DE60142916D1 - Ätzverfahren - Google Patents
ÄtzverfahrenInfo
- Publication number
- DE60142916D1 DE60142916D1 DE60142916T DE60142916T DE60142916D1 DE 60142916 D1 DE60142916 D1 DE 60142916D1 DE 60142916 T DE60142916 T DE 60142916T DE 60142916 T DE60142916 T DE 60142916T DE 60142916 D1 DE60142916 D1 DE 60142916D1
- Authority
- DE
- Germany
- Prior art keywords
- etching
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000005530 etching Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/805—Electrodes
- H10K50/81—Anodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/805—Electrodes
- H10K50/82—Cathodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/20—Changing the shape of the active layer in the devices, e.g. patterning
- H10K71/231—Changing the shape of the active layer in the devices, e.g. patterning by etching of existing layers
- H10K71/236—Changing the shape of the active layer in the devices, e.g. patterning by etching of existing layers using printing techniques, e.g. applying the etch liquid using an ink jet printer
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/17—Passive-matrix OLED displays
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Optics & Photonics (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electroluminescent Light Sources (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB0025342A GB2367788A (en) | 2000-10-16 | 2000-10-16 | Etching using an ink jet print head |
PCT/GB2001/004591 WO2002033740A1 (en) | 2000-10-16 | 2001-10-15 | Etching process |
Publications (1)
Publication Number | Publication Date |
---|---|
DE60142916D1 true DE60142916D1 (de) | 2010-10-07 |
Family
ID=9901387
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60142916T Expired - Lifetime DE60142916D1 (de) | 2000-10-16 | 2001-10-15 | Ätzverfahren |
Country Status (8)
Country | Link |
---|---|
US (1) | US7431860B2 (de) |
EP (1) | EP1327259B1 (de) |
JP (2) | JP4269680B2 (de) |
KR (1) | KR100496473B1 (de) |
CN (1) | CN1311532C (de) |
DE (1) | DE60142916D1 (de) |
GB (1) | GB2367788A (de) |
WO (1) | WO2002033740A1 (de) |
Families Citing this family (73)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7550794B2 (en) * | 2002-09-20 | 2009-06-23 | Idc, Llc | Micromechanical systems device comprising a displaceable electrode and a charge-trapping layer |
JP3932099B2 (ja) * | 2002-02-06 | 2007-06-20 | セイコーエプソン株式会社 | エッチング方法 |
EP1525630A2 (de) * | 2002-07-29 | 2005-04-27 | Siemens Aktiengesellschaft | Elektronisches bauteil mit vorwiegend organischen funktionsmaterialien und herstellungsverfahren dazu |
GB0218202D0 (en) | 2002-08-06 | 2002-09-11 | Avecia Ltd | Organic light emitting diodes |
US7781850B2 (en) | 2002-09-20 | 2010-08-24 | Qualcomm Mems Technologies, Inc. | Controlling electromechanical behavior of structures within a microelectromechanical systems device |
JP2004172389A (ja) | 2002-11-20 | 2004-06-17 | Renesas Technology Corp | 半導体装置およびその製造方法 |
KR100985418B1 (ko) * | 2002-11-26 | 2010-10-05 | 이 잉크 코포레이션 | 가요성 전자 회로 및 디스플레이 |
AU2004271225B2 (en) * | 2003-09-09 | 2010-01-21 | Csg Solar Ag | Improved method of forming openings in an organic resin material |
WO2005024920A1 (en) * | 2003-09-09 | 2005-03-17 | Csg Solar, Ag | Improved method of forming openings in an organic resin material |
AU2004271223B2 (en) * | 2003-09-09 | 2010-02-18 | Csg Solar Ag | Improved method of etching silicon |
US7592201B2 (en) | 2003-09-09 | 2009-09-22 | Csg Solar Ag | Adjustments of masks by re-flow |
JP2007505485A (ja) | 2003-09-09 | 2007-03-08 | シーエスジー ソーラー アクチェンゲゼルシャフト | シリコンをエッチングする方法の改良 |
DE10358830B3 (de) * | 2003-12-16 | 2005-08-18 | Framatome Anp Gmbh | Brennelement für einen Druckwasserkernreaktor und mit solchen Brennelementen aufgebauter Kern eines Druckwasserreaktors |
US7036220B2 (en) * | 2003-12-18 | 2006-05-02 | The Regents Of The University Of California | Pin-deposition of conductive inks for microelectrodes and contact via filling |
CN100338746C (zh) * | 2004-01-05 | 2007-09-19 | 财团法人工业技术研究院 | 一种形成导电栓柱的方法 |
US7449215B2 (en) * | 2004-03-05 | 2008-11-11 | Toshiba Matsushita Display Technology Co., Ltd. | Method of manufacturing display device |
JP2006019672A (ja) * | 2004-06-02 | 2006-01-19 | Seiko Epson Corp | トランジスタの製造方法、電気光学装置の製造方法、および電子デバイスの製造方法 |
JP3879751B2 (ja) * | 2004-07-27 | 2007-02-14 | セイコーエプソン株式会社 | コンタクトホールの形成方法、回路基板の製造方法、及び、電気光学装置の製造方法 |
KR101313117B1 (ko) * | 2004-07-29 | 2013-09-30 | 퀄컴 엠이엠에스 테크놀로지스, 인크. | 간섭 변조기의 미소기전 동작을 위한 시스템 및 방법 |
US7105375B2 (en) * | 2004-07-30 | 2006-09-12 | Xerox Corporation | Reverse printing |
JP2006075687A (ja) * | 2004-09-08 | 2006-03-23 | Seiko Epson Corp | 液滴吐出装置、ヘッドのクリーニング方法、電気光学装置の製造方法、電気光学装置および電子機器 |
US8691667B1 (en) * | 2004-12-30 | 2014-04-08 | E. I. Du Pont De Nemours And Company | Method and apparatus for depositing a pattern on a substrate |
TW200628877A (en) * | 2005-02-04 | 2006-08-16 | Prime View Int Co Ltd | Method of manufacturing optical interference type color display |
US7691280B2 (en) * | 2005-03-25 | 2010-04-06 | E. I. Du Pont De Nemours And Company | Ink jet printing of etchants and modifiers |
US7667929B2 (en) * | 2005-04-04 | 2010-02-23 | Hitachi Global Storage Technologies Netherlands B.V. | Apparatus, method and system for fabricating a patterned media imprint master |
JP4341579B2 (ja) * | 2005-05-19 | 2009-10-07 | セイコーエプソン株式会社 | マイクロレンズの製造方法 |
EP1891690A1 (de) * | 2005-06-16 | 2008-02-27 | Siemens Aktiengesellschaft | Organischer zeilendetektor und verfahren zu seiner herstellung |
KR20080040715A (ko) * | 2005-07-22 | 2008-05-08 | 콸콤 인코포레이티드 | Mems 장치를 위한 지지 구조물 및 그 방법들 |
EP2495212A3 (de) * | 2005-07-22 | 2012-10-31 | QUALCOMM MEMS Technologies, Inc. | MEMS-Vorrichtungen mit Stützstrukturen und Herstellungsverfahren dafür |
US7795061B2 (en) * | 2005-12-29 | 2010-09-14 | Qualcomm Mems Technologies, Inc. | Method of creating MEMS device cavities by a non-etching process |
KR100753959B1 (ko) * | 2006-01-12 | 2007-08-31 | 에이펫(주) | 기판 건조장치를 이용한 기판 건조방법 |
US7382515B2 (en) * | 2006-01-18 | 2008-06-03 | Qualcomm Mems Technologies, Inc. | Silicon-rich silicon nitrides as etch stops in MEMS manufacture |
US7450295B2 (en) * | 2006-03-02 | 2008-11-11 | Qualcomm Mems Technologies, Inc. | Methods for producing MEMS with protective coatings using multi-component sacrificial layers |
US20070249078A1 (en) * | 2006-04-19 | 2007-10-25 | Ming-Hau Tung | Non-planar surface structures and process for microelectromechanical systems |
GB2439594A (en) * | 2006-06-07 | 2008-01-02 | Seiko Epson Corp | A method for forming a predetermined pattern of an organic semiconductor |
US7763546B2 (en) * | 2006-08-02 | 2010-07-27 | Qualcomm Mems Technologies, Inc. | Methods for reducing surface charges during the manufacture of microelectromechanical systems devices |
US7993960B2 (en) | 2006-12-13 | 2011-08-09 | Samsung Mobile Display Co., Ltd. | Electronic device and method of manufacturing the same |
EP1933393A1 (de) * | 2006-12-13 | 2008-06-18 | Samsung SDI Co., Ltd. | Verfahren zur Herstellung ein Substrat für eine elektronische Vorrichtung |
US7733552B2 (en) * | 2007-03-21 | 2010-06-08 | Qualcomm Mems Technologies, Inc | MEMS cavity-coating layers and methods |
US7719752B2 (en) * | 2007-05-11 | 2010-05-18 | Qualcomm Mems Technologies, Inc. | MEMS structures, methods of fabricating MEMS components on separate substrates and assembly of same |
JP5501225B2 (ja) * | 2007-05-24 | 2014-05-21 | インターナショナル・ビジネス・マシーンズ・コーポレーション | 薄層型光電池の背面コンタクト形成方法 |
US7838062B2 (en) * | 2007-05-29 | 2010-11-23 | Sunpower Corporation | Array of small contacts for solar cell fabrication |
WO2009094711A1 (en) * | 2008-02-01 | 2009-08-06 | Newsouth Innovations Pty Limited | Method for patterned etching of selected material |
US20090261067A1 (en) * | 2008-04-22 | 2009-10-22 | Robert Alan Dietrich | Methods and apparatus for prototyping three dimensional objects from a plurality of layers |
CN101590775A (zh) * | 2008-05-28 | 2009-12-02 | Icf科技有限公司 | 塑胶元件表面处理方法 |
US7851239B2 (en) * | 2008-06-05 | 2010-12-14 | Qualcomm Mems Technologies, Inc. | Low temperature amorphous silicon sacrificial layer for controlled adhesion in MEMS devices |
FR2937181B1 (fr) * | 2008-10-10 | 2011-01-14 | Commissariat Energie Atomique | Structuration en surface de couches minces par ejection localisee de liquide immiscible. |
JP5396916B2 (ja) * | 2009-03-03 | 2014-01-22 | コニカミノルタ株式会社 | 透明電極の製造方法、透明電極および有機エレクトロルミネッセンス素子 |
US7864403B2 (en) * | 2009-03-27 | 2011-01-04 | Qualcomm Mems Technologies, Inc. | Post-release adjustment of interferometric modulator reflectivity |
KR20120036939A (ko) * | 2009-06-04 | 2012-04-18 | 메르크 파텐트 게엠베하 | 2성분 에칭 |
WO2011032218A1 (en) * | 2009-09-18 | 2011-03-24 | Newsouth Innovations Pty Limited | Method for texturing surfaces |
KR101621340B1 (ko) * | 2009-10-23 | 2016-05-16 | 엠-솔브 리미티드 | 정전 용량성 터치 패널들 |
US8415183B2 (en) * | 2010-11-22 | 2013-04-09 | Tsmc Solid State Lighting Ltd. | Wafer level conformal coating for LED devices |
WO2012099607A1 (en) * | 2011-01-21 | 2012-07-26 | Hewlett-Packard Development Company, L.P. | Copolymers for luminescence enhancement in reflective display applications |
CN102206892A (zh) * | 2011-05-26 | 2011-10-05 | 姚先均 | 织袜机的落袜筒及其生产方法 |
US9680097B2 (en) | 2013-04-06 | 2017-06-13 | Indian Institute Of Technology Kanpur | Organic thin film transistors and methods for their manufacturing and use |
KR102135275B1 (ko) | 2013-07-29 | 2020-07-20 | 삼성디스플레이 주식회사 | 박막 트랜지스터 기판, 이의 제조 방법 및 이를 포함하는 표시 장치 |
KR101577900B1 (ko) * | 2014-06-24 | 2015-12-29 | 동국대학교 산학협력단 | 국부적 에칭공정을 이용한 유기박막 트랜지스터 및 이의 제조방법 |
NO2750604T3 (de) | 2015-06-25 | 2018-03-03 | ||
JP2018530902A (ja) * | 2015-07-03 | 2018-10-18 | ナショナル リサーチ カウンシル オブ カナダ | 隙間が極細の配線を印刷する方法 |
DE102016224870A1 (de) * | 2016-12-13 | 2018-06-14 | Robert Bosch Gmbh | Verfahren zur Herstellung einer Leiterbildstruktur auf einem mit Metall beschichteten Substrat und Bauteil |
HUE050387T2 (hu) | 2017-06-13 | 2020-11-30 | Hymmen Gmbh Maschinen & Anlagenbau | Eljárás és eszköz strukturált felület kialakítására |
CN108281467A (zh) * | 2018-01-22 | 2018-07-13 | 京东方科技集团股份有限公司 | 像素界定层、显示基板及其制作方法、显示装置 |
KR20190111547A (ko) * | 2018-03-23 | 2019-10-02 | 엘지전자 주식회사 | 가전제품용 외장패널 및 그 제조방법 |
IT201900007377A1 (it) * | 2019-05-28 | 2020-11-28 | Giorgio Macor | Metodo e apparato per generare una struttura superficiale |
IT201800008133A1 (it) * | 2018-08-22 | 2020-02-22 | Giorgio Macor | Metodo e apparato per generare una struttura tridimensionale |
KR20210060496A (ko) | 2018-08-30 | 2021-05-26 | 인터페이스 인크. | 바닥재 및 장식용 구조체들을 위한 디지털 인쇄 |
CN109212827A (zh) * | 2018-08-31 | 2019-01-15 | 深圳市华星光电技术有限公司 | 一种柔性lcd及其制备方法 |
CN109972128A (zh) * | 2019-03-29 | 2019-07-05 | 南昌大学 | 喷墨打印结合无电镀工艺制备超薄金属网格柔性透明电极的方法 |
DE102019206431A1 (de) | 2019-05-03 | 2020-11-05 | Hymmen GmbH Maschinen- und Anlagenbau | Verfahren zum Herstellen einer Struktur auf einer Oberfläche |
KR102260364B1 (ko) * | 2019-12-11 | 2021-06-02 | 가천대학교 산학협력단 | 물방울의 공명주파수를 이용한 에칭장치 및 이를 이용한 에칭방법 |
JP7404878B2 (ja) * | 2020-01-09 | 2023-12-26 | コニカミノルタ株式会社 | 有機エレクトロルミネッセンス素子及びその製造方法 |
EP3865308A1 (de) | 2020-02-12 | 2021-08-18 | Jesús Francisco Barberan Latorre | Verfahren und maschine zur herstellung von reliefs sowie paneele mit diesen reliefs |
Family Cites Families (28)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1521965A1 (de) * | 1964-10-12 | 1969-05-14 | Siemens Ag | Verfahren zum Zerteilen metallbeschichteter Si-Scheiben |
DE3047884A1 (de) * | 1980-12-18 | 1982-07-15 | Siemens AG, 1000 Berlin und 8000 München | Vorrichtung zur automatisierbaren bearbeitung in der halbleitertechnologie, z.b. von leiterplatten |
DE3338717A1 (de) * | 1983-10-25 | 1985-05-02 | Siemens AG, 1000 Berlin und 8000 München | Verfahren zur herstellung einer roentgenmaske mit metalltraegerfolie |
US4849066A (en) * | 1988-09-23 | 1989-07-18 | Rca Licensing Corporation | Method for selectively etching integral cathode substrate and support utilizing increased etchant turbulence |
JPH0325937A (ja) * | 1989-06-22 | 1991-02-04 | Mitsubishi Electric Corp | 半導体装置の製造方法 |
JPH04225231A (ja) * | 1990-12-26 | 1992-08-14 | Kawasaki Steel Corp | シリコンウエハのエッチング方法及びその装置 |
US5275658A (en) * | 1991-12-13 | 1994-01-04 | Tokyo Electron Limited | Liquid supply apparatus |
JPH05303009A (ja) * | 1992-04-28 | 1993-11-16 | Dainippon Printing Co Ltd | マイクロレンズアレー原版およびマイクロレンズアレー作製方法 |
GB2294909B (en) * | 1994-11-14 | 1996-10-23 | High End Systems Inc | Acid etched gobo |
JP3370459B2 (ja) * | 1994-11-15 | 2003-01-27 | 積水化学工業株式会社 | 撥水性被膜の製造方法 |
JPH08279484A (ja) * | 1995-04-07 | 1996-10-22 | Hitachi Cable Ltd | 半導体ウェハのエッチング方法及び装置 |
JP3753194B2 (ja) * | 1995-12-14 | 2006-03-08 | セイコーエプソン株式会社 | プラズマ処理方法及びその装置 |
DE69724107T2 (de) * | 1996-03-04 | 2004-06-24 | DuPont Displays, Inc., Santa Barbara | Polyfluorene als materialien für photolumineszenz und elektrolumineszenz |
US5882489A (en) * | 1996-04-26 | 1999-03-16 | Ulvac Technologies, Inc. | Processes for cleaning and stripping photoresist from surfaces of semiconductor wafers |
US6106907A (en) * | 1996-06-25 | 2000-08-22 | Canon Kabushiki Kaisha | Electrode plate, liquid crystal device and production thereof |
US5677237A (en) * | 1996-06-21 | 1997-10-14 | Taiwan Semiconductor Manufacturing Company Ltd. | Process for removing seams in tungsten plugs |
JPH10106747A (ja) * | 1996-09-26 | 1998-04-24 | Mitsubishi Electric Corp | 有機エレクトロルミネッセンス表示装置およびその製法 |
JP3612158B2 (ja) * | 1996-11-18 | 2005-01-19 | スピードファム株式会社 | プラズマエッチング方法及びその装置 |
JP3785710B2 (ja) * | 1996-12-24 | 2006-06-14 | 株式会社デンソー | El表示装置 |
WO1999021233A1 (en) * | 1997-10-17 | 1999-04-29 | The Regents Of The University Of California | Process for fabricating organic semiconductor devices using ink-jet printing technology and device and system employing same |
JP4003273B2 (ja) | 1998-01-19 | 2007-11-07 | セイコーエプソン株式会社 | パターン形成方法および基板製造装置 |
GB9808061D0 (en) * | 1998-04-16 | 1998-06-17 | Cambridge Display Tech Ltd | Polymer devices |
JP3564294B2 (ja) | 1998-04-20 | 2004-09-08 | シャープ株式会社 | 薄膜elパネルおよびその製造方法およびカラーelパネル装置 |
US6033939A (en) * | 1998-04-21 | 2000-03-07 | International Business Machines Corporation | Method for providing electrically fusible links in copper interconnection |
JP2000104182A (ja) * | 1998-09-30 | 2000-04-11 | Seiko Epson Corp | ウェットエッチング方法および装置、インクジェットヘッドの振動板の製造方法、インクジェットヘッド、並びにインクジェット記録装置 |
JP2000171814A (ja) | 1998-12-07 | 2000-06-23 | Hitachi Ltd | 液晶パネル基板の導電性薄膜パターニング方法および装置 |
CA2394895C (en) | 1999-12-21 | 2014-01-28 | Plastic Logic Limited | Forming interconnects |
GB2373095A (en) * | 2001-03-09 | 2002-09-11 | Seiko Epson Corp | Patterning substrates with evaporation residues |
-
2000
- 2000-10-16 GB GB0025342A patent/GB2367788A/en not_active Withdrawn
-
2001
- 2001-10-15 EP EP01974535A patent/EP1327259B1/de not_active Expired - Lifetime
- 2001-10-15 DE DE60142916T patent/DE60142916D1/de not_active Expired - Lifetime
- 2001-10-15 CN CNB018051936A patent/CN1311532C/zh not_active Expired - Fee Related
- 2001-10-15 JP JP2002537042A patent/JP4269680B2/ja not_active Expired - Fee Related
- 2001-10-15 US US10/149,392 patent/US7431860B2/en not_active Expired - Fee Related
- 2001-10-15 WO PCT/GB2001/004591 patent/WO2002033740A1/en active IP Right Grant
- 2001-10-15 KR KR10-2002-7007648A patent/KR100496473B1/ko not_active IP Right Cessation
-
2008
- 2008-05-16 JP JP2008129365A patent/JP4544343B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
KR20020062757A (ko) | 2002-07-29 |
CN1404625A (zh) | 2003-03-19 |
JP2004512642A (ja) | 2004-04-22 |
KR100496473B1 (ko) | 2005-06-22 |
EP1327259B1 (de) | 2010-08-25 |
US7431860B2 (en) | 2008-10-07 |
JP4544343B2 (ja) | 2010-09-15 |
WO2002033740A1 (en) | 2002-04-25 |
GB2367788A (en) | 2002-04-17 |
GB0025342D0 (en) | 2000-11-29 |
JP2008235284A (ja) | 2008-10-02 |
JP4269680B2 (ja) | 2009-05-27 |
EP1327259A1 (de) | 2003-07-16 |
CN1311532C (zh) | 2007-04-18 |
US20030029831A1 (en) | 2003-02-13 |
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ATE509008T1 (de) | Sulfonylguanidine | |
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