DE60039257D1 - Verfahren zur herstellung einer kupferfolie mit au - Google Patents

Verfahren zur herstellung einer kupferfolie mit au

Info

Publication number
DE60039257D1
DE60039257D1 DE60039257T DE60039257T DE60039257D1 DE 60039257 D1 DE60039257 D1 DE 60039257D1 DE 60039257 T DE60039257 T DE 60039257T DE 60039257 T DE60039257 T DE 60039257T DE 60039257 D1 DE60039257 D1 DE 60039257D1
Authority
DE
Germany
Prior art keywords
producing
copper film
copper
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60039257T
Other languages
English (en)
Inventor
Kouji Kitano
Mikio Hanafusa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Mining Holdings Inc
Eneos Corp
Original Assignee
Nippon Mining and Metals Co Ltd
Nippon Mining Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=18551938&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=DE60039257(D1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Nippon Mining and Metals Co Ltd, Nippon Mining Co Ltd filed Critical Nippon Mining and Metals Co Ltd
Application granted granted Critical
Publication of DE60039257D1 publication Critical patent/DE60039257D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/18—Working by laser beam, e.g. welding, cutting or boring using absorbing layers on the workpiece, e.g. for marking or protecting purposes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
    • H05K3/0038—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material combined with laser drilling through a metal layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/34—Coated articles, e.g. plated or painted; Surface treated articles
    • B23K2101/35—Surface treated articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/08—Non-ferrous metals or alloys
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/08—Non-ferrous metals or alloys
    • B23K2103/12—Copper or alloys thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0723—Electroplating, e.g. finish plating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12361—All metal or with adjacent metals having aperture or cut
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12431—Foil or filament smaller than 6 mils
    • Y10T428/12438—Composite
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12639—Adjacent, identical composition, components
    • Y10T428/12646—Group VIII or IB metal-base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12861—Group VIII or IB metal-base component
    • Y10T428/12903—Cu-base component
DE60039257T 2000-02-03 2000-12-04 Verfahren zur herstellung einer kupferfolie mit au Expired - Lifetime DE60039257D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2000026174A JP3258308B2 (ja) 2000-02-03 2000-02-03 レーザー穴開け性に優れた銅箔及びその製造方法
PCT/JP2000/008578 WO2001058225A1 (fr) 2000-02-03 2000-12-04 Feuillard de cuivre presentant des capacites excellentes de perçage au faisceau laser et son procede de production

Publications (1)

Publication Number Publication Date
DE60039257D1 true DE60039257D1 (de) 2008-07-31

Family

ID=18551938

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60039257T Expired - Lifetime DE60039257D1 (de) 2000-02-03 2000-12-04 Verfahren zur herstellung einer kupferfolie mit au

Country Status (9)

Country Link
US (1) US6638642B2 (de)
EP (2) EP1276358B1 (de)
JP (1) JP3258308B2 (de)
KR (1) KR100483517B1 (de)
CN (1) CN1204791C (de)
DE (1) DE60039257D1 (de)
MY (1) MY126842A (de)
TW (1) TW578451B (de)
WO (1) WO2001058225A1 (de)

Families Citing this family (40)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3628585B2 (ja) 2000-04-05 2005-03-16 株式会社日鉱マテリアルズ 銅張り積層板及び銅張り積層板のレーザーによる穴開け方法
JP3690962B2 (ja) * 2000-04-26 2005-08-31 三井金属鉱業株式会社 キャリア箔付電解銅箔及びそのキャリア箔付電解銅箔の製造方法並びに銅張積層板
US6893742B2 (en) * 2001-02-15 2005-05-17 Olin Corporation Copper foil with low profile bond enhancement
KR100618511B1 (ko) * 2002-03-05 2006-08-31 히다치 가세고교 가부시끼가이샤 수지 부착 금속박, 금속 피복 적층판, 그를 이용한 프린트배선판 및 그의 제조 방법
JP2004006612A (ja) * 2002-04-12 2004-01-08 Mitsui Mining & Smelting Co Ltd キャリア箔付銅箔及びそのキャリア箔付銅箔の製造方法並びにそのキャリア箔付銅箔を用いた銅張積層板
JP4115293B2 (ja) * 2003-02-17 2008-07-09 古河サーキットフォイル株式会社 チップオンフィルム用銅箔
JP2004307884A (ja) * 2003-04-03 2004-11-04 Fukuda Metal Foil & Powder Co Ltd プリント配線板用銅箔
JP2004314568A (ja) * 2003-04-21 2004-11-11 Fukuda Metal Foil & Powder Co Ltd プリント配線板用銅箔
JP4065215B2 (ja) * 2003-05-13 2008-03-19 福田金属箔粉工業株式会社 プリント配線板用銅箔
CN100515167C (zh) * 2004-02-17 2009-07-15 日矿金属株式会社 具有黑化处理表面或层的铜箔
US20070209547A1 (en) * 2004-08-10 2007-09-13 Nippon Mining & Metals Co., Ltd. Barrier Film For Flexible Copper Substrate And Sputtering Target For Forming Barrier Film
CN100418695C (zh) * 2004-09-20 2008-09-17 长春石油化学股份有限公司 铜箔的制法
JP2006312265A (ja) * 2005-05-09 2006-11-16 Furukawa Circuit Foil Kk キャリア付き極薄銅箔および該極薄銅箔を用いたプリント配線板、多層プリント配線板
WO2006137240A1 (ja) * 2005-06-23 2006-12-28 Nippon Mining & Metals Co., Ltd. プリント配線板用銅箔
WO2007145164A1 (ja) * 2006-06-12 2007-12-21 Nippon Mining & Metals Co., Ltd. 粗化処理面を備えた圧延銅又は銅合金箔及び圧延銅又は銅合金箔の粗化方法
KR20090080978A (ko) * 2006-11-29 2009-07-27 닛코 킨조쿠 가부시키가이샤 2 층 구리 피복 적층판
KR20120034750A (ko) * 2007-03-20 2012-04-12 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤 무접착제 플렉시블 라미네이트 및 그 제조 방법
CN101669237A (zh) * 2007-04-20 2010-03-10 日矿金属株式会社 锂二次电池用电解铜箔及该铜箔的制造方法
US8642893B2 (en) * 2007-09-28 2014-02-04 Jx Nippon Mining & Metals Corporation Copper foil for printed circuit and copper-clad laminate
WO2009050970A1 (ja) 2007-10-18 2009-04-23 Nippon Mining & Metals Co., Ltd. 金属被覆ポリイミド複合体、同複合体の製造方法及び同複合体の製造装置
US8568899B2 (en) * 2007-10-18 2013-10-29 Jx Nippon Mining & Metals Corporation Metal covered polyimide composite, process for producing the composite, and process for producing electronic circuit board
KR101199816B1 (ko) * 2007-12-27 2012-11-12 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤 2 층 동장 적층판의 제조 방법 및 2 층 동장 적층판
KR20130012592A (ko) * 2008-02-04 2013-02-04 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤 무접착제 플렉시블 라미네이트
KR101289803B1 (ko) * 2008-05-16 2013-07-26 삼성테크윈 주식회사 회로 기판 및 그 제조 방법
US8142905B2 (en) * 2008-06-17 2012-03-27 Jx Nippon Mining & Metals Corporation Copper foil for printed circuit board and copper clad laminate for printed circuit board
EP2366469A1 (de) * 2008-11-25 2011-09-21 JX Nippon Mining & Metals Corporation Verfahren zum aufwickeln von kupferfolien oder von kupferkaschiertem laminat
KR101288641B1 (ko) 2008-11-25 2013-07-22 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤 인쇄 회로용 동박
JP2009143234A (ja) 2008-12-24 2009-07-02 Nippon Mining & Metals Co Ltd キャリア付金属箔
EP2371535A4 (de) 2008-12-26 2012-05-09 Jx Nippon Mining & Metals Corp Flexible beschichtung und mit deren hilfe geformtes flexibles substrat für elektronische schaltungen
KR101224034B1 (ko) * 2010-05-03 2013-01-18 엘에스엠트론 주식회사 인쇄회로용 동박 및 그 제조방법
WO2012043182A1 (ja) 2010-09-27 2012-04-05 Jx日鉱日石金属株式会社 プリント配線板用銅箔、その製造方法、プリント配線板用樹脂基板及びプリント配線板
CN103459679B (zh) 2011-03-25 2016-06-15 吉坤日矿日石金属株式会社 具备粗化处理面的压延铜或铜合金箔
US9338898B2 (en) * 2012-03-09 2016-05-10 Mitsui Mining & Smelting Co., Ltd. Method of producing a printed wiring board
CN103972513B (zh) * 2013-02-06 2016-08-17 永箔科技股份有限公司 多孔性集流体金属材料连续加工法
WO2014136763A1 (ja) * 2013-03-05 2014-09-12 三井金属鉱業株式会社 レーザー加工用銅箔、キャリア箔付レーザー加工用銅箔、銅張積層体及びプリント配線板の製造方法
TWI483657B (zh) * 2013-11-15 2015-05-01 Unimicron Technology Corp 線路板的鑽孔方法
WO2018193935A1 (ja) * 2017-04-17 2018-10-25 住友金属鉱山株式会社 導電性基板、導電性基板の製造方法
CN108156759B (zh) * 2017-12-28 2019-12-24 广州兴森快捷电路科技有限公司 印制电路板激光孔径偏小的返工方法
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CN111560611A (zh) * 2020-05-07 2020-08-21 上海交通大学 一种钛合金表面激光熔覆制备镍基涂层的过渡层方法

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Also Published As

Publication number Publication date
CN1204791C (zh) 2005-06-01
US20030031888A1 (en) 2003-02-13
CN1387745A (zh) 2002-12-25
EP1276358A4 (de) 2005-06-22
KR20020074223A (ko) 2002-09-28
EP1276358B1 (de) 2008-06-18
US6638642B2 (en) 2003-10-28
EP1781073A3 (de) 2007-05-30
EP1276358A1 (de) 2003-01-15
MY126842A (en) 2006-10-31
KR100483517B1 (ko) 2005-04-15
WO2001058225A1 (fr) 2001-08-09
JP2001217516A (ja) 2001-08-10
JP3258308B2 (ja) 2002-02-18
EP1781073A2 (de) 2007-05-02
TW578451B (en) 2004-03-01

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