DE3909669A1 - Vorrichtung zur bearbeitung von werkstuecken - Google Patents

Vorrichtung zur bearbeitung von werkstuecken

Info

Publication number
DE3909669A1
DE3909669A1 DE3909669A DE3909669A DE3909669A1 DE 3909669 A1 DE3909669 A1 DE 3909669A1 DE 3909669 A DE3909669 A DE 3909669A DE 3909669 A DE3909669 A DE 3909669A DE 3909669 A1 DE3909669 A1 DE 3909669A1
Authority
DE
Germany
Prior art keywords
workpiece
station
component units
wafer
unit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE3909669A
Other languages
German (de)
English (en)
Other versions
DE3909669C2 (OSRAM
Inventor
Yoshiki Iwata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Publication of DE3909669A1 publication Critical patent/DE3909669A1/de
Application granted granted Critical
Publication of DE3909669C2 publication Critical patent/DE3909669C2/de
Granted legal-status Critical Current

Links

Classifications

    • H10P72/0458—
    • H10P72/3306—

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
DE3909669A 1988-03-24 1989-03-23 Vorrichtung zur bearbeitung von werkstuecken Granted DE3909669A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6820288A JP2559617B2 (ja) 1988-03-24 1988-03-24 基板処理装置

Publications (2)

Publication Number Publication Date
DE3909669A1 true DE3909669A1 (de) 1989-10-05
DE3909669C2 DE3909669C2 (OSRAM) 1992-06-04

Family

ID=13366973

Family Applications (1)

Application Number Title Priority Date Filing Date
DE3909669A Granted DE3909669A1 (de) 1988-03-24 1989-03-23 Vorrichtung zur bearbeitung von werkstuecken

Country Status (3)

Country Link
JP (1) JP2559617B2 (OSRAM)
DE (1) DE3909669A1 (OSRAM)
GB (1) GB2217107B (OSRAM)

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1991015032A1 (en) * 1990-03-22 1991-10-03 Surface Technology Systems Limited Loading mechanisms
DE4024973A1 (de) * 1990-08-07 1992-02-13 Ibm Anordnung zum lager, transportieren und einschleusen von substraten
DE4213936A1 (de) * 1991-04-30 1992-11-05 Murata Manufacturing Co Waermebehandlungssystem
DE4217085A1 (de) * 1991-05-23 1992-11-26 Gold Star Electronics Automatische leiterrahmen-zufuhreinrichtung
DE4127341A1 (de) * 1991-08-19 1993-02-25 Leybold Ag Vorrichtung zum selbsttaetigen giessen, beschichten, lackieren, pruefen und sortieren von werkstuecken
DE4230175A1 (de) * 1991-09-13 1993-03-18 Gold Star Electronics Vorrichtung zur automatischen entladung von test- und sortieranlagen
DE4139549A1 (de) * 1991-11-30 1993-06-03 Leybold Ag Vorrichtung fuer den transport von substraten
DE4422683A1 (de) * 1993-06-30 1995-01-19 Mitsubishi Electric Corp Verfahren und Vorrichtung zum automatischen Ordnen von Losen für eine Fertigungsstraße
DE19639634A1 (de) * 1995-10-13 1997-04-17 Samsung Electronics Co Ltd Transportvorrichtung für ein Transferelement in einer Speichereinrichtung für die Herstellung von Halbleitervorrichtungen
US6245156B1 (en) 1998-03-12 2001-06-12 Tokyo Electron Limited Substrate transport method and apparatus, and substrate processing system
DE10227213A1 (de) * 2002-06-18 2004-01-15 Asys Automatic Systems Gmbh & Co. Kg Umsetzvorrichtung für Mikrosysteme
US6769855B2 (en) 2000-12-27 2004-08-03 Tokyo Electron Limited Substrate processing apparatus and substrate processing method
DE19964235B4 (de) * 1998-03-12 2006-08-24 Tokyo Electron Ltd. Substrattransportvorrichtung
DE102005039453A1 (de) * 2005-08-18 2007-03-01 Asys Automatic Systems Gmbh & Co. Kg Bearbeitungsanlage modularen Aufbaus für flächige Substrate

Families Citing this family (47)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2652894B2 (ja) * 1989-11-22 1997-09-10 キヤノン株式会社 ウエハ搬送装置
JP3069945B2 (ja) * 1995-07-28 2000-07-24 東京エレクトロン株式会社 処理装置
US5734629A (en) * 1995-12-28 1998-03-31 Rimage Corporation CD transporter
TW317644B (OSRAM) * 1996-01-26 1997-10-11 Tokyo Electron Co Ltd
JP3218425B2 (ja) * 1996-03-25 2001-10-15 東京エレクトロン株式会社 処理方法及び処理装置
TW333658B (en) * 1996-05-30 1998-06-11 Tokyo Electron Co Ltd The substrate processing method and substrate processing system
US6062798A (en) * 1996-06-13 2000-05-16 Brooks Automation, Inc. Multi-level substrate processing apparatus
US6203582B1 (en) * 1996-07-15 2001-03-20 Semitool, Inc. Modular semiconductor workpiece processing tool
US6672820B1 (en) 1996-07-15 2004-01-06 Semitool, Inc. Semiconductor processing apparatus having linear conveyer system
US6091498A (en) 1996-07-15 2000-07-18 Semitool, Inc. Semiconductor processing apparatus having lift and tilt mechanism
US6645355B2 (en) 1996-07-15 2003-11-11 Semitool, Inc. Semiconductor processing apparatus having lift and tilt mechanism
JP3779393B2 (ja) * 1996-09-06 2006-05-24 東京エレクトロン株式会社 処理システム
TW353777B (en) * 1996-11-08 1999-03-01 Tokyo Electron Ltd Treatment device
US6099643A (en) * 1996-12-26 2000-08-08 Dainippon Screen Mfg. Co., Ltd. Apparatus for processing a substrate providing an efficient arrangement and atmospheric isolation of chemical treatment section
DE69708108T2 (de) * 1997-11-21 2002-03-14 Tapematic S.P.A., Monza Maschine zur Verarbeitung von optischen Platten und Verfahren zum Transportieren von optischen Platten während deren Verarbeitung
US6565729B2 (en) 1998-03-20 2003-05-20 Semitool, Inc. Method for electrochemically depositing metal on a semiconductor workpiece
US6497801B1 (en) 1998-07-10 2002-12-24 Semitool Inc Electroplating apparatus with segmented anode array
US6244931B1 (en) * 1999-04-02 2001-06-12 Applied Materials, Inc. Buffer station on CMP system
US7585398B2 (en) 1999-04-13 2009-09-08 Semitool, Inc. Chambers, systems, and methods for electrochemically processing microfeature workpieces
US7264698B2 (en) 1999-04-13 2007-09-04 Semitool, Inc. Apparatus and methods for electrochemical processing of microelectronic workpieces
US7020537B2 (en) 1999-04-13 2006-03-28 Semitool, Inc. Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
US7351315B2 (en) 2003-12-05 2008-04-01 Semitool, Inc. Chambers, systems, and methods for electrochemically processing microfeature workpieces
US7351314B2 (en) 2003-12-05 2008-04-01 Semitool, Inc. Chambers, systems, and methods for electrochemically processing microfeature workpieces
US7160421B2 (en) 1999-04-13 2007-01-09 Semitool, Inc. Turning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
US7438788B2 (en) 1999-04-13 2008-10-21 Semitool, Inc. Apparatus and methods for electrochemical processing of microelectronic workpieces
TWI226387B (en) 1999-04-13 2005-01-11 Semitool Inc Workpiece processor having processing chamber with improved processing fluid flow
US7189318B2 (en) 1999-04-13 2007-03-13 Semitool, Inc. Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
US6916412B2 (en) 1999-04-13 2005-07-12 Semitool, Inc. Adaptable electrochemical processing chamber
US6401324B1 (en) * 2000-08-07 2002-06-11 Toshiharu Tom Miyano Machine tool assembly and method of performing machining operations using the machine tool assembly
JP3616748B2 (ja) * 2000-11-07 2005-02-02 東京エレクトロン株式会社 現像処理方法，現像処理装置及び処理装置
AU2002343330A1 (en) 2001-08-31 2003-03-10 Semitool, Inc. Apparatus and methods for electrochemical processing of microelectronic workpieces
US7114903B2 (en) 2002-07-16 2006-10-03 Semitool, Inc. Apparatuses and method for transferring and/or pre-processing microelectronic workpieces
US7077585B2 (en) 2002-07-22 2006-07-18 Yoshitake Ito Developing method and apparatus for performing development processing properly and a solution processing method enabling enhanced uniformity in the processing
JP4414921B2 (ja) 2005-03-23 2010-02-17 東京エレクトロン株式会社 塗布、現像装置及び塗布、現像方法
JP4519037B2 (ja) * 2005-08-31 2010-08-04 東京エレクトロン株式会社 加熱装置及び塗布、現像装置
JP5006122B2 (ja) * 2007-06-29 2012-08-22 株式会社Ｓｏｋｕｄｏ 基板処理装置
JP4505005B2 (ja) * 2007-09-28 2010-07-14 大日本スクリーン製造株式会社 基板処理装置
JP4505006B2 (ja) * 2007-09-28 2010-07-14 大日本スクリーン製造株式会社 基板処理装置
JP4499147B2 (ja) * 2007-11-21 2010-07-07 大日本スクリーン製造株式会社 基板処理装置
JP5128918B2 (ja) 2007-11-30 2013-01-23 株式会社Ｓｏｋｕｄｏ 基板処理装置
JP5179170B2 (ja) 2007-12-28 2013-04-10 株式会社Ｓｏｋｕｄｏ 基板処理装置
US8757026B2 (en) 2008-04-15 2014-06-24 Dynamic Micro Systems, Semiconductor Equipment Gmbh Clean transfer robot
JP4887329B2 (ja) * 2008-05-19 2012-02-29 東京エレクトロン株式会社 基板処理システム
JP5608148B2 (ja) * 2011-11-25 2014-10-15 株式会社Ｓｃｒｅｅｎセミコンダクターソリューションズ 基板処理装置
KR102530263B1 (ko) * 2011-12-22 2023-05-08 카티바, 인크. 가스 엔클로저 시스템
JP6058999B2 (ja) 2012-12-11 2017-01-11 株式会社Ｓｃｒｅｅｎセミコンダクターソリューションズ 基板処理装置および基板処理方法
US9245783B2 (en) 2013-05-24 2016-01-26 Novellus Systems, Inc. Vacuum robot with linear translation carriage

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE375601C (de) * 1923-05-15 Claudius Dornier Dipl Ing Flugboot mit Zugschraube

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5619635A (en) * 1979-07-27 1981-02-24 Hitachi Ltd Manufacturing apparatus
US4454003A (en) * 1983-01-06 1984-06-12 Systems Engineering & Manufacturing Corp. Printed circuit board component conveyor apparatus and process
JPS6041045U (ja) * 1983-08-26 1985-03-23 東京エレクトロン株式会社 半導体ウエハプロ−バ
JPS60162341A (ja) * 1984-02-02 1985-08-24 Fuji Photo Film Co Ltd 電話番号用バ−コ−ド表示装置
DE3681799D1 (de) * 1985-01-22 1991-11-14 Applied Materials Inc Halbleiter-bearbeitungseinrichtung.
CA1300357C (en) * 1986-04-04 1992-05-12 Materials Research Corporation Method and apparatus for handling and processing wafer-like materials
DE3788973T2 (de) * 1986-04-04 1994-08-11 Materials Research Corp Verfahren und Vorrichtung zur Handhabung und Behandlung von scheibenartigen Materialien.
US4806057A (en) * 1986-04-22 1989-02-21 Motion Manufacturing, Inc. Automatic wafer loading method and apparatus
JPH0734426B2 (ja) * 1986-06-25 1995-04-12 日本電気株式会社 レジスト材の塗布現像装置
GB2194500B (en) * 1986-07-04 1991-01-23 Canon Kk A wafer handling apparatus
JPS6313332A (ja) * 1986-07-04 1988-01-20 Canon Inc 半導体製造装置
FR2620049B2 (fr) * 1986-11-28 1989-11-24 Commissariat Energie Atomique Procede de traitement, stockage et/ou transfert d'un objet dans une atmosphere de haute proprete, et conteneur pour la mise en oeuvre de ce procede
EP0322205A3 (en) * 1987-12-23 1990-09-12 Texas Instruments Incorporated Automated photolithographic work cell

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE375601C (de) * 1923-05-15 Claudius Dornier Dipl Ing Flugboot mit Zugschraube

Cited By (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1991015032A1 (en) * 1990-03-22 1991-10-03 Surface Technology Systems Limited Loading mechanisms
US5330301A (en) * 1990-03-22 1994-07-19 Surface Technology Systems Limited Loading mechanisms
DE4024973A1 (de) * 1990-08-07 1992-02-13 Ibm Anordnung zum lager, transportieren und einschleusen von substraten
DE4213936A1 (de) * 1991-04-30 1992-11-05 Murata Manufacturing Co Waermebehandlungssystem
DE4217085A1 (de) * 1991-05-23 1992-11-26 Gold Star Electronics Automatische leiterrahmen-zufuhreinrichtung
DE4217085C2 (de) * 1991-05-23 2001-08-16 Gold Star Electronics Automatische Leiterrahmen-Zufuhreinrichtung
DE4127341A1 (de) * 1991-08-19 1993-02-25 Leybold Ag Vorrichtung zum selbsttaetigen giessen, beschichten, lackieren, pruefen und sortieren von werkstuecken
US5232505A (en) * 1991-08-19 1993-08-03 Leybold Aktiengesellschaft Apparatus for the automatic casting, coating, varnishing, testing and sorting of workpieces
DE4127341C2 (de) * 1991-08-19 2000-03-09 Leybold Ag Vorrichtung zum selbsttätigen Gießen, Beschichten, Lackieren, Prüfen und Sortieren von Werkstücken
DE4230175A1 (de) * 1991-09-13 1993-03-18 Gold Star Electronics Vorrichtung zur automatischen entladung von test- und sortieranlagen
DE4139549A1 (de) * 1991-11-30 1993-06-03 Leybold Ag Vorrichtung fuer den transport von substraten
US6012894A (en) * 1993-06-30 2000-01-11 Mitsubishi Denki Kabushiki Kaisha Automatic lot organization method
US5551830A (en) * 1993-06-30 1996-09-03 Mitsubishi Denki Kabushiki Kaisha Automatic lot organization method
DE4422683A1 (de) * 1993-06-30 1995-01-19 Mitsubishi Electric Corp Verfahren und Vorrichtung zum automatischen Ordnen von Losen für eine Fertigungsstraße
DE19639634A1 (de) * 1995-10-13 1997-04-17 Samsung Electronics Co Ltd Transportvorrichtung für ein Transferelement in einer Speichereinrichtung für die Herstellung von Halbleitervorrichtungen
US6245156B1 (en) 1998-03-12 2001-06-12 Tokyo Electron Limited Substrate transport method and apparatus, and substrate processing system
DE19910478C2 (de) * 1998-03-12 2002-02-28 Tokyo Electron Ltd Substrattransportverfahren und Substratbearbeitungssystem
US6520733B1 (en) 1998-03-12 2003-02-18 Tokyo Electron Limited Substrate transport and apparatus
DE19964235B4 (de) * 1998-03-12 2006-08-24 Tokyo Electron Ltd. Substrattransportvorrichtung
DE10164192B4 (de) * 2000-12-27 2005-07-14 Tokyo Electron Limited Vorrichtung und Verfahren zur Bearbeitung von Substraten
US6769855B2 (en) 2000-12-27 2004-08-03 Tokyo Electron Limited Substrate processing apparatus and substrate processing method
DE10227213B4 (de) * 2002-06-18 2004-07-22 Asys Automatic Systems Gmbh & Co. Kg Umsetzvorrichtung für Mikrosysteme
DE10227213A1 (de) * 2002-06-18 2004-01-15 Asys Automatic Systems Gmbh & Co. Kg Umsetzvorrichtung für Mikrosysteme
DE102005039453A1 (de) * 2005-08-18 2007-03-01 Asys Automatic Systems Gmbh & Co. Kg Bearbeitungsanlage modularen Aufbaus für flächige Substrate
DE102005039453B4 (de) * 2005-08-18 2007-06-28 Asys Automatic Systems Gmbh & Co. Kg Bearbeitungsanlage modularen Aufbaus für flächige Substrate

Also Published As

Publication number Publication date
GB2217107B (en) 1992-09-23
JP2559617B2 (ja) 1996-12-04
DE3909669C2 (OSRAM) 1992-06-04
GB2217107A (en) 1989-10-18
JPH01241840A (ja) 1989-09-26
GB8906751D0 (en) 1989-05-10

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Legal Events

Date Code Title Description
OP8 Request for examination as to paragraph 44 patent law
8128 New person/name/address of the agent

Representative=s name: TIEDTKE, H., DIPL.-ING. BUEHLING, G., DIPL.-CHEM.

D2 Grant after examination
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee