WO2014063301A1 - Smt的pcb板的检验方法及装置 - Google Patents

Smt的pcb板的检验方法及装置 Download PDF

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Publication number
WO2014063301A1
WO2014063301A1 PCT/CN2012/083356 CN2012083356W WO2014063301A1 WO 2014063301 A1 WO2014063301 A1 WO 2014063301A1 CN 2012083356 W CN2012083356 W CN 2012083356W WO 2014063301 A1 WO2014063301 A1 WO 2014063301A1
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Prior art keywords
shape
pad
pcb
opening
vector data
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PCT/CN2012/083356
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English (en)
French (fr)
Inventor
罗艺
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Luo Yi
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Application filed by Luo Yi filed Critical Luo Yi
Priority to PCT/CN2012/083356 priority Critical patent/WO2014063301A1/zh
Publication of WO2014063301A1 publication Critical patent/WO2014063301A1/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09918—Optically detected marks used for aligning tool relative to the PCB, e.g. for mounting of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/163—Monitoring a manufacturing process

Definitions

  • the invention belongs to the field of electronics, and in particular relates to an inspection technology of a PCB of SMT.
  • SMT Surface Mounted Technology
  • the size and positional deviation of the manufacturing process of the prior art steel mesh may also occur in the manufacturing process of the PCB, and the theoretical position of the PCB pad does not match the actual position. This case is compared in this welding part. In large cases, it is feasible.
  • the purpose of the embodiments of the present invention is to provide a method for inspecting a PCB of an SMT, which aims to solve the problem that the accuracy of the verification of the prior art scheme is not high and affects the yield of the product.
  • the embodiment of the present invention is implemented by the method for verifying a PCB of an SMT, and the method includes the following steps:
  • the vector data of the stencil opening is specifically: a center coordinate of the stencil opening, an opening shape and a shape size;
  • the vector data of the stencil opening is compared with the vector data of the PCB pad. If the same, the PCB and the stencil are qualified, otherwise, the failure is determined and an alarm is issued.
  • the vector data of the stencil opening is compared with the vector data of the PCB pad, and if the same, the PCB and the stencil are qualified, otherwise, the failure is determined, and the alarm is specifically included:
  • the center coordinate of the stencil opening is subtracted from the center coordinate of the PCB pad to obtain the difference of the central coordinates. If the difference does not exceed the threshold, the same is determined, and the determination is qualified. If the difference exceeds the threshold, the difference is determined, and the determination is not determined. Qualified and alarmed;
  • the shape and shape of the opening of the stencil is compared with the shape and shape of the PCB pad. If the shape is the same and the difference between the shape of the opening and the shape of the pad does not exceed the threshold, the same is determined and the determination is passed. If the shape is different or the difference between the opening shape size and the pad shape size exceeds the threshold value, the difference is determined, the failure is determined, an alarm is issued, and the difference between the opening shape size and the pad shape size is output.
  • the vector data of the stencil opening further includes: a color value of each pixel of the stencil opening; the vector data of the pad further includes: a color of each pixel of the pad value.
  • an inspection apparatus for a PCB of an SMT comprising:
  • the acquiring and fitting unit is further configured to acquire image data of the PCB board, and after performing MARK positioning on the image data, fitting the pad shape of the PCB image data into the same shape as the design file of the PCB board; Generating vector data of the fitted PCB pad; the vector data of the pad is specifically: a center coordinate of the pad, a pad shape and a shape size, and transmitting the vector data of the pad to the comparison unit;
  • the comparison unit is used to compare the vector data of the stencil opening with the vector data of the PCB pad. If the same, the PCB and the stencil are qualified, otherwise, the failure is determined and an alarm is issued.
  • the comparison unit is specifically configured to:
  • the center coordinate of the stencil opening is subtracted from the center coordinate of the PCB pad to obtain the difference of the central coordinates. If the difference does not exceed the threshold, the same is determined, and the determination is qualified. If the difference exceeds the threshold, the difference is determined, and the determination is not determined. Qualified and alarmed;
  • the shape and shape of the opening of the stencil is compared with the shape and shape of the PCB pad. If the shape is the same and the difference between the shape of the opening and the shape of the pad does not exceed the threshold, the same is determined and the determination is passed. If the shape is different or the difference between the opening shape size and the pad shape size exceeds the threshold value, the difference is determined, the failure is determined, an alarm is issued, and the difference between the opening shape size and the pad shape size is output.
  • the vector data of the stencil opening further includes: a color value of each pixel of the stencil opening; the vector data of the pad further includes: a color of each pixel of the pad value.
  • the technical solution provided by the present invention has the advantage of high detection precision.
  • FIG. 1 is a schematic structural view of a PCB board provided by the prior art
  • FIG. 2 is a flowchart of a method for inspecting a PCB of an SMT according to an embodiment of the present invention
  • FIG. 3 is a schematic view showing the shape of a pad and an opening provided by an embodiment of the present invention.
  • FIG. 4 is a structural diagram of an inspection apparatus for a PCB of an SMT according to an embodiment of the present invention.
  • the technical solution of the present invention is implemented under the premise that the existing PCB board has a multi-layer structure, and there is not only a multi-layer circuit structure but also a pad on the PCB board. Need to print solder paste, solder paste and PCB structure as shown in Figure 1, and in order to print solder paste on the PCB, you need to make a steel mesh, and open holes in the steel mesh, so that when printing solder paste, steel The net is placed on the top of the PCB, and then the MARK is positioned, and the solder paste is printed on the PCB. Thus, the printing of the solder paste of the PCB is completed.
  • the embodiment of the present invention provides a new detection scheme for the PCB.
  • the opening of the stencil and the pad of the PCB are qualified by comparing the stencil photo with the image of the PCB.
  • the photos obtained by the steel mesh are black and white photos
  • the photos of the PCB board are colored photos
  • the black and white photos and the color photos cannot be compared, so the simple passage between the photos is
  • the comparison of the stencil opening and the slab of the PCB is unsatisfactory, and the technical solution provided by the embodiment of the present invention is required to implement the inspection of the PCB.
  • the technical solutions of the embodiments of the present invention are described in detail below.
  • a specific embodiment of the present invention provides a method for inspecting a PCB of an SMT.
  • the method is completed by a PCB board inspection device.
  • the device pre-stores a design file of the PCB board.
  • the method is as shown in FIG. 2, and includes the following steps:
  • the method provided by the embodiment of the invention can automatically correct the PCB board and the steel mesh by comparing the vector data by generating vector data after the image is fitted, so that it has the advantages of automatic recognition, deviation confirmation and accurate identification.
  • Xi represents the X-axis coordinate of the opening or the midpoint of the pad
  • Yi represents the Y-axis coordinate of the opening or the midpoint of the pad
  • Ai is shape information
  • the shape information may be a data structure, for example:
  • Shapetype st; // shape type, garden, square, polygon.
  • the multidimensional calculation method is used when the data is compared, which improves the detection accuracy.
  • the representation of the vector data may be in other manners.
  • the technical solution provided by the specific embodiment of the present invention is not limited to the representation of the vector data.
  • the shape of the opening of the image data here is fitted to the same shape as the design file of the PCB board in order to realize the inspection of the steel mesh and the PCB board, because in actual conditions, the opening of the steel mesh
  • the hole will be inconsistent with the design document, as shown in Figure 3 (where 31 is the pad and 32 is the opening).
  • the opening of the stencil may have a gap, if not If the comparison is made directly, the comparison cannot be performed, so the fitting must be performed before the comparison can be made.
  • the vector data of the stencil opening may be: a central coordinate of the stencil opening (including an X-axis coordinate, a Y-axis coordinate), an opening shape and a shape size; wherein the opening shape may specifically include: a circle Shape, rectangle or polygon, the corresponding shape size may be: when it is a circle, the size may be, radius or diameter, the shape of the rectangle may be: long, wide size, when it is a polygon, the shape size may Is: polygon area and corner coordinates.
  • the vector data of the PCB board pad may be specifically: a central coordinate of the PCB board pad (including an X-axis coordinate, a Y-axis coordinate), a pad shape and a shape size; wherein the pad shape may specifically include: a circle, a rectangle, or
  • the shape of the polygon may be: when it is a circle, the size may be a radius or a diameter, and the shape of the rectangle may be: a length and a width.
  • the shape size may be: a polygon area. And corner coordinates.
  • the method for implementing S23 may specifically be:
  • the center coordinate of the stencil opening is subtracted from the center coordinate of the PCB pad to obtain the difference of the central coordinates. If the difference does not exceed the threshold, the same is determined, and the determination is qualified. If the difference exceeds the threshold, the difference is determined, and the determination is not determined. Qualified and alarmed;
  • the shape and shape of the opening of the stencil is compared with the shape and shape of the PCB pad. If the shape is the same and the difference between the shape of the opening and the shape of the pad does not exceed the threshold, the same is determined and the determination is passed. If the shape is different or the difference between the opening shape size and the pad shape size exceeds the threshold value, the difference is determined, the failure is determined, the alarm is issued, and the difference between the opening shape size and the pad shape size is output to facilitate the user according to the difference.
  • the cause of the failure is determined, for example, a deviation in the X-axis or a deviation in the Y-axis.
  • the vector data may further include: the color value of each pixel of the aperture is used for sub-pixel calculation, and the color value is used to accurately calculate the external size of the aperture or the pad.
  • the black color value is 0, the white color value is 300255, and the black to white color is enlarged to the size of a single pixel. There will definitely be a pixel color value in white and black.
  • the intermediate value of white and black can be used to calculate the shape of the opening or the pad based on the color value of the intermediate color. Taking the image of the digital camera as an example, the size of each pixel is 7 micrometers. If the color value of the intermediate pixel is 150, the outer shape is the midpoint of the 150/255 position of the intermediate pixel. If the color value of the intermediate pixel is 200, then The shape is the 1200/3255 position of the intermediate pixel.
  • a specific embodiment of the present invention provides an inspection device for a PCB of an SMT, which is shown in FIG. 4 and includes:
  • Obtaining a fitting unit 41 configured to acquire image data of the steel mesh, and after performing MARK positioning on the image data, fitting the opening shape of the image data to the same shape as the design file of the PCB board;
  • the vector data of the stencil opening is specifically: the center coordinate of the stencil opening, the opening shape and the shape size, and the vector data of the stencil opening is sent to the comparison Unit 42;
  • the fitting unit 41 which is further configured to acquire image data of the PCB board, and after performing MARK positioning on the image data, fitting the pad shape of the PCB image data into the same shape as the design file of the PCB board; generating Vector data of the PCB pad after fitting; the vector data of the pad is specifically: the center coordinate of the pad, the shape of the pad and the shape size, and the vector data of the pad is sent to the comparison unit 42;
  • the comparison unit 42 is configured to compare the vector data of the stencil opening with the vector data of the PCB pad. If the same, the PCB and the steel mesh are determined to be qualified. Otherwise, the failure is determined and an alarm is issued.
  • the comparison unit 42 is specifically configured to:
  • the center coordinate of the stencil opening is subtracted from the center coordinate of the PCB pad to obtain the difference of the central coordinates. If the difference does not exceed the threshold, the same is determined, and the determination is qualified. If the difference exceeds the threshold, the difference is determined, and the determination is not determined. Qualified and alarmed;
  • the shape and shape of the opening of the stencil is compared with the shape and shape of the PCB pad. If the shape is the same and the difference between the shape of the opening and the shape of the pad does not exceed the threshold, the same is determined and the determination is passed. If the shape is different or the difference between the opening shape size and the pad shape size exceeds the threshold value, the difference is determined, the failure is determined, an alarm is issued, and the difference between the opening shape size and the pad shape size is output.
  • the vector data of the stencil opening further includes: a color value of each pixel of the stencil opening; the vector data of the pad further includes: a color of each pixel of the pad value.
  • each unit included is only divided according to functional logic, but is not limited to the above division, as long as the corresponding function can be implemented; in addition, the specific name of each functional unit It is also for convenience of distinguishing from each other and is not intended to limit the scope of protection of the present invention.

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Abstract

本方案提供了一种SMT（Surface Mounted Technology）的PCB（Printed Circuit Board）板的检验方法及装置，适用于电子领域。该检验方法包括如下步骤：获取钢网的图像数据，对该图像数据进行MARK定位后，将该图像数据的开孔形状拟合成与该PCB板的设计文件相同的形状；生成拟合后的钢网开孔的矢量数据（S21）；获取PCB板的图像数据，对该图像数据进行MARK定位后，将该PCB板图像数据的焊盘形状拟合成与该PCB板的设计文件相同的形状；生成拟合后的PCB焊盘的矢量数据（S22）；将钢网开孔的矢量数据与PCB焊盘的矢量数据进行比对，如相同，确定PCB与钢网合格，否则，确定不合格，进行报警（S23）。该技术方案具有提高PCB板检测精度的优点。

Description

SMT的PCB板的检验方法及装置 技术领域
本发明属于电子领域，尤其涉及一种SMT的PCB的检验技术。
 背景技术
表面组装技术(Surface Mounted Technology , SMT) 是目前电子组装行业里最流行的一种技术和工艺，尤其在 印刷电路板（Printed Circuit Board，PCB）领域应用广泛，现有的基于SMT的PCB的验证方法通常是拿一张PCB放置到钢网下方，人工观察是否PCB所有焊盘都显现出来了，如显现出来，则表示合格。
 技术问题
在实现现有技术的技术方案中，发现现有技术存在如下问题：
现有技术的中钢网的制造过程可能出现的大小，位置偏差，PCB的制造过程中，也会出现PCB焊盘的理论位置与实际位置不相符的情况，此种情况在这个在焊接零件比较大的情况下，是可行的。
但是随着零件越来越小，越多，越密集。这样检测会造成很多问题。
1 漏孔无法在生产前看到: 钢网的开孔太过密集，人工无法确认全部开孔是否正常。只漏孔有首件试印后才能确认。
2 偏位无法看到：只有在印刷锡膏以后，只有用专业的锡膏检测软件才能发现问题，一旦发现锡膏印刷出现偏位问题后，整个钢网都将作废，产线停止生产，直接造成生产成本高。
3 形状无法确认：传统方式只对是否开孔确认，不确认形状，但是钢网开孔形状会对焊接质量产生直接影响。
所以现有技术提供的技术方案验证的精度不高，影响产品的成品率。
 技术解决方案
本发明实施例的目的在于提供一种SMT的PCB板的检验方法，旨在解决现有的技术方案验证的精度不高，影响产品的成品率的问题。
本发明实施例是这样实现的，提供一种SMT的PCB板的检验方法，所述方法包括如下步骤：
获取钢网的图像数据，对该图像数据进行MARK定位后，将该图像数据的开孔形状拟合成与该PCB板的设计文件相同的形状；生成拟合后的钢网开孔的矢量数据；所述钢网开孔的矢量数据具体为：钢网开孔的中心坐标、开孔形状和形状尺寸；
获取PCB板的图像数据，对该图像数据进行MARK定位后，将该PCB板图像数据的焊盘形状拟合成与该PCB板的设计文件相同的形状；生成拟合后的PCB焊盘的矢量数据；所述焊盘的矢量数据具体为：焊盘的中心坐标、焊盘形状和形状尺寸；
将钢网开孔的矢量数据与PCB焊盘的矢量数据进行比对，如相同，确定PCB与钢网合格，否则，确定不合格，进行报警。
可选的，所述将钢网开孔的矢量数据与PCB焊盘的矢量数据进行比对，如相同，确定PCB与钢网合格，否则，确定不合格，进行报警具体包括：
将钢网开孔的中心坐标与PCB板焊盘中心坐标相减获取中心坐标的差值，如差值未超出阈值，则确定相同，判定合格，如差值超出阈值，则确定不同，确定不合格，进行报警；
或将钢网开孔的开孔形状和形状尺寸与PCB板焊盘形状和形状尺寸对比，如形状相同且开孔形状尺寸与焊盘形状尺寸之差未超出阈值，则确定相同，判定合格，如形状不相同或开孔形状尺寸与焊盘形状尺寸之差超出阈值，则确定不同，确定不合格，进行报警，并输出开孔形状尺寸与焊盘形状尺寸的差值。
可选的，所述钢网开孔的矢量数据还包括：所述钢网开孔每个像素点的颜色值；所述焊盘的矢量数据还包括：所述焊盘每个像素点的颜色值。
另一方面，还提供一种SMT的PCB板的检验装置，所述装置包括：
获取拟合单元，用于获取钢网的图像数据，对该图像数据进行MARK定位后，将该图像数据的开孔形状拟合成与该PCB板的设计文件相同的形状；生成拟合后的钢网开孔的矢量数据；所述钢网开孔的矢量数据具体为：钢网开孔的中心坐标、开孔形状和形状尺寸，将所述钢网开孔的矢量数据发送给比对单元；
所述获取拟合单元，还用于获取PCB板的图像数据，对该图像数据进行MARK定位后，将该PCB板图像数据的焊盘形状拟合成与该PCB板的设计文件相同的形状；生成拟合后的PCB焊盘的矢量数据；所述焊盘的矢量数据具体为：焊盘的中心坐标、焊盘形状和形状尺寸，将所述焊盘的矢量数据发送给比对单元；
比对单元，用于将钢网开孔的矢量数据与PCB焊盘的矢量数据进行比对，如相同，确定PCB与钢网合格，否则，确定不合格，进行报警。
可选的，所述比对单元具体用于：
将钢网开孔的中心坐标与PCB板焊盘中心坐标相减获取中心坐标的差值，如差值未超出阈值，则确定相同，判定合格，如差值超出阈值，则确定不同，确定不合格，进行报警；
或将钢网开孔的开孔形状和形状尺寸与PCB板焊盘形状和形状尺寸对比，如形状相同且开孔形状尺寸与焊盘形状尺寸之差未超出阈值，则确定相同，判定合格，如形状不相同或开孔形状尺寸与焊盘形状尺寸之差超出阈值，则确定不同，确定不合格，进行报警，并输出开孔形状尺寸与焊盘形状尺寸的差值。
可选的，所述钢网开孔的矢量数据还包括：所述钢网开孔每个像素点的颜色值；所述焊盘的矢量数据还包括：所述焊盘每个像素点的颜色值。
 有益效果
在本发明实施例中，本发明提供的技术方案具有检测精度高的优点。
 附图说明
图1是现有技术提供的PCB板结构示意图；
图2是本发明实施例提供的一种SMT的PCB板的检验方法的流程图；
图3是本发明实施例提供的焊盘与开孔的形状示意图；以及
图4是本发明实施例提供的一种SMT的PCB板的检验装置的结构图。
 本发明的实施方式
为了使本发明的目的、技术方案及优点更加清楚明白，以下结合附图及实施例，对本发明进行进一步详细说明。应当理解，此处所描述的具体实施例仅仅用以解释本发明，并不用于限定本发明。
需要实现说明的是，本发明的技术方案是在如下的技术前提下实现的，现有的PCB板为多层的结构，其不仅仅存在多层的电路结构，在PCB板的焊盘上还需要印刷锡膏，锡膏与PCB的结构如图1所示，而为了将锡膏印刷在PCB板上，就需要制造钢网，并在钢网上开孔，这样将印刷锡膏时，将钢网放在PCB板的上面，然后进行MARK定位以后，将锡膏印刷在PCB板上，这样就完成了PCB板锡膏的印刷，本发明实施例提供了一种全新的PCB板的检测方案，其通过对钢网照片和PCB板的图像照片的对比来判断钢网的开孔与PCB板的焊盘是否合格。需要说明的是，在现有技术中，钢网获取的照片为黑白的照片，而PCB板的照片为彩色的照片，黑白照片与彩色照片是无法进行比对的，所以简单的通过照片之间的比对无法确定钢网开孔与PCB板的焊盘是否合格的，需要采用本发明实施例提供的技术方案才能够实现PCB板的检验。下面就详细说本发明实施例的技术方案。
本发明具体实施方式提供一种SMT的PCB板的检验方法，该方法由PCB板检验装置完成，该装置预先存储有PCB板的设计文件，该方法如图2所示，包括如下步骤：
S21、获取钢网的图像数据，对该图像数据进行MARK定位后，将该图像数据的开孔形状拟合成与该PCB板的设计文件相同的形状；生成拟合后的钢网开孔的矢量数据；
S22、获取PCB板的图像数据，对该图像数据进行MARK定位后，将该PCB板图像数据的焊盘形状拟合成与该PCB板的设计文件相同的形状；生成拟合后的PCB焊盘的矢量数据；
S23、将钢网开孔的矢量数据与PCB焊盘的矢量数据进行比对，如相同，确定PCB与钢网合格，否则，确定不合格，进行报警。
本发明实施例提供的方法通过对图片拟合以后生成矢量数据，对矢量数据进行比对就能够实现PCB板和钢网的自动校正，所以其具有自动识别、偏差确认和识别准确的优点。
可选的，上述矢量数据的表现形式可以为多种，例如：采用多为矩阵Z={Xi,Yi,Ai}描述矢量数据。其中Xi表示开孔或焊盘中点的X轴坐标，Yi表示开孔或焊盘中点的Y轴坐标，Ai为形状信息，该形状信息可以为一种数据结构，例如：
typedef struct ATTRIBUTE｛
COLOR color; // 颜色值
shapetype, st; // 形状类型，园，方形，多边形。
double w, h; /// 长度，高度
radius r; //// 半径
｝；// 因为Ai数据结构包含了多个数学属性，这样在数据计算比对时，采用多维计算方法，这样提高检测精度。
当然在实际情况中，上述矢量数据的表现形式还可以采用其他的方式，本发明具体实施方式提供的技术方案并不局限上述矢量数据的表现形式。
需要额外说明的是，这里的将该图像数据的开孔形状拟合成与该PCB板的设计文件相同的形状是为了实现钢网和PCB板的检验，因为在实际情况中，钢网的开孔会与设计文档的不一致，如图3所示（其中31为焊盘，32为开孔），例如当焊盘的形状为方形时，其钢网的开孔有可能有缺口，如果不拟合直接进行比对，则无法进行比对，所以必须进行拟合以后才能够比对。
可选的，上述钢网开孔的矢量数据具体可以为：钢网开孔的中心坐标（包括X轴坐标，Y轴坐标）、开孔形状和形状尺寸；其中开孔形状具体可以包括：圆形、长方形或多边形，其对应的形状尺寸具体可以为：当为圆形时，尺寸可以为，半径或直径，长方形的形状的尺寸可以为：长、宽尺寸，当为多边形时，形状尺寸可以为：多边形面积以及角点坐标。
上述PCB板焊盘的矢量数据具体可以为：PCB板焊盘的中心坐标（包括X轴坐标，Y轴坐标）、焊盘形状和形状尺寸；其中焊盘形状具体可以包括：圆形、长方形或多边形，其对应的形状尺寸具体可以为：当为圆形时，尺寸可以为，半径或直径，长方形的形状的尺寸可以为：长、宽尺寸，当为多边形时，形状尺寸可以为：多边形面积以及角点坐标。
实现S23的方法具体可以为：
将钢网开孔的中心坐标与PCB板焊盘中心坐标相减获取中心坐标的差值，如差值未超出阈值，则确定相同，判定合格，如差值超出阈值，则确定不同，确定不合格，进行报警；
或将钢网开孔的开孔形状和形状尺寸与PCB板焊盘形状和形状尺寸对比，如形状相同且开孔形状尺寸与焊盘形状尺寸之差未超出阈值，则确定相同，判定合格，如形状不相同或开孔形状尺寸与焊盘形状尺寸之差超出阈值，则确定不同，确定不合格，进行报警，并输出开孔形状尺寸与焊盘形状尺寸的差值以方便用户根据差值确定不合格的原因，例如是位于X轴的偏差或Y轴的偏差。
可选的，上述矢量数据具体还可以包括开孔每个像素点的颜色值为亚像素计算使用，此颜色值用来准确计算开孔或焊盘的外形尺寸。下面以一个实际的例子来说明，假设黑色的颜色值为0，白色的颜色值为300255，而黑色到白色如果放大到单个像素的大小，则白色和黑色的中肯定会有像素的颜色值为白色和黑色的中间值，则根据中间颜色的颜色值即可计算出开孔或焊盘的外形。以数码相机的图像为例，每个像素的尺寸为7微米，假设中间像素的颜色值为150，则外形即为中间像素的150/255位置中点，如果中间像素的颜色值为200，则外形即为中间像素的1200/3255位置。
需要说明的是，上述S21、S22的执行顺序可以为同时，其中S22也可以在S21之前或之后。
本发明具体实施方式提供一种SMT的PCB板的检验装置，该装置如图4所示，包括：
获取拟合单元41，用于获取钢网的图像数据，对该图像数据进行MARK定位后，将该图像数据的开孔形状拟合成与该PCB板的设计文件相同的形状；生成拟合后的钢网开孔的矢量数据；所述钢网开孔的矢量数据具体为：钢网开孔的中心坐标、开孔形状和形状尺寸，将所述钢网开孔的矢量数据发送给比对单元42；
获取拟合单元41，还用于获取PCB板的图像数据，对该图像数据进行MARK定位后，将该PCB板图像数据的焊盘形状拟合成与该PCB板的设计文件相同的形状；生成拟合后的PCB焊盘的矢量数据；所述焊盘的矢量数据具体为：焊盘的中心坐标、焊盘形状和形状尺寸，将所述焊盘的矢量数据发送给比对单元42；
比对单元42，用于将钢网开孔的矢量数据与PCB焊盘的矢量数据进行比对，如相同，确定PCB与钢网合格，否则，确定不合格，进行报警。
可选的，比对单元42具体用于：
将钢网开孔的中心坐标与PCB板焊盘中心坐标相减获取中心坐标的差值，如差值未超出阈值，则确定相同，判定合格，如差值超出阈值，则确定不同，确定不合格，进行报警；
或将钢网开孔的开孔形状和形状尺寸与PCB板焊盘形状和形状尺寸对比，如形状相同且开孔形状尺寸与焊盘形状尺寸之差未超出阈值，则确定相同，判定合格，如形状不相同或开孔形状尺寸与焊盘形状尺寸之差超出阈值，则确定不同，确定不合格，进行报警，并输出开孔形状尺寸与焊盘形状尺寸的差值。
可选的，所述钢网开孔的矢量数据还包括：所述钢网开孔每个像素点的颜色值；所述焊盘的矢量数据还包括：所述焊盘每个像素点的颜色值。
值得注意获取的是，上述实施例中，所包括的各个单元只是按照功能逻辑进行划分的，但并不局限于上述的划分，只要能够实现相应的功能即可；另外，各功能单元的具体名称也只是为了便于相互区分，并不用于限制本发明的保护范围。
另外，本领域普通技术人员可以理解实现上述各实施例方法中的全部或部分步骤是可以通过程序来指令相关的硬件来完成，相应的程序可以存储于一计算机可读取存储介质中，所述的存储介质，如ROM/RAM、磁盘或光盘等。
以上所述仅为本发明的较佳实施例而已，并不用以限制本发明，凡在本发明的精神和原则之内所作的任何修改、等同替换和改进等，均应包含在本发明的保护范围之内。
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  1. 1、一种SMT的PCB板的检验方法，其特征在于，所述方法包括如下步骤：
    获取钢网的图像数据，对该图像数据进行MARK定位后，将该图像数据的开孔形状拟合成与该PCB板的设计文件相同的形状；生成拟合后的钢网开孔的矢量数据；所述钢网开孔的矢量数据具体为：钢网开孔的中心坐标、开孔形状和形状尺寸；
    获取PCB板的图像数据，对该图像数据进行MARK定位后，将该PCB板图像数据的焊盘形状拟合成与该PCB板的设计文件相同的形状；生成拟合后的PCB焊盘的矢量数据；所述焊盘的矢量数据具体为：焊盘的中心坐标、焊盘形状和形状尺寸；
    将钢网开孔的矢量数据与PCB焊盘的矢量数据进行比对，如相同，确定PCB与钢网合格，否则，确定不合格，进行报警。
    2、根据权利要求1所述的方法，其特征在于，所述将钢网开孔的矢量数据与PCB焊盘的矢量数据进行比对，如相同，确定PCB与钢网合格，否则，确定不合格，进行报警具体包括：
    将钢网开孔的中心坐标与PCB板焊盘中心坐标相减获取中心坐标的差值，如差值未超出阈值，则确定相同，判定合格，如差值超出阈值，则确定不同，确定不合格，进行报警；
    或将钢网开孔的开孔形状和形状尺寸与PCB板焊盘形状和形状尺寸对比，如形状相同且开孔形状尺寸与焊盘形状尺寸之差未超出阈值，则确定相同，判定合格，如形状不相同或开孔形状尺寸与焊盘形状尺寸之差超出阈值，则确定不同，确定不合格，进行报警，并输出开孔形状尺寸与焊盘形状尺寸的差值。
    3、根据权利要求1所述的方法，其特征在于，所述钢网开孔的矢量数据还包括：所述钢网开孔每个像素点的颜色值；所述焊盘的矢量数据还包括：所述焊盘每个像素点的颜色值。
    4、一种SMT的PCB板的检验装置，其特征在于，所述装置包括：
    获取拟合单元，用于获取钢网的图像数据，对该图像数据进行MARK定位后，将该图像数据的开孔形状拟合成与该PCB板的设计文件相同的形状；生成拟合后的钢网开孔的矢量数据；所述钢网开孔的矢量数据具体为：钢网开孔的中心坐标、开孔形状和形状尺寸，将所述钢网开孔的矢量数据发送给比对单元；
    所述获取拟合单元，还用于获取PCB板的图像数据，对该图像数据进行MARK定位后，将该PCB板图像数据的焊盘形状拟合成与该PCB板的设计文件相同的形状；生成拟合后的PCB焊盘的矢量数据；所述焊盘的矢量数据具体为：焊盘的中心坐标、焊盘形状和形状尺寸，将所述焊盘的矢量数据发送给比对单元；
    比对单元，用于将钢网开孔的矢量数据与PCB焊盘的矢量数据进行比对，如相同，确定PCB与钢网合格，否则，确定不合格，进行报警。
    5、根据权利要求4所述的装置，其特征在于，所述比对单元具体用于：
    将钢网开孔的中心坐标与PCB板焊盘中心坐标相减获取中心坐标的差值，如差值未超出阈值，则确定相同，判定合格，如差值超出阈值，则确定不同，确定不合格，进行报警；
    或将钢网开孔的开孔形状和形状尺寸与PCB板焊盘形状和形状尺寸对比，如形状相同且开孔形状尺寸与焊盘形状尺寸之差未超出阈值，则确定相同，判定合格，如形状不相同或开孔形状尺寸与焊盘形状尺寸之差超出阈值，则确定不同，确定不合格，进行报警，并输出开孔形状尺寸与焊盘形状尺寸的差值。
    6、根据权利要求4所述的装置，其特征在于，所述钢网开孔的矢量数据还包括：所述钢网开孔每个像素点的颜色值；所述焊盘的矢量数据还包括：所述焊盘每个像素点的颜色值。
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