DE60044958D1 - Plasmaätzkammer - Google Patents
PlasmaätzkammerInfo
- Publication number
- DE60044958D1 DE60044958D1 DE60044958T DE60044958T DE60044958D1 DE 60044958 D1 DE60044958 D1 DE 60044958D1 DE 60044958 T DE60044958 T DE 60044958T DE 60044958 T DE60044958 T DE 60044958T DE 60044958 D1 DE60044958 D1 DE 60044958D1
- Authority
- DE
- Germany
- Prior art keywords
- plasma etching
- etching
- plasma
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000001020 plasma etching Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/3065—Plasma etching; Reactive-ion etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67069—Apparatus for fluid treatment for etching for drying etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32623—Mechanical discharge control means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32623—Mechanical discharge control means
- H01J37/32642—Focus rings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68735—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10S156/915—Differential etching apparatus including focus ring surrounding a wafer for plasma apparatus
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Drying Of Semiconductors (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/345,639 US6344105B1 (en) | 1999-06-30 | 1999-06-30 | Techniques for improving etch rate uniformity |
Publications (1)
Publication Number | Publication Date |
---|---|
DE60044958D1 true DE60044958D1 (de) | 2010-10-21 |
Family
ID=23355856
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60044958T Expired - Lifetime DE60044958D1 (de) | 1999-06-30 | 2000-06-29 | Plasmaätzkammer |
DE60038175T Expired - Lifetime DE60038175T2 (de) | 1999-06-30 | 2000-06-29 | Plasmaätzkammer |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60038175T Expired - Lifetime DE60038175T2 (de) | 1999-06-30 | 2000-06-29 | Plasmaätzkammer |
Country Status (9)
Country | Link |
---|---|
US (1) | US6344105B1 (de) |
EP (2) | EP1898444B1 (de) |
JP (2) | JP4792185B2 (de) |
KR (1) | KR100743872B1 (de) |
CN (2) | CN100392791C (de) |
AU (1) | AU5908600A (de) |
DE (2) | DE60044958D1 (de) |
TW (1) | TW463235B (de) |
WO (1) | WO2001001445A1 (de) |
Families Citing this family (112)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5662770A (en) * | 1993-04-16 | 1997-09-02 | Micron Technology, Inc. | Method and apparatus for improving etch uniformity in remote source plasma reactors with powered wafer chucks |
US6334960B1 (en) * | 1999-03-11 | 2002-01-01 | Board Of Regents, The University Of Texas System | Step and flash imprint lithography |
KR100315088B1 (ko) * | 1999-09-29 | 2001-11-24 | 윤종용 | 포커스 링을 갖는 반도체 웨이퍼 제조 장치 |
US6489249B1 (en) * | 2000-06-20 | 2002-12-03 | Infineon Technologies Ag | Elimination/reduction of black silicon in DT etch |
TW506234B (en) * | 2000-09-18 | 2002-10-11 | Tokyo Electron Ltd | Tunable focus ring for plasma processing |
US6475336B1 (en) * | 2000-10-06 | 2002-11-05 | Lam Research Corporation | Electrostatically clamped edge ring for plasma processing |
US6554954B2 (en) * | 2001-04-03 | 2003-04-29 | Applied Materials Inc. | Conductive collar surrounding semiconductor workpiece in plasma chamber |
TWI246873B (en) * | 2001-07-10 | 2006-01-01 | Tokyo Electron Ltd | Plasma processing device |
DE10143718A1 (de) * | 2001-08-31 | 2003-03-27 | Infineon Technologies Ag | Lagerungsvorrichtung für einen Wafer in einer Plasmaätzanlage |
US7041201B2 (en) * | 2001-11-14 | 2006-05-09 | Applied Materials, Inc. | Sidewall magnet improving uniformity of inductively coupled plasma and shields used therewith |
TWI272877B (en) * | 2001-12-13 | 2007-02-01 | Tokyo Electron Ltd | Ring mechanism, and plasma processing device using the ring mechanism |
US20030159778A1 (en) * | 2002-02-27 | 2003-08-28 | Kunihiko Koroyasu | Plasma processing apparatus, protecting layer therefor and installation of protecting layer |
US20040000375A1 (en) * | 2002-06-27 | 2004-01-01 | Taiwan Semiconductor Manufacturing Co., Ltd. | Plasma etch chamber equipped with multi-layer insert ring |
US20040040663A1 (en) * | 2002-08-29 | 2004-03-04 | Ryujiro Udo | Plasma processing apparatus |
US20040112862A1 (en) * | 2002-12-12 | 2004-06-17 | Molecular Imprints, Inc. | Planarization composition and method of patterning a substrate using the same |
DE10260645B3 (de) * | 2002-12-23 | 2004-09-16 | Infineon Technologies Ag | Kompensationsrahmen zur Aufnahme eines Substrats |
US20040168613A1 (en) * | 2003-02-27 | 2004-09-02 | Molecular Imprints, Inc. | Composition and method to form a release layer |
US7540935B2 (en) * | 2003-03-14 | 2009-06-02 | Lam Research Corporation | Plasma oxidation and removal of oxidized material |
US8382942B2 (en) * | 2003-03-21 | 2013-02-26 | Tokyo Electron Limited | Method and apparatus for reducing substrate backside deposition during processing |
US7049052B2 (en) * | 2003-05-09 | 2006-05-23 | Lam Research Corporation | Method providing an improved bi-layer photoresist pattern |
US20040226516A1 (en) * | 2003-05-13 | 2004-11-18 | Daniel Timothy J. | Wafer pedestal cover |
CN100463112C (zh) * | 2003-05-30 | 2009-02-18 | 周星工程股份有限公司 | 一种用于半导体装置的设备 |
US7157036B2 (en) * | 2003-06-17 | 2007-01-02 | Molecular Imprints, Inc | Method to reduce adhesion between a conformable region and a pattern of a mold |
US20050160934A1 (en) * | 2004-01-23 | 2005-07-28 | Molecular Imprints, Inc. | Materials and methods for imprint lithography |
US20060108710A1 (en) * | 2004-11-24 | 2006-05-25 | Molecular Imprints, Inc. | Method to reduce adhesion between a conformable region and a mold |
US7307118B2 (en) * | 2004-11-24 | 2007-12-11 | Molecular Imprints, Inc. | Composition to reduce adhesion between a conformable region and a mold |
US7658816B2 (en) | 2003-09-05 | 2010-02-09 | Tokyo Electron Limited | Focus ring and plasma processing apparatus |
US7024105B2 (en) * | 2003-10-10 | 2006-04-04 | Applied Materials Inc. | Substrate heater assembly |
US7122482B2 (en) | 2003-10-27 | 2006-10-17 | Molecular Imprints, Inc. | Methods for fabricating patterned features utilizing imprint lithography |
US7244336B2 (en) * | 2003-12-17 | 2007-07-17 | Lam Research Corporation | Temperature controlled hot edge ring assembly for reducing plasma reactor etch rate drift |
US7338578B2 (en) * | 2004-01-20 | 2008-03-04 | Taiwan Semiconductor Manufacturing Co., Ltd. | Step edge insert ring for etch chamber |
US8076386B2 (en) * | 2004-02-23 | 2011-12-13 | Molecular Imprints, Inc. | Materials for imprint lithography |
US20050189068A1 (en) * | 2004-02-27 | 2005-09-01 | Kawasaki Microelectronics, Inc. | Plasma processing apparatus and method of plasma processing |
JP3981091B2 (ja) * | 2004-03-01 | 2007-09-26 | 株式会社東芝 | 成膜用リングおよび半導体装置の製造装置 |
US20050193951A1 (en) * | 2004-03-08 | 2005-09-08 | Muneo Furuse | Plasma processing apparatus |
JP2005303099A (ja) | 2004-04-14 | 2005-10-27 | Hitachi High-Technologies Corp | プラズマ処理装置およびプラズマ処理方法 |
US7282550B2 (en) * | 2004-08-16 | 2007-10-16 | Molecular Imprints, Inc. | Composition to provide a layer with uniform etch characteristics |
US7939131B2 (en) | 2004-08-16 | 2011-05-10 | Molecular Imprints, Inc. | Method to provide a layer with uniform etch characteristics |
US20060062922A1 (en) * | 2004-09-23 | 2006-03-23 | Molecular Imprints, Inc. | Polymerization technique to attenuate oxygen inhibition of solidification of liquids and composition therefor |
US7138067B2 (en) * | 2004-09-27 | 2006-11-21 | Lam Research Corporation | Methods and apparatus for tuning a set of plasma processing steps |
US7578945B2 (en) * | 2004-09-27 | 2009-08-25 | Lam Research Corporation | Method and apparatus for tuning a set of plasma processing steps |
US7244311B2 (en) * | 2004-10-13 | 2007-07-17 | Lam Research Corporation | Heat transfer system for improved semiconductor processing uniformity |
US20060081557A1 (en) * | 2004-10-18 | 2006-04-20 | Molecular Imprints, Inc. | Low-k dielectric functional imprinting materials |
GB0424371D0 (en) * | 2004-11-04 | 2004-12-08 | Trikon Technologies Ltd | Shielding design for backside metal deposition |
JP4336320B2 (ja) * | 2005-02-25 | 2009-09-30 | キヤノンアネルバ株式会社 | ウエハホルダ |
US9659758B2 (en) * | 2005-03-22 | 2017-05-23 | Honeywell International Inc. | Coils utilized in vapor deposition applications and methods of production |
US20060219172A1 (en) * | 2005-04-05 | 2006-10-05 | Taiwan Semiconductor Manufacturing Co., Ltd. | PVD equipment and electrode and deposition ring thereof |
KR100714896B1 (ko) * | 2005-06-08 | 2007-05-04 | 삼성전자주식회사 | 건식 식각 장치의 포커스 링 |
US20060278520A1 (en) * | 2005-06-13 | 2006-12-14 | Lee Eal H | Use of DC magnetron sputtering systems |
KR100688747B1 (ko) | 2005-06-27 | 2007-03-02 | 동부일렉트로닉스 주식회사 | 웨이퍼 에지 식각 장치 및 방법 |
US8557351B2 (en) * | 2005-07-22 | 2013-10-15 | Molecular Imprints, Inc. | Method for adhering materials together |
US8808808B2 (en) | 2005-07-22 | 2014-08-19 | Molecular Imprints, Inc. | Method for imprint lithography utilizing an adhesion primer layer |
US7759407B2 (en) * | 2005-07-22 | 2010-07-20 | Molecular Imprints, Inc. | Composition for adhering materials together |
CN101258784B (zh) * | 2005-09-22 | 2011-03-30 | 积水化学工业株式会社 | 等离子加工设备 |
KR101153118B1 (ko) * | 2005-10-12 | 2012-06-07 | 파나소닉 주식회사 | 플라즈마 처리장치 및 플라즈마 처리방법 |
US7651571B2 (en) * | 2005-12-22 | 2010-01-26 | Kyocera Corporation | Susceptor |
JP2007250967A (ja) * | 2006-03-17 | 2007-09-27 | Tokyo Electron Ltd | プラズマ処理装置および方法とフォーカスリング |
US8635971B2 (en) * | 2006-03-31 | 2014-01-28 | Lam Research Corporation | Tunable uniformity in a plasma processing system |
US20080194113A1 (en) * | 2006-09-20 | 2008-08-14 | Samsung Electronics Co., Ltd. | Methods and apparatus for semiconductor etching including an electro static chuck |
KR100809957B1 (ko) * | 2006-09-20 | 2008-03-07 | 삼성전자주식회사 | 반도체 식각장치 |
US20080110557A1 (en) * | 2006-11-15 | 2008-05-15 | Molecular Imprints, Inc. | Methods and Compositions for Providing Preferential Adhesion and Release of Adjacent Surfaces |
US20080296261A1 (en) * | 2007-06-01 | 2008-12-04 | Nordson Corporation | Apparatus and methods for improving treatment uniformity in a plasma process |
US7837827B2 (en) * | 2007-06-28 | 2010-11-23 | Lam Research Corporation | Edge ring arrangements for substrate processing |
US8999106B2 (en) * | 2007-12-19 | 2015-04-07 | Applied Materials, Inc. | Apparatus and method for controlling edge performance in an inductively coupled plasma chamber |
US20090194414A1 (en) * | 2008-01-31 | 2009-08-06 | Nolander Ira G | Modified sputtering target and deposition components, methods of production and uses thereof |
US8409355B2 (en) * | 2008-04-24 | 2013-04-02 | Applied Materials, Inc. | Low profile process kit |
US20100101729A1 (en) * | 2008-10-28 | 2010-04-29 | Applied Materials, Inc. | Process kit having reduced erosion sensitivity |
KR101063588B1 (ko) * | 2008-11-05 | 2011-09-07 | 주식회사 디엠에스 | 커버 링의 수명을 연장하고 플라즈마 반응기의 식각 성능을향상시키기 위한 구조를 가지는 정전 척 어셈블리 |
KR101540609B1 (ko) * | 2009-02-24 | 2015-07-31 | 삼성전자 주식회사 | 웨이퍼 에지 식각 장치 |
KR101343502B1 (ko) * | 2009-07-24 | 2013-12-19 | 엘지디스플레이 주식회사 | 코팅장비의 코터 척 |
WO2011058851A1 (ja) * | 2009-11-16 | 2011-05-19 | シャープ株式会社 | ドライエッチング装置およびドライエッチング方法 |
JP6285620B2 (ja) * | 2011-08-26 | 2018-02-28 | 新光電気工業株式会社 | 静電チャック及び半導体・液晶製造装置 |
US9376752B2 (en) | 2012-04-06 | 2016-06-28 | Applied Materials, Inc. | Edge ring for a deposition chamber |
KR20140101996A (ko) * | 2013-02-13 | 2014-08-21 | 삼성전자주식회사 | 기판 지지유닛 및 이를 구비한 플라즈마 식각장치 |
US9997381B2 (en) * | 2013-02-18 | 2018-06-12 | Lam Research Corporation | Hybrid edge ring for plasma wafer processing |
WO2015116245A1 (en) * | 2014-01-30 | 2015-08-06 | Applied Materials, Inc. | Gas confiner assembly for eliminating shadow frame |
US10242848B2 (en) * | 2014-12-12 | 2019-03-26 | Lam Research Corporation | Carrier ring structure and chamber systems including the same |
JP2016184610A (ja) * | 2015-03-25 | 2016-10-20 | 株式会社東芝 | 上部電極、エッジリングおよびプラズマ処理装置 |
US10903055B2 (en) | 2015-04-17 | 2021-01-26 | Applied Materials, Inc. | Edge ring for bevel polymer reduction |
KR102424818B1 (ko) * | 2015-05-27 | 2022-07-25 | 도쿄엘렉트론가부시키가이샤 | 플라즈마 처리 장치 및 포커스 링 |
JP6570971B2 (ja) * | 2015-05-27 | 2019-09-04 | 東京エレクトロン株式会社 | プラズマ処理装置およびフォーカスリング |
US10854492B2 (en) * | 2015-08-18 | 2020-12-01 | Lam Research Corporation | Edge ring assembly for improving feature profile tilting at extreme edge of wafer |
KR101722382B1 (ko) * | 2016-01-08 | 2017-04-03 | 주식회사 윈텔 | 플라즈마 처리 장치 |
CN116110846A (zh) * | 2016-01-26 | 2023-05-12 | 应用材料公司 | 晶片边缘环升降解决方案 |
CN107316795B (zh) * | 2016-04-26 | 2020-01-03 | 北京北方华创微电子装备有限公司 | 一种聚焦环和等离子体处理装置 |
US10163642B2 (en) * | 2016-06-30 | 2018-12-25 | Taiwan Semiconductor Manufacturing Company, Ltd. | Semiconductor device, method and tool of manufacture |
JP2018006299A (ja) | 2016-07-08 | 2018-01-11 | 東芝メモリ株式会社 | プラズマ処理装置用処理対象支持台、プラズマ処理装置及びプラズマ処理方法 |
US20180122670A1 (en) * | 2016-11-01 | 2018-05-03 | Varian Semiconductor Equipment Associates, Inc. | Removable substrate plane structure ring |
US10032661B2 (en) | 2016-11-18 | 2018-07-24 | Taiwan Semiconductor Manufacturing Company, Ltd. | Semiconductor device, method, and tool of manufacture |
WO2018183245A1 (en) * | 2017-03-31 | 2018-10-04 | Mattson Technology, Inc. | Material deposition prevention on a workpiece in a process chamber |
KR101966793B1 (ko) * | 2017-05-17 | 2019-04-09 | 세메스 주식회사 | 기판 지지 유닛 및 그를 포함하는 기판 처리 장치 |
US11183373B2 (en) | 2017-10-11 | 2021-11-23 | Honeywell International Inc. | Multi-patterned sputter traps and methods of making |
JP6966286B2 (ja) * | 2017-10-11 | 2021-11-10 | 東京エレクトロン株式会社 | プラズマ処理装置、フォーカスリングの昇降制御方法およびフォーカスリングの昇降制御プログラム |
KR102089949B1 (ko) * | 2017-10-20 | 2020-03-19 | 세메스 주식회사 | 기판 처리 장치 및 기판 처리 장치의 부품 |
CN112913000A (zh) * | 2018-10-18 | 2021-06-04 | 朗姆研究公司 | 用于斜面蚀刻器的下等离子体排除区域环 |
JP7117734B2 (ja) * | 2018-12-06 | 2022-08-15 | 東京エレクトロン株式会社 | プラズマ処理装置及びプラズマ処理方法 |
US11551965B2 (en) * | 2018-12-07 | 2023-01-10 | Applied Materials, Inc. | Apparatus to reduce polymers deposition |
KR102647177B1 (ko) * | 2019-02-11 | 2024-03-15 | 삼성전자주식회사 | 플라즈마 처리 장치 |
CN118507324A (zh) * | 2019-06-18 | 2024-08-16 | 朗姆研究公司 | 用于衬底处理系统的缩小直径承载环硬件 |
US11302563B2 (en) * | 2019-06-20 | 2022-04-12 | Corning Incorporated | Carrier for back end of line processing |
KR102214333B1 (ko) | 2019-06-27 | 2021-02-10 | 세메스 주식회사 | 기판 처리 장치 및 기판 처리 방법 |
CN112885690B (zh) * | 2019-11-29 | 2023-10-20 | 中微半导体设备(上海)股份有限公司 | 一种等离子体处理装置 |
CN112992631B (zh) * | 2019-12-16 | 2023-09-29 | 中微半导体设备(上海)股份有限公司 | 一种下电极组件,其安装方法及等离子体处理装置 |
CN111312630A (zh) * | 2020-03-05 | 2020-06-19 | 锐捷光电科技(江苏)有限公司 | 一种单一密封皮圈对于蚀刻均匀性的改善方法 |
JP7398988B2 (ja) * | 2020-03-13 | 2023-12-15 | 東京エレクトロン株式会社 | スパッタ装置 |
KR102177146B1 (ko) * | 2020-04-10 | 2020-11-10 | 비씨엔씨 주식회사 | 플라즈마 공정 챔버용 엣지링 |
US11380575B2 (en) * | 2020-07-27 | 2022-07-05 | Applied Materials, Inc. | Film thickness uniformity improvement using edge ring and bias electrode geometry |
USD1034491S1 (en) | 2020-07-27 | 2024-07-09 | Applied Materials, Inc. | Edge ring |
US12106943B2 (en) | 2021-05-25 | 2024-10-01 | Applied Materials, Inc. | Substrate halo arrangement for improved process uniformity |
US20230066418A1 (en) * | 2021-08-30 | 2023-03-02 | Taiwan Semiconductor Manufacturing Company, Ltd. | Focus ring for a plasma-based semiconductor processing tool |
CN113921365B (zh) * | 2021-09-29 | 2024-03-26 | 北京北方华创微电子装备有限公司 | 半导体工艺设备及其边缘保护机构 |
KR20230094576A (ko) | 2021-12-21 | 2023-06-28 | 삼성전자주식회사 | 링 어셈블리, 기판 지지 장치 및 이를 포함하는 플라즈마 처리 장치 |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2501948B2 (ja) * | 1990-10-26 | 1996-05-29 | 三菱電機株式会社 | プラズマ処理方法及びプラズマ処理装置 |
KR100297358B1 (ko) * | 1991-07-23 | 2001-11-30 | 히가시 데쓰로 | 플라즈마에칭장치 |
US5411624A (en) * | 1991-07-23 | 1995-05-02 | Tokyo Electron Limited | Magnetron plasma processing apparatus |
JPH0529270A (ja) * | 1991-07-23 | 1993-02-05 | Tokyo Electron Ltd | マグネトロンプラズマ処理装置 |
US5662770A (en) | 1993-04-16 | 1997-09-02 | Micron Technology, Inc. | Method and apparatus for improving etch uniformity in remote source plasma reactors with powered wafer chucks |
JP2638443B2 (ja) | 1993-08-31 | 1997-08-06 | 日本電気株式会社 | ドライエッチング方法およびドライエッチング装置 |
KR100264445B1 (ko) * | 1993-10-04 | 2000-11-01 | 히가시 데쓰로 | 플라즈마처리장치 |
US5463525A (en) | 1993-12-20 | 1995-10-31 | International Business Machines Corporation | Guard ring electrostatic chuck |
JP3257741B2 (ja) * | 1994-03-03 | 2002-02-18 | 東京エレクトロン株式会社 | プラズマエッチング装置及び方法 |
JP2659919B2 (ja) | 1994-01-13 | 1997-09-30 | インターナショナル・ビジネス・マシーンズ・コーポレイション | プラズマの不均一性を補正するプラズマ装置 |
US5891348A (en) | 1996-01-26 | 1999-04-06 | Applied Materials, Inc. | Process gas focusing apparatus and method |
JPH09213683A (ja) * | 1996-02-07 | 1997-08-15 | Sony Corp | プラズマエッチング装置 |
US6113731A (en) * | 1997-01-02 | 2000-09-05 | Applied Materials, Inc. | Magnetically-enhanced plasma chamber with non-uniform magnetic field |
WO1999014788A1 (en) | 1997-09-16 | 1999-03-25 | Applied Materials, Inc. | Shield or ring surrounding semiconductor workpiece in plasma chamber |
US6074488A (en) | 1997-09-16 | 2000-06-13 | Applied Materials, Inc | Plasma chamber support having an electrically coupled collar ring |
US6039836A (en) | 1997-12-19 | 2000-03-21 | Lam Research Corporation | Focus rings |
KR100258984B1 (ko) * | 1997-12-24 | 2000-08-01 | 윤종용 | 건식 식각 장치 |
US6117349A (en) * | 1998-08-28 | 2000-09-12 | Taiwan Semiconductor Manufacturing Company, Ltd. | Composite shadow ring equipped with a sacrificial inner ring |
-
1999
- 1999-06-30 US US09/345,639 patent/US6344105B1/en not_active Expired - Lifetime
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2000
- 2000-06-28 TW TW089112761A patent/TW463235B/zh not_active IP Right Cessation
- 2000-06-29 DE DE60044958T patent/DE60044958D1/de not_active Expired - Lifetime
- 2000-06-29 KR KR1020017016518A patent/KR100743872B1/ko active IP Right Grant
- 2000-06-29 JP JP2001506576A patent/JP4792185B2/ja not_active Expired - Lifetime
- 2000-06-29 AU AU59086/00A patent/AU5908600A/en not_active Abandoned
- 2000-06-29 DE DE60038175T patent/DE60038175T2/de not_active Expired - Lifetime
- 2000-06-29 CN CNB008097933A patent/CN100392791C/zh not_active Expired - Lifetime
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- 2000-06-29 EP EP00945097A patent/EP1198821B1/de not_active Expired - Lifetime
- 2000-06-29 CN CN2008100852345A patent/CN101241846B/zh not_active Expired - Lifetime
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2010
- 2010-10-21 JP JP2010236658A patent/JP2011014943A/ja active Pending
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JP4792185B2 (ja) | 2011-10-12 |
CN101241846A (zh) | 2008-08-13 |
US6344105B1 (en) | 2002-02-05 |
EP1198821B1 (de) | 2008-02-27 |
WO2001001445A1 (en) | 2001-01-04 |
EP1198821A1 (de) | 2002-04-24 |
TW463235B (en) | 2001-11-11 |
CN1373899A (zh) | 2002-10-09 |
CN100392791C (zh) | 2008-06-04 |
AU5908600A (en) | 2001-01-31 |
KR20020041340A (ko) | 2002-06-01 |
DE60038175D1 (de) | 2008-04-10 |
CN101241846B (zh) | 2010-08-11 |
EP1898444B1 (de) | 2010-09-08 |
EP1898444A1 (de) | 2008-03-12 |
JP2003503841A (ja) | 2003-01-28 |
JP2011014943A (ja) | 2011-01-20 |
KR100743872B1 (ko) | 2007-07-30 |
DE60038175T2 (de) | 2009-03-12 |
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