DE3942931A1 - Aufnehmer - Google Patents

Aufnehmer

Info

Publication number
DE3942931A1
DE3942931A1 DE3942931A DE3942931A DE3942931A1 DE 3942931 A1 DE3942931 A1 DE 3942931A1 DE 3942931 A DE3942931 A DE 3942931A DE 3942931 A DE3942931 A DE 3942931A DE 3942931 A1 DE3942931 A1 DE 3942931A1
Authority
DE
Germany
Prior art keywords
wafers
transducer
roughness
micron
less
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE3942931A
Other languages
German (de)
English (en)
Other versions
DE3942931C2 (ja
Inventor
Tatsu Nozawa
Kazunori Meguro
Yoshiyuki Watanabe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Coorstek KK
Original Assignee
Toshiba Ceramics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Ceramics Co Ltd filed Critical Toshiba Ceramics Co Ltd
Publication of DE3942931A1 publication Critical patent/DE3942931A1/de
Application granted granted Critical
Publication of DE3942931C2 publication Critical patent/DE3942931C2/de
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
    • C23C16/4581—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber characterised by material of construction or surface finish of the means for supporting the substrate
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/515—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics
    • C04B35/56—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on carbides or oxycarbides
    • C04B35/565—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on carbides or oxycarbides based on silicon carbide
DE3942931A 1988-12-26 1989-12-23 Aufnehmer Granted DE3942931A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63326236A JPH02174116A (ja) 1988-12-26 1988-12-26 サセプタ

Publications (2)

Publication Number Publication Date
DE3942931A1 true DE3942931A1 (de) 1990-06-28
DE3942931C2 DE3942931C2 (ja) 1993-07-15

Family

ID=18185510

Family Applications (1)

Application Number Title Priority Date Filing Date
DE3942931A Granted DE3942931A1 (de) 1988-12-26 1989-12-23 Aufnehmer

Country Status (4)

Country Link
JP (1) JPH02174116A (ja)
DE (1) DE3942931A1 (ja)
FR (1) FR2640964B1 (ja)
IT (1) IT1236887B (ja)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4026244A1 (de) * 1990-08-18 1992-02-20 Ant Nachrichtentech Substrattraeger
DE4222512A1 (de) * 1992-07-09 1994-01-13 Ant Nachrichtentech Verfahren zur Herstellung von Bauelementen auf einem Substrat
US5403401A (en) * 1993-03-04 1995-04-04 Xycarb B.V. Substrate carrier
US5580388A (en) * 1993-01-21 1996-12-03 Moore Epitaxial, Inc. Multi-layer susceptor for rapid thermal process reactors
US5584936A (en) * 1995-12-14 1996-12-17 Cvd, Incorporated Susceptor for semiconductor wafer processing
US5645646A (en) * 1994-02-25 1997-07-08 Applied Materials, Inc. Susceptor for deposition apparatus
US5700725A (en) * 1995-06-26 1997-12-23 Lucent Technologies Inc. Apparatus and method for making integrated circuits
EP0840358A2 (en) * 1996-11-05 1998-05-06 Applied Materials, Inc. Sloped substrate support
US6368410B1 (en) * 1999-06-28 2002-04-09 General Electric Company Semiconductor processing article
WO2002097872A1 (fr) * 2001-05-31 2002-12-05 Shin-Etsu Handotai Co., Ltd. Procede de production d'une tranche de semi-conducteur et suscepteur utilise a cet effet
DE10334940A1 (de) * 2003-07-31 2005-03-03 Infineon Technologies Ag Trägereinrichtung

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0492447A (ja) * 1990-08-08 1992-03-25 Shin Etsu Chem Co Ltd 無機薄膜の成膜方法
DE19547601A1 (de) * 1995-12-20 1997-06-26 Sel Alcatel Ag Vorrichtung zum Sintern von porösen Schichten
JP3887052B2 (ja) * 1996-12-13 2007-02-28 東洋炭素株式会社 気相成長用サセプター
WO2001013423A1 (fr) 1999-08-10 2001-02-22 Ibiden Co., Ltd. Plaque ceramique pour dispositif de production de semi-conducteurs
JP4688363B2 (ja) * 2001-07-31 2011-05-25 京セラ株式会社 ウエハ加熱装置
US8021968B2 (en) 2007-08-03 2011-09-20 Shin-Etsu Handotai Co., Ltd. Susceptor and method for manufacturing silicon epitaxial wafer

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1374137A (en) * 1971-11-29 1974-11-13 Crane Packing Co Apparatus for holding a workpiece for a polishing operation
DE8008012U1 (de) * 1980-09-11 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Halterung für Halbleiterscheiben
DE3438980A1 (de) * 1983-11-01 1985-05-09 Varian Associates, Inc., Palo Alto, Calif. Halterung zum stuetzen eines werkstuecks
DE3439371C2 (ja) * 1983-10-31 1988-05-11 Toshiba Kikai K.K., Tokio/Tokyo, Jp

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54152465A (en) * 1978-05-22 1979-11-30 Nec Corp Manufacture of epitaxial wafer
JPS61242994A (ja) * 1985-04-22 1986-10-29 Toshiba Corp 縦型気相成長装置
JP2671914B2 (ja) * 1986-01-30 1997-11-05 東芝セラミックス 株式会社 サセプタ
US4761134B1 (en) * 1987-03-30 1993-11-16 Silicon carbide diffusion furnace components with an impervious coating thereon
JPS6447019A (en) * 1987-08-18 1989-02-21 Denki Kagaku Kogyo Kk Glassy carbon coated susceptor

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE8008012U1 (de) * 1980-09-11 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Halterung für Halbleiterscheiben
GB1374137A (en) * 1971-11-29 1974-11-13 Crane Packing Co Apparatus for holding a workpiece for a polishing operation
DE3439371C2 (ja) * 1983-10-31 1988-05-11 Toshiba Kikai K.K., Tokio/Tokyo, Jp
DE3438980A1 (de) * 1983-11-01 1985-05-09 Varian Associates, Inc., Palo Alto, Calif. Halterung zum stuetzen eines werkstuecks

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4026244A1 (de) * 1990-08-18 1992-02-20 Ant Nachrichtentech Substrattraeger
DE4222512A1 (de) * 1992-07-09 1994-01-13 Ant Nachrichtentech Verfahren zur Herstellung von Bauelementen auf einem Substrat
US5580388A (en) * 1993-01-21 1996-12-03 Moore Epitaxial, Inc. Multi-layer susceptor for rapid thermal process reactors
US5403401A (en) * 1993-03-04 1995-04-04 Xycarb B.V. Substrate carrier
US6146464A (en) * 1994-02-25 2000-11-14 Applied Materials, Inc. Susceptor for deposition apparatus
US5645646A (en) * 1994-02-25 1997-07-08 Applied Materials, Inc. Susceptor for deposition apparatus
US5700725A (en) * 1995-06-26 1997-12-23 Lucent Technologies Inc. Apparatus and method for making integrated circuits
US5584936A (en) * 1995-12-14 1996-12-17 Cvd, Incorporated Susceptor for semiconductor wafer processing
EP0840358A2 (en) * 1996-11-05 1998-05-06 Applied Materials, Inc. Sloped substrate support
EP0840358A3 (en) * 1996-11-05 2004-01-14 Applied Materials, Inc. Sloped substrate support
US6368410B1 (en) * 1999-06-28 2002-04-09 General Electric Company Semiconductor processing article
US6706205B2 (en) 1999-06-28 2004-03-16 General Electric Company Semiconductor processing article
WO2002097872A1 (fr) * 2001-05-31 2002-12-05 Shin-Etsu Handotai Co., Ltd. Procede de production d'une tranche de semi-conducteur et suscepteur utilise a cet effet
DE10334940A1 (de) * 2003-07-31 2005-03-03 Infineon Technologies Ag Trägereinrichtung
DE10334940B4 (de) * 2003-07-31 2007-08-23 Infineon Technologies Ag Trägereinrichtung

Also Published As

Publication number Publication date
IT8922733A0 (it) 1989-12-19
FR2640964B1 (ja) 1993-06-11
DE3942931C2 (ja) 1993-07-15
IT1236887B (it) 1993-04-26
IT8922733A1 (it) 1991-06-19
JPH02174116A (ja) 1990-07-05
FR2640964A1 (ja) 1990-06-29

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Legal Events

Date Code Title Description
8110 Request for examination paragraph 44
D2 Grant after examination
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee