DE68924502T2 - Verfahren zur Herstellung von Einzelsubstraten. - Google Patents
Verfahren zur Herstellung von Einzelsubstraten.Info
- Publication number
- DE68924502T2 DE68924502T2 DE1989624502 DE68924502T DE68924502T2 DE 68924502 T2 DE68924502 T2 DE 68924502T2 DE 1989624502 DE1989624502 DE 1989624502 DE 68924502 T DE68924502 T DE 68924502T DE 68924502 T2 DE68924502 T2 DE 68924502T2
- Authority
- DE
- Germany
- Prior art keywords
- production
- single substrates
- substrates
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
- B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP63162043A JPH0210727A (ja) | 1988-06-28 | 1988-06-28 | 半導体ウエハの分割方法および装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE68924502D1 DE68924502D1 (de) | 1995-11-16 |
DE68924502T2 true DE68924502T2 (de) | 1996-04-04 |
Family
ID=15747004
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE1989624502 Expired - Fee Related DE68924502T2 (de) | 1988-06-28 | 1989-06-19 | Verfahren zur Herstellung von Einzelsubstraten. |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP0348783B1 (de) |
JP (1) | JPH0210727A (de) |
KR (1) | KR960008895B1 (de) |
DE (1) | DE68924502T2 (de) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0695504B2 (ja) * | 1989-10-31 | 1994-11-24 | 直江津電子工業株式会社 | ウエハ枚葉式内周刃2分割切断装置におけるウエハ供給回収装置 |
JPH06103675B2 (ja) * | 1990-10-29 | 1994-12-14 | 直江津電子工業株式会社 | 半導体ウエハの2分割切断におけるウエハの中心位置決め方法 |
JPH06112451A (ja) * | 1992-09-29 | 1994-04-22 | Nagano Denshi Kogyo Kk | Soi基板の製造方法 |
EP0709878B1 (de) * | 1994-10-24 | 1998-04-01 | Naoetsu Electronics Company | Verfahren zur Herstellung von Einzelsubstraten aus einem Silizium-Halbleiterwafer |
JP2820024B2 (ja) * | 1994-03-04 | 1998-11-05 | 信越半導体株式会社 | シリコン半導体素子製造用基板の製造方法 |
DE19739965A1 (de) * | 1997-09-11 | 1999-03-18 | Wacker Siltronic Halbleitermat | Sägeleiste zum Fixieren eines Kristalls und Verfahren zum Abtrennen von Scheiben |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL302762A (de) * | 1963-06-01 | |||
US3936328A (en) * | 1972-04-28 | 1976-02-03 | Mitsubishi Denki Kabushiki Kaisha | Process of manufacturing semiconductor devices |
FR2590879A1 (fr) * | 1985-11-27 | 1987-06-05 | American Telephone & Telegraph | Procede et appareil pour le chargement et le dechargement automatiques de tranches de semi-conducteur |
JPS6323332A (ja) * | 1986-04-28 | 1988-01-30 | バリアン・アソシエイツ・インコ−ポレイテツド | ウエーハ移送方法及び装置 |
US4808059A (en) * | 1986-07-15 | 1989-02-28 | Peak Systems, Inc. | Apparatus and method for transferring workpieces |
-
1988
- 1988-06-28 JP JP63162043A patent/JPH0210727A/ja active Pending
-
1989
- 1989-06-19 EP EP19890111111 patent/EP0348783B1/de not_active Expired - Lifetime
- 1989-06-19 DE DE1989624502 patent/DE68924502T2/de not_active Expired - Fee Related
- 1989-06-27 KR KR89008886A patent/KR960008895B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
DE68924502D1 (de) | 1995-11-16 |
KR960008895B1 (en) | 1996-07-05 |
EP0348783B1 (de) | 1995-10-11 |
EP0348783A2 (de) | 1990-01-03 |
JPH0210727A (ja) | 1990-01-16 |
EP0348783A3 (de) | 1991-04-10 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |