HK1046012A1 - 用於半導體封鑄的樹脂組合物、由所述材料獲得的半導體設備以及製造所述半導體設備的方法 - Google Patents

用於半導體封鑄的樹脂組合物、由所述材料獲得的半導體設備以及製造所述半導體設備的方法

Info

Publication number
HK1046012A1
HK1046012A1 HK02107624.7A HK02107624A HK1046012A1 HK 1046012 A1 HK1046012 A1 HK 1046012A1 HK 02107624 A HK02107624 A HK 02107624A HK 1046012 A1 HK1046012 A1 HK 1046012A1
Authority
HK
Hong Kong
Prior art keywords
semiconductor device
resin composition
same
semiconductor
producing
Prior art date
Application number
HK02107624.7A
Other languages
English (en)
Inventor
Harada Tadaaki
Taki Hideaki
Hosokawa Toshitsugu
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP11212068A external-priority patent/JP2000309681A/ja
Priority claimed from JP11212069A external-priority patent/JP2000309682A/ja
Priority claimed from JP11212070A external-priority patent/JP2000309683A/ja
Priority claimed from JP24051199A external-priority patent/JP4286399B2/ja
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Publication of HK1046012A1 publication Critical patent/HK1046012A1/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
    • C08L61/04—Condensation polymers of aldehydes or ketones with phenols only
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12044—OLED

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
HK02107624.7A 1999-02-25 2002-10-21 用於半導體封鑄的樹脂組合物、由所述材料獲得的半導體設備以及製造所述半導體設備的方法 HK1046012A1 (zh)

Applications Claiming Priority (8)

Application Number Priority Date Filing Date Title
JP4890799 1999-02-25
JP4890599 1999-02-25
JP4890699 1999-02-25
JP11212068A JP2000309681A (ja) 1999-02-25 1999-07-27 半導体封止用樹脂組成物およびそれを用いた半導体装置ならびに半導体装置の製法
JP11212069A JP2000309682A (ja) 1999-02-25 1999-07-27 半導体封止用樹脂組成物およびそれを用いた半導体装置ならびに半導体装置の製法
JP11212070A JP2000309683A (ja) 1999-02-25 1999-07-27 半導体封止用樹脂組成物およびそれを用いた半導体装置ならびに半導体装置の製法
JP24051199A JP4286399B2 (ja) 1999-02-25 1999-08-26 半導体封止用樹脂組成物およびそれを用いた半導体装置ならびに半導体装置の製法
PCT/JP2000/000951 WO2000050512A1 (en) 1999-02-25 2000-02-21 Resin composition for semiconductor encapsulation, semiconductor device obtained with the same, and process for producing semiconductor device

Publications (1)

Publication Number Publication Date
HK1046012A1 true HK1046012A1 (zh) 2002-12-20

Family

ID=27564709

Family Applications (1)

Application Number Title Priority Date Filing Date
HK02107624.7A HK1046012A1 (zh) 1999-02-25 2002-10-21 用於半導體封鑄的樹脂組合物、由所述材料獲得的半導體設備以及製造所述半導體設備的方法

Country Status (6)

Country Link
US (1) US7034404B1 (zh)
EP (1) EP1203792A4 (zh)
KR (1) KR20020005601A (zh)
CN (1) CN1262598C (zh)
HK (1) HK1046012A1 (zh)
WO (1) WO2000050512A1 (zh)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003048862A (ja) 2001-08-03 2003-02-21 Ueno Seiyaku Oyo Kenkyusho:Kk アルキレンビスナフトール誘導体およびそれからなる電荷制御剤
TW200517436A (en) * 2003-10-09 2005-06-01 Nippon Kayaku Kk Resin composition for protective film
JP4421939B2 (ja) * 2004-05-13 2010-02-24 日東電工株式会社 半導体封止用エポキシ樹脂組成物およびそれを用いた半導体装置
KR101134168B1 (ko) * 2005-08-24 2012-04-09 삼성전자주식회사 반도체 칩 및 그 제조 방법과, 그를 이용한 표시 패널 및그 제조 방법
JP4396746B2 (ja) * 2007-08-13 2010-01-13 セイコーエプソン株式会社 電子デバイス
SG10201406428QA (en) 2009-10-09 2014-12-30 Sumitomo Bakelite Co Semiconductor device
JP2012017422A (ja) * 2010-07-08 2012-01-26 Nitto Denko Corp 熱硬化性樹脂組成物硬化体の製法およびそれにより得られた硬化物
TWI586749B (zh) * 2010-11-19 2017-06-11 漢高日本股份有限公司 單組分環氧樹脂組成物
CN102167886B (zh) * 2011-01-14 2012-09-26 黄文迎 环氧树脂组合物及其制备方法
JP2013014709A (ja) * 2011-07-05 2013-01-24 Nitto Denko Corp 電子部品封止用エポキシ樹脂組成物およびそれを用いた電子部品装置
US8986578B2 (en) 2011-12-28 2015-03-24 King Fahd University Of Petroleum And Minerals High impact strength conductive adhesives
TWI548005B (zh) * 2014-01-24 2016-09-01 環旭電子股份有限公司 選擇性電子封裝模組的製造方法
US10850512B2 (en) * 2018-02-23 2020-12-01 Canon Kabushiki Kaisha Ink jet recording head and method of manufacturing same
CN110041507A (zh) * 2019-05-07 2019-07-23 安徽美佳新材料股份有限公司 一种环保防紫外线型环氧树脂的制备方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02147618A (ja) * 1988-11-29 1990-06-06 Nitto Denko Corp エポキシ樹脂組成物及びそれを用いた接着方法
JP3454437B2 (ja) * 1992-10-02 2003-10-06 ナショナル スターチ アンド ケミカル インベストメント ホールディング コーポレイション 低粘度無溶媒の一液型エポキシ樹脂接着性組成物
US5585421A (en) * 1994-03-31 1996-12-17 Somar Corporation Composition dispensable at high speed for bonding electric parts to printed wiring boards
MY111779A (en) * 1994-11-10 2000-12-30 Nitto Denko Corp Semiconductor device
JPH08157561A (ja) * 1994-12-01 1996-06-18 Shin Etsu Chem Co Ltd 半導体封止用エポキシ樹脂組成物及び半導体装置
JP3611066B2 (ja) * 1996-08-29 2005-01-19 株式会社ルネサステクノロジ 無機質充填剤及びエポキシ樹脂組成物の製造方法
JP2982713B2 (ja) * 1996-10-23 1999-11-29 日本電気株式会社 半導体素子の放熱構造
JPH10168161A (ja) * 1996-12-13 1998-06-23 Nitto Denko Corp 熱硬化性樹脂組成物およびそれを用いた半導体装置
JPH10189832A (ja) * 1996-12-20 1998-07-21 Nitto Denko Corp エポキシ樹脂組成物およびそれを用いた半導体装置
JP3911088B2 (ja) * 1997-04-28 2007-05-09 日東電工株式会社 半導体装置
JP3351996B2 (ja) * 1997-07-18 2002-12-03 松下電工株式会社 半導体装置の製造方法及び半導体装置
KR100563352B1 (ko) * 1998-06-09 2006-03-22 닛토덴코 가부시키가이샤 반도체 봉지용 에폭시 수지 조성물 및 이를 사용하는반도체 장치

Also Published As

Publication number Publication date
EP1203792A1 (en) 2002-05-08
EP1203792A4 (en) 2002-05-29
CN1348481A (zh) 2002-05-08
KR20020005601A (ko) 2002-01-17
US7034404B1 (en) 2006-04-25
WO2000050512A1 (en) 2000-08-31
CN1262598C (zh) 2006-07-05

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