chuck assembly for use in a spin, rinse, and dry module and methods for making and implementing the same

Also Published As

Publication number Publication date
EP1253633A3 (de) 2005-03-16
JP4488646B2 (ja) 2010-06-23
JP2002319613A (ja) 2002-10-31
US20020153676A1 (en) 2002-10-24
US6761362B2 (en) 2004-07-13
EP1253633A2 (de) 2002-10-30
EP1253633B1 (de) 2010-11-17

Similar Documents

Publication Publication Date Title
DE60238291D1 (de) Wafer-Haltevorrichtung
DE60238871D1 (de) Waferpositionierungsverfahren
DE60229591D1 (de) Trägerplattenvorrichtung
DE60227511D1 (de) Umzeitkodierung
DE60235777D1 (de) Verschleissanordnung
DE60205416D1 (de) Kompressorantreibsystem
DE60232603D1 (de) Nahinfrarot-schutzfolie
FI20011411A (fi) Värähtelykaiutin
DE60227475D1 (de) Halbleiterbauelement
DE60225041D1 (de) Roentgenbildverbesserung
DE60227839D1 (de) Martensitische nanoverbundstähle
DE60117032D1 (de) Glasfaserspleissverstärkung
DE50212173D1 (de) sgängern
DE50213828D1 (de) Lichtsensitives Halbleiterbauelement
DE60225606D1 (de) Perfluoroelastomere
DE50204551D1 (de) Kugelgelenk
DE60112475D1 (de) Einschraubenverdichter
DE60217049D1 (de) Ölluftseparatorplug
DE60225790D1 (de) Halbleiterbauelement
FI20010163A0 (fi) Palvelinarkitehtuuri
ITMI20010954A0 (it) Procedimento di iodurazione
DE50202752D1 (de) Mikroskop
DE50203716D1 (de) Mikroskop
DE10249893B4 (de) Halbleiterschaltung
DE60201464D1 (de) Halbleiterlaser