DE3782389D1 - "lift-off" verfahren zur herstellung von leiterbahnen auf einem substrat. - Google Patents
"lift-off" verfahren zur herstellung von leiterbahnen auf einem substrat.Info
- Publication number
- DE3782389D1 DE3782389D1 DE8787112098T DE3782389T DE3782389D1 DE 3782389 D1 DE3782389 D1 DE 3782389D1 DE 8787112098 T DE8787112098 T DE 8787112098T DE 3782389 T DE3782389 T DE 3782389T DE 3782389 D1 DE3782389 D1 DE 3782389D1
- Authority
- DE
- Germany
- Prior art keywords
- pathways
- lift
- substrate
- production
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 230000037361 pathway Effects 0.000 title 1
- 239000000758 substrate Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0272—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers for lift-off processes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
- H01L21/02118—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer carbon based polymeric organic or inorganic material, e.g. polyimides, poly cyclobutene or PVC
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/312—Organic layers, e.g. photoresist
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
- H05K3/046—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer
- H05K3/048—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer using a lift-off resist pattern or a release layer pattern
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Weting (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP20097186 | 1986-08-27 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE3782389D1 true DE3782389D1 (de) | 1992-12-03 |
DE3782389T2 DE3782389T2 (de) | 1993-05-06 |
Family
ID=16433363
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE8787112098T Expired - Fee Related DE3782389T2 (de) | 1986-08-27 | 1987-08-20 | "lift-off" verfahren zur herstellung von leiterbahnen auf einem substrat. |
Country Status (5)
Country | Link |
---|---|
US (1) | US4886573A (de) |
EP (1) | EP0261400B1 (de) |
JP (1) | JPH07120647B2 (de) |
KR (1) | KR940009174B1 (de) |
DE (1) | DE3782389T2 (de) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5006488A (en) * | 1989-10-06 | 1991-04-09 | International Business Machines Corporation | High temperature lift-off process |
US5198298A (en) * | 1989-10-24 | 1993-03-30 | Advanced Micro Devices, Inc. | Etch stop layer using polymers |
US5077382A (en) * | 1989-10-26 | 1991-12-31 | Occidental Chemical Corporation | Copolyimide odpa/bpda/4,4'-oda or p-pda |
US5426071A (en) * | 1994-03-04 | 1995-06-20 | E. I. Du Pont De Nemours And Company | Polyimide copolymer film for lift-off metallization |
US6303488B1 (en) | 1997-02-12 | 2001-10-16 | Micron Technology, Inc. | Semiconductor processing methods of forming openings to devices and substrates, exposing material from which photoresist cannot be substantially selectively removed |
US6495468B2 (en) | 1998-12-22 | 2002-12-17 | Micron Technology, Inc. | Laser ablative removal of photoresist |
DE602006020865D1 (de) * | 2005-06-07 | 2011-05-05 | Fujifilm Corp | Struktur zur formung eines musters für eine funktionelle folie und verfahren zur herstellung der funktionellen folie |
KR100643404B1 (ko) * | 2005-09-22 | 2006-11-10 | 삼성전자주식회사 | 디스플레이장치 및 그 제조방법 |
US7993972B2 (en) * | 2008-03-04 | 2011-08-09 | Stats Chippac, Ltd. | Wafer level die integration and method therefor |
JP5786548B2 (ja) * | 2011-08-15 | 2015-09-30 | 住友電気工業株式会社 | 窒化物半導体発光素子を作製する方法 |
JP2013243263A (ja) * | 2012-05-21 | 2013-12-05 | Internatl Business Mach Corp <Ibm> | 3次元積層パッケージにおける電力供給と放熱(冷却)との両立 |
KR102614588B1 (ko) * | 2018-08-20 | 2023-12-18 | 삼성디스플레이 주식회사 | 표시 장치의 제조 방법 |
US11878640B2 (en) * | 2019-03-29 | 2024-01-23 | Autonetworks Technologies, Ltd. | Wiring module |
Family Cites Families (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3179633A (en) * | 1962-01-26 | 1965-04-20 | Du Pont | Aromatic polyimides from meta-phenylene diamine and para-phenylene diamine |
GB1230421A (de) * | 1967-09-15 | 1971-05-05 | ||
US4218283A (en) * | 1974-08-23 | 1980-08-19 | Hitachi, Ltd. | Method for fabricating semiconductor device and etchant for polymer resin |
JPS52156583A (en) * | 1976-06-23 | 1977-12-27 | Hitachi Ltd | Electrode formation method in semiconductor device |
FR2392495A1 (fr) * | 1977-05-25 | 1978-12-22 | Radiotechnique Compelec | Procede de realisation de dispositifs semi-conducteurs a reseau de conducteurs mono ou multicouche et dispositifs ainsi obtenus |
JPS54138068A (en) * | 1978-04-18 | 1979-10-26 | Toray Ind Inc | Polyimide film |
JPS5527326A (en) * | 1978-08-17 | 1980-02-27 | Ube Ind Ltd | Polyimide resin composition and its preparation |
JPS5565227A (en) * | 1978-11-09 | 1980-05-16 | Ube Ind Ltd | Production of polyimide solution |
EP0019391B1 (de) * | 1979-05-12 | 1982-10-06 | Fujitsu Limited | Verfahren zur Herstellung einer elektronischen Vorrichtung mit Vielschicht-Verdrahtungsstruktur |
US4367119A (en) * | 1980-08-18 | 1983-01-04 | International Business Machines Corporation | Planar multi-level metal process with built-in etch stop |
JPS5744618A (en) * | 1980-08-29 | 1982-03-13 | Hitachi Chem Co Ltd | Preparation of polyimide copolymer |
JPS5792849A (en) * | 1980-12-01 | 1982-06-09 | Mitsubishi Electric Corp | Manufacture of semiconductor device |
US4451971A (en) * | 1982-08-02 | 1984-06-05 | Fairchild Camera And Instrument Corporation | Lift-off wafer processing |
US4428796A (en) * | 1982-08-02 | 1984-01-31 | Fairchild Camera And Instrument Corporation | Adhesion bond-breaking of lift-off regions on semiconductor structures |
US4497684A (en) * | 1983-02-22 | 1985-02-05 | Amdahl Corporation | Lift-off process for depositing metal on a substrate |
EP0133533B1 (de) * | 1983-08-01 | 1993-04-21 | Hitachi, Ltd. | Harzmaterial mit geringer thermischer Ausdehnung für Verdrahtungsisolationsfolie |
JPS60110140A (ja) * | 1983-11-21 | 1985-06-15 | Hitachi Ltd | 配線構造体形成方法 |
JPS60120723A (ja) * | 1983-11-30 | 1985-06-28 | インタ−ナショナル ビジネス マシ−ンズ コ−ポレ−ション | 電子装置 |
JPS60157286A (ja) * | 1984-01-27 | 1985-08-17 | 株式会社日立製作所 | フレキシブルプリント基板の製造方法 |
JPS60212428A (ja) * | 1984-04-06 | 1985-10-24 | Mitsui Toatsu Chem Inc | ポリイミド樹脂プレポリマ溶液の調整方法 |
US4519872A (en) * | 1984-06-11 | 1985-05-28 | International Business Machines Corporation | Use of depolymerizable polymers in the fabrication of lift-off structure for multilevel metal processes |
US4606998A (en) * | 1985-04-30 | 1986-08-19 | International Business Machines Corporation | Barrierless high-temperature lift-off process |
-
1987
- 1987-08-19 US US07/087,021 patent/US4886573A/en not_active Expired - Fee Related
- 1987-08-20 EP EP87112098A patent/EP0261400B1/de not_active Expired - Lifetime
- 1987-08-20 DE DE8787112098T patent/DE3782389T2/de not_active Expired - Fee Related
- 1987-08-26 JP JP62210107A patent/JPH07120647B2/ja not_active Expired - Lifetime
- 1987-08-26 KR KR87009328A patent/KR940009174B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
EP0261400B1 (de) | 1992-10-28 |
KR940009174B1 (en) | 1994-10-01 |
KR880003550A (ko) | 1988-05-17 |
US4886573A (en) | 1989-12-12 |
DE3782389T2 (de) | 1993-05-06 |
EP0261400A3 (en) | 1989-05-24 |
EP0261400A2 (de) | 1988-03-30 |
JPH07120647B2 (ja) | 1995-12-20 |
JPS63170925A (ja) | 1988-07-14 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |