HK1034726A1 - Resin composition for semiconductor encapsulation,semiconductor device comprising the same and proc ess for the production of semiconductor device using the same. - Google Patents

Resin composition for semiconductor encapsulation,semiconductor device comprising the same and proc ess for the production of semiconductor device using the same.

Info

Publication number
HK1034726A1
HK1034726A1 HK01105451A HK01105451A HK1034726A1 HK 1034726 A1 HK1034726 A1 HK 1034726A1 HK 01105451 A HK01105451 A HK 01105451A HK 01105451 A HK01105451 A HK 01105451A HK 1034726 A1 HK1034726 A1 HK 1034726A1
Authority
HK
Hong Kong
Prior art keywords
same
semiconductor device
semiconductor
production
resin composition
Prior art date
Application number
HK01105451A
Other languages
English (en)
Inventor
Tadaaki Harada
Toshitsugu Hosokawa
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Publication of HK1034726A1 publication Critical patent/HK1034726A1/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/06—Containers; Seals characterised by the material of the container or its electrical properties
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12044—OLED

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
HK01105451A 1999-10-06 2001-08-06 Resin composition for semiconductor encapsulation,semiconductor device comprising the same and proc ess for the production of semiconductor device using the same. HK1034726A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP28588299 1999-10-06
JP2000244064 2000-08-11

Publications (1)

Publication Number Publication Date
HK1034726A1 true HK1034726A1 (en) 2001-11-02

Family

ID=26556063

Family Applications (1)

Application Number Title Priority Date Filing Date
HK01105451A HK1034726A1 (en) 1999-10-06 2001-08-06 Resin composition for semiconductor encapsulation,semiconductor device comprising the same and proc ess for the production of semiconductor device using the same.

Country Status (9)

Country Link
US (1) US6555602B1 (xx)
EP (1) EP1090942B1 (xx)
KR (1) KR100550705B1 (xx)
CN (1) CN1156533C (xx)
DE (1) DE60011199T2 (xx)
HK (1) HK1034726A1 (xx)
MY (1) MY126953A (xx)
SG (1) SG97948A1 (xx)
TW (1) TWI257935B (xx)

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JP2002212537A (ja) * 2001-01-24 2002-07-31 Sony Chem Corp 接着剤及び電気装置
JP3865601B2 (ja) 2001-06-12 2007-01-10 日東電工株式会社 電磁波抑制体シート
EP1312580B1 (en) * 2001-11-16 2007-01-24 STMicroelectronics S.r.l. Process for sealing devices incorporating microstructures
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MY139328A (en) * 2002-05-20 2009-09-30 Nitto Denko Corp Thermosetting resin composition and semiconductor device obtained with the same
US20050049334A1 (en) * 2003-09-03 2005-03-03 Slawomir Rubinsztain Solvent-modified resin system containing filler that has high Tg, transparency and good reliability in wafer level underfill applications
US20050170188A1 (en) * 2003-09-03 2005-08-04 General Electric Company Resin compositions and methods of use thereof
US20060147719A1 (en) * 2002-11-22 2006-07-06 Slawomir Rubinsztajn Curable composition, underfill, and method
US20050266263A1 (en) * 2002-11-22 2005-12-01 General Electric Company Refractory solid, adhesive composition, and device, and associated method
US20050181214A1 (en) * 2002-11-22 2005-08-18 John Robert Campbell Curable epoxy compositions, methods and articles made therefrom
US20050048700A1 (en) * 2003-09-02 2005-03-03 Slawomir Rubinsztajn No-flow underfill material having low coefficient of thermal expansion and good solder ball fluxing performance
EP1557880A1 (en) * 2004-01-21 2005-07-27 Nitto Denko Corporation Resin composition for encapsulating semiconductor
GB0412196D0 (en) * 2004-06-02 2004-07-07 Hexcel Composites Ltd Cure accelerators
US7446136B2 (en) * 2005-04-05 2008-11-04 Momentive Performance Materials Inc. Method for producing cure system, adhesive system, and electronic device
US7405246B2 (en) * 2005-04-05 2008-07-29 Momentive Performance Materials Inc. Cure system, adhesive system, electronic device
KR100961417B1 (ko) * 2005-09-29 2010-06-09 아사히 가세이 케미칼즈 가부시키가이샤 고-안정성 마이크로캡슐화 에폭시 수지용 경화제 및 에폭시수지 조성물
CN101379108B (zh) * 2006-02-03 2011-11-30 旭化成电子材料株式会社 微胶囊型环氧树脂用固化剂、母料型环氧树脂用固化剂组合物、单液型环氧树脂组合物、及其加工品
JP4316604B2 (ja) * 2006-12-08 2009-08-19 株式会社東芝 電源一体型半導体モジュールおよびその製造方法
CN101563776B (zh) * 2006-12-18 2011-12-07 矽马电子股份有限公司 引线框固定材料、引线框及半导体装置
KR100983096B1 (ko) 2007-11-28 2010-09-17 (주)에버텍엔터프라이즈 내습성 및 흐름성이 우수한 언더필용 하이브리드 에폭시조성물
KR100896481B1 (ko) * 2007-11-28 2009-05-08 (주)에버텍엔터프라이즈 열전도성이 우수한 언더필용 에폭시 조성물
WO2009142065A1 (ja) * 2008-05-21 2009-11-26 ナガセケムテックス株式会社 電子部品封止用エポキシ樹脂組成物
SG10201406428QA (en) 2009-10-09 2014-12-30 Sumitomo Bakelite Co Semiconductor device
JP5691219B2 (ja) 2010-03-30 2015-04-01 住友ベークライト株式会社 半導体封止用樹脂組成物の製造方法および粉砕装置
CN102237164B (zh) * 2010-04-26 2015-11-25 聚鼎科技股份有限公司 过电流保护元件
JP5158238B2 (ja) * 2010-08-26 2013-03-06 日立化成株式会社 太陽電池電極用接着フィルム及びそれを用いた太陽電池モジュールの製造方法
EP2691433A1 (en) * 2011-03-31 2014-02-05 OCV Intellectual Capital, LLC Microencapsulated curing agent
KR101326960B1 (ko) 2011-05-20 2013-11-13 엘지이노텍 주식회사 에폭시 수지 조성물 및 이를 이용한 방열회로기판
KR20130008409A (ko) * 2011-07-12 2013-01-22 엘지이노텍 주식회사 에폭시 수지 조성물 및 이를 이용한 방열회로기판
CA2858168A1 (en) 2011-12-08 2013-06-13 Ocv Intellectual Capital, Llc Fiber reinforced resin molding compound and manufacturing method for fiber reinforced resin molded article therefrom
CN104952839B (zh) * 2014-03-28 2018-05-04 恒劲科技股份有限公司 封装装置及其制作方法
CN104292768B (zh) * 2014-06-24 2017-01-04 国家电网公司 一种用于高压电力绝缘的环氧树脂组合物及其制备方法
WO2017110373A1 (ja) * 2015-12-25 2017-06-29 住友ベークライト株式会社 封止用樹脂組成物、および半導体装置
CN108598254A (zh) * 2018-04-19 2018-09-28 嘉盛半导体(苏州)有限公司 滤波器封装方法及封装结构

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JP3359410B2 (ja) 1994-03-04 2002-12-24 三菱電機株式会社 成形用エポキシ樹脂組成物ならびにそれを用いた高電圧機器用モールド製品およびその製法
JPH08109246A (ja) * 1994-10-13 1996-04-30 Sumitomo Bakelite Co Ltd 半導体封止用エポキシ樹脂組成物
DE59510595D1 (de) * 1995-01-10 2003-04-24 Siemens Ag Flammwidriges Reaktionsharzsystem auf Basis von Epoxyverbindungen und phosphorhaltigen Anhydrid-Härtern
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JP3640748B2 (ja) * 1996-11-06 2005-04-20 京セラケミカル株式会社 熱硬化性樹脂組成物、その製造方法
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Also Published As

Publication number Publication date
EP1090942A1 (en) 2001-04-11
KR100550705B1 (ko) 2006-02-08
CN1292401A (zh) 2001-04-25
EP1090942B1 (en) 2004-06-02
KR20010040021A (ko) 2001-05-15
SG97948A1 (en) 2003-08-20
CN1156533C (zh) 2004-07-07
TWI257935B (en) 2006-07-11
DE60011199T2 (de) 2004-09-30
US6555602B1 (en) 2003-04-29
DE60011199D1 (de) 2004-07-08
MY126953A (en) 2006-11-30

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20081006