DE60100594D1 - Verfahren und system zur aufspürung von fehlern auf einer gedruckten leiterplatte - Google Patents

Verfahren und system zur aufspürung von fehlern auf einer gedruckten leiterplatte

Info

Publication number
DE60100594D1
DE60100594D1 DE60100594T DE60100594T DE60100594D1 DE 60100594 D1 DE60100594 D1 DE 60100594D1 DE 60100594 T DE60100594 T DE 60100594T DE 60100594 T DE60100594 T DE 60100594T DE 60100594 D1 DE60100594 D1 DE 60100594D1
Authority
DE
Germany
Prior art keywords
pcb
printed circuit
circuit board
contours
detecting faults
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE60100594T
Other languages
English (en)
Other versions
DE60100594T2 (de
Inventor
Alain Coulombe
Michel Cantin
Louis Berard
Jonathan Gauthier
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Solvision Inc
Original Assignee
Solvision Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Solvision Inc filed Critical Solvision Inc
Application granted granted Critical
Publication of DE60100594D1 publication Critical patent/DE60100594D1/de
Publication of DE60100594T2 publication Critical patent/DE60100594T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G06T7/0006—Industrial image inspection using a design-rule based approach
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30141—Printed circuit board [PCB]

Landscapes

  • Engineering & Computer Science (AREA)
  • Quality & Reliability (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Image Analysis (AREA)
  • Image Processing (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Length Measuring Devices By Optical Means (AREA)
DE60100594T 2000-01-18 2001-01-17 Verfahren und system zur aufspürung von fehlern auf einer gedruckten leiterplatte Expired - Fee Related DE60100594T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
CA2296143 2000-01-18
CA002296143A CA2296143A1 (fr) 2000-01-18 2000-01-18 Systeme d'inspection optique
PCT/CA2001/000042 WO2001054068A2 (en) 2000-01-18 2001-01-17 Method and system for detecting defects on a printed circuit board

Publications (2)

Publication Number Publication Date
DE60100594D1 true DE60100594D1 (de) 2003-09-18
DE60100594T2 DE60100594T2 (de) 2004-06-24

Family

ID=4165090

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60100594T Expired - Fee Related DE60100594T2 (de) 2000-01-18 2001-01-17 Verfahren und system zur aufspürung von fehlern auf einer gedruckten leiterplatte

Country Status (12)

Country Link
US (1) US6771807B2 (de)
EP (1) EP1254431B1 (de)
JP (1) JP2003520969A (de)
KR (1) KR100744212B1 (de)
CN (1) CN1261908C (de)
AT (1) ATE247309T1 (de)
AU (1) AU2001228211A1 (de)
CA (1) CA2296143A1 (de)
DE (1) DE60100594T2 (de)
IL (2) IL150744A0 (de)
TW (1) TWI240223B (de)
WO (1) WO2001054068A2 (de)

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CN109389597B (zh) * 2018-10-24 2021-04-27 四川长虹电器股份有限公司 一种生产线上电路板缺陷检测系统及方法
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CN113610761B (zh) * 2021-07-06 2023-11-17 上海望友信息科技有限公司 判断断头线的方法、装置、电子设备及存储介质
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TWI786838B (zh) * 2021-09-17 2022-12-11 鴻海精密工業股份有限公司 印字瑕疵檢測方法、電腦裝置及儲存介質
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CN114384204B (zh) * 2021-12-07 2024-03-22 广州兴森快捷电路科技有限公司 Pcb拼板检测装置、系统、方法及存储介质
CN116242830A (zh) * 2021-12-08 2023-06-09 先进半导体材料(深圳)有限公司 引线框架的瑕疵检测方法
CN114627113B (zh) * 2022-05-12 2022-07-29 成都数之联科技股份有限公司 一种印制电路板缺陷检测方法及系统及装置及介质
CN116563357B (zh) * 2023-07-10 2023-11-03 深圳思谋信息科技有限公司 图像匹配方法、装置、计算机设备及计算机可读存储介质
CN116912250B (zh) * 2023-09-13 2023-11-28 山东众成菌业股份有限公司 基于机器视觉的菌包生产质量检测方法
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Also Published As

Publication number Publication date
KR100744212B1 (ko) 2007-07-30
WO2001054068A2 (en) 2001-07-26
IL150744A0 (en) 2003-02-12
US20010028732A1 (en) 2001-10-11
CA2296143A1 (fr) 2001-07-18
US6771807B2 (en) 2004-08-03
EP1254431A2 (de) 2002-11-06
CN1401107A (zh) 2003-03-05
CN1261908C (zh) 2006-06-28
DE60100594T2 (de) 2004-06-24
ATE247309T1 (de) 2003-08-15
KR20020089325A (ko) 2002-11-29
JP2003520969A (ja) 2003-07-08
IL150744A (en) 2007-09-20
TWI240223B (en) 2005-09-21
EP1254431B1 (de) 2003-08-13
AU2001228211A1 (en) 2001-07-31
WO2001054068A3 (en) 2002-08-08

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