DE60011199T2 - Harzzusammensetzung zur Einkapselung von Halbleitern, Halbleiteranordnungen die diese enthalten und Verfahren für die Herstellung von diesen Halbleiteranordnungen - Google Patents
Harzzusammensetzung zur Einkapselung von Halbleitern, Halbleiteranordnungen die diese enthalten und Verfahren für die Herstellung von diesen Halbleiteranordnungen Download PDFInfo
- Publication number
- DE60011199T2 DE60011199T2 DE60011199T DE60011199T DE60011199T2 DE 60011199 T2 DE60011199 T2 DE 60011199T2 DE 60011199 T DE60011199 T DE 60011199T DE 60011199 T DE60011199 T DE 60011199T DE 60011199 T2 DE60011199 T2 DE 60011199T2
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- semiconductor
- resin composition
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- resin
- electrically wired
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/06—Containers; Seals characterised by the material of the container or its electrical properties
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12044—OLED
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28588299 | 1999-10-06 | ||
| JP28588299 | 1999-10-06 | ||
| JP2000244064 | 2000-08-11 | ||
| JP2000244064 | 2000-08-11 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DE60011199D1 DE60011199D1 (de) | 2004-07-08 |
| DE60011199T2 true DE60011199T2 (de) | 2004-09-30 |
Family
ID=26556063
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE60011199T Expired - Fee Related DE60011199T2 (de) | 1999-10-06 | 2000-10-06 | Harzzusammensetzung zur Einkapselung von Halbleitern, Halbleiteranordnungen die diese enthalten und Verfahren für die Herstellung von diesen Halbleiteranordnungen |
Country Status (9)
Families Citing this family (35)
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| JP3430150B2 (ja) | 2000-12-18 | 2003-07-28 | 日東電工株式会社 | 光半導体素子封止用エポキシ樹脂組成物の製造方法 |
| JP2002212537A (ja) * | 2001-01-24 | 2002-07-31 | Sony Chem Corp | 接着剤及び電気装置 |
| JP3865601B2 (ja) | 2001-06-12 | 2007-01-10 | 日東電工株式会社 | 電磁波抑制体シート |
| EP1312580B1 (en) * | 2001-11-16 | 2007-01-24 | STMicroelectronics S.r.l. | Process for sealing devices incorporating microstructures |
| KR100480946B1 (ko) * | 2001-12-28 | 2005-04-07 | 제일모직주식회사 | 내크랙성 및 열전도율이 향상된 반도체 소자 밀봉용에폭시 수지 조성물 |
| MY139328A (en) * | 2002-05-20 | 2009-09-30 | Nitto Denko Corp | Thermosetting resin composition and semiconductor device obtained with the same |
| US20050181214A1 (en) * | 2002-11-22 | 2005-08-18 | John Robert Campbell | Curable epoxy compositions, methods and articles made therefrom |
| US20060147719A1 (en) * | 2002-11-22 | 2006-07-06 | Slawomir Rubinsztajn | Curable composition, underfill, and method |
| US20050266263A1 (en) * | 2002-11-22 | 2005-12-01 | General Electric Company | Refractory solid, adhesive composition, and device, and associated method |
| US20050170188A1 (en) * | 2003-09-03 | 2005-08-04 | General Electric Company | Resin compositions and methods of use thereof |
| US20050049334A1 (en) * | 2003-09-03 | 2005-03-03 | Slawomir Rubinsztain | Solvent-modified resin system containing filler that has high Tg, transparency and good reliability in wafer level underfill applications |
| US20050048700A1 (en) * | 2003-09-02 | 2005-03-03 | Slawomir Rubinsztajn | No-flow underfill material having low coefficient of thermal expansion and good solder ball fluxing performance |
| EP1557880A1 (en) * | 2004-01-21 | 2005-07-27 | Nitto Denko Corporation | Resin composition for encapsulating semiconductor |
| GB0412196D0 (en) * | 2004-06-02 | 2004-07-07 | Hexcel Composites Ltd | Cure accelerators |
| US7446136B2 (en) * | 2005-04-05 | 2008-11-04 | Momentive Performance Materials Inc. | Method for producing cure system, adhesive system, and electronic device |
| US7405246B2 (en) * | 2005-04-05 | 2008-07-29 | Momentive Performance Materials Inc. | Cure system, adhesive system, electronic device |
| WO2007037378A1 (ja) * | 2005-09-29 | 2007-04-05 | Asahi Kasei Chemicals Corporation | 高安定性マイクロカプセル型エポキシ樹脂用硬化剤及びエポキシ樹脂組成物 |
| EP1980580A1 (en) * | 2006-02-03 | 2008-10-15 | Asahi Kasei Chemicals Corporation | Microcapsule type hardener for epoxy resin, masterbatch type hardener composition for epoxy resin, one-pack type epoxy resin composition, and processed article |
| JP4316604B2 (ja) * | 2006-12-08 | 2009-08-19 | 株式会社東芝 | 電源一体型半導体モジュールおよびその製造方法 |
| WO2008075655A1 (ja) * | 2006-12-18 | 2008-06-26 | Shiima Electronics Inc. | リードフレーム固定材、リードフレーム、及び半導体装置 |
| KR100983096B1 (ko) | 2007-11-28 | 2010-09-17 | (주)에버텍엔터프라이즈 | 내습성 및 흐름성이 우수한 언더필용 하이브리드 에폭시조성물 |
| KR100896481B1 (ko) * | 2007-11-28 | 2009-05-08 | (주)에버텍엔터프라이즈 | 열전도성이 우수한 언더필용 에폭시 조성물 |
| US20110105646A1 (en) * | 2008-05-21 | 2011-05-05 | Nagase Chemtex Corporation | Epoxy resin composition for encapsulating electronic part |
| CN102576696B (zh) | 2009-10-09 | 2015-10-07 | 住友电木株式会社 | 半导体装置 |
| JP5691219B2 (ja) | 2010-03-30 | 2015-04-01 | 住友ベークライト株式会社 | 半導体封止用樹脂組成物の製造方法および粉砕装置 |
| CN102237164B (zh) * | 2010-04-26 | 2015-11-25 | 聚鼎科技股份有限公司 | 过电流保护元件 |
| JP5158238B2 (ja) * | 2010-08-26 | 2013-03-06 | 日立化成株式会社 | 太陽電池電極用接着フィルム及びそれを用いた太陽電池モジュールの製造方法 |
| US8715543B2 (en) * | 2011-03-31 | 2014-05-06 | Ocv Intellectual Capital, Llc | Microencapsulated curing agent |
| KR101326960B1 (ko) | 2011-05-20 | 2013-11-13 | 엘지이노텍 주식회사 | 에폭시 수지 조성물 및 이를 이용한 방열회로기판 |
| KR20130008409A (ko) * | 2011-07-12 | 2013-01-22 | 엘지이노텍 주식회사 | 에폭시 수지 조성물 및 이를 이용한 방열회로기판 |
| KR20140104003A (ko) | 2011-12-08 | 2014-08-27 | 오씨브이 인텔렉츄얼 캐피탈 엘엘씨 | 섬유 보강 수지 성형 화합물 및 그로부터의 섬유 보강 수지 성형품의 제조 방법 |
| CN104952839B (zh) * | 2014-03-28 | 2018-05-04 | 恒劲科技股份有限公司 | 封装装置及其制作方法 |
| CN104292768B (zh) * | 2014-06-24 | 2017-01-04 | 国家电网公司 | 一种用于高压电力绝缘的环氧树脂组合物及其制备方法 |
| HUE052360T2 (hu) * | 2015-12-25 | 2021-04-28 | Sumitomo Bakelite Co | Tömítõ gyantaösszetétel és félvezetõ eszköz |
| CN108598254A (zh) * | 2018-04-19 | 2018-09-28 | 嘉盛半导体(苏州)有限公司 | 滤波器封装方法及封装结构 |
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|---|---|---|---|---|
| US5001542A (en) * | 1988-12-05 | 1991-03-19 | Hitachi Chemical Company | Composition for circuit connection, method for connection using the same, and connected structure of semiconductor chips |
| DE4003842C2 (de) * | 1989-02-09 | 1997-06-05 | Shinetsu Chemical Co | Epoxidharzmassen zum Einkapseln von Halbleitern, enthaltend kugelförmiges Siliciumdioxid |
| JPH04108852A (ja) * | 1990-08-28 | 1992-04-09 | Hitachi Chem Co Ltd | 半導体封止用エポキシ樹脂組成物及びその組成物で封止した半導体装置 |
| US5302672A (en) * | 1991-02-27 | 1994-04-12 | Dainippon Ink And Chemicals, Inc. | 2,7-dihydroxynaphthalene based epoxy resin, intermediate thereof, processes for producing them, and epoxy resin composition |
| JPH0565392A (ja) * | 1991-09-04 | 1993-03-19 | Toshiba Chem Corp | 一液性エポキシ樹脂組成物 |
| JP3141970B2 (ja) * | 1993-06-30 | 2001-03-07 | ソマール株式会社 | 液状エポキシ樹脂組成物 |
| JP3359410B2 (ja) * | 1994-03-04 | 2002-12-24 | 三菱電機株式会社 | 成形用エポキシ樹脂組成物ならびにそれを用いた高電圧機器用モールド製品およびその製法 |
| JPH08109246A (ja) * | 1994-10-13 | 1996-04-30 | Sumitomo Bakelite Co Ltd | 半導体封止用エポキシ樹脂組成物 |
| DE59510595D1 (de) | 1995-01-10 | 2003-04-24 | Siemens Ag | Flammwidriges Reaktionsharzsystem auf Basis von Epoxyverbindungen und phosphorhaltigen Anhydrid-Härtern |
| DE69722106T2 (de) * | 1996-08-29 | 2004-04-01 | Mitsubishi Denki K.K. | Epoxidharzzusammensetzung und damit eingekapselte Halbleiteranordnungen |
| JP3640748B2 (ja) * | 1996-11-06 | 2005-04-20 | 京セラケミカル株式会社 | 熱硬化性樹脂組成物、その製造方法 |
| JPH10195179A (ja) * | 1997-01-08 | 1998-07-28 | Shin Etsu Chem Co Ltd | 半導体封止用エポキシ樹脂組成物及び半導体装置 |
| US6054222A (en) * | 1997-02-20 | 2000-04-25 | Kabushiki Kaisha Toshiba | Epoxy resin composition, resin-encapsulated semiconductor device using the same, epoxy resin molding material and epoxy resin composite tablet |
| JPH1129624A (ja) * | 1997-07-09 | 1999-02-02 | Toshiba Corp | 半導体封止用液状エポキシ樹脂組成物 |
| JP3365725B2 (ja) * | 1997-08-29 | 2003-01-14 | 住友ベークライト株式会社 | エポキシ樹脂組成物及び半導体装置 |
| JPH11147936A (ja) * | 1997-11-19 | 1999-06-02 | Sumitomo Bakelite Co Ltd | 半導体封止用エポキシ樹脂組成物及び半導体装置 |
-
2000
- 2000-10-06 KR KR1020000058849A patent/KR100550705B1/ko not_active IP Right Cessation
- 2000-10-06 CN CNB00130996XA patent/CN1156533C/zh not_active Expired - Fee Related
- 2000-10-06 TW TW089120868A patent/TWI257935B/zh not_active IP Right Cessation
- 2000-10-06 MY MYPI20004688A patent/MY126953A/en unknown
- 2000-10-06 DE DE60011199T patent/DE60011199T2/de not_active Expired - Fee Related
- 2000-10-06 EP EP00121877A patent/EP1090942B1/en not_active Expired - Lifetime
- 2000-10-06 SG SG200005708A patent/SG97948A1/en unknown
- 2000-10-06 US US09/680,531 patent/US6555602B1/en not_active Expired - Fee Related
-
2001
- 2001-08-06 HK HK01105451A patent/HK1034726A1/xx not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| KR100550705B1 (ko) | 2006-02-08 |
| CN1292401A (zh) | 2001-04-25 |
| CN1156533C (zh) | 2004-07-07 |
| SG97948A1 (en) | 2003-08-20 |
| EP1090942A1 (en) | 2001-04-11 |
| EP1090942B1 (en) | 2004-06-02 |
| MY126953A (en) | 2006-11-30 |
| US6555602B1 (en) | 2003-04-29 |
| HK1034726A1 (en) | 2001-11-02 |
| TWI257935B (en) | 2006-07-11 |
| KR20010040021A (ko) | 2001-05-15 |
| DE60011199D1 (de) | 2004-07-08 |
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