DE68922360D1 - Verfahren zur Herstellung von Metall-Polyimid-Verbundwerkstoffen. - Google Patents

Verfahren zur Herstellung von Metall-Polyimid-Verbundwerkstoffen.

Info

Publication number
DE68922360D1
DE68922360D1 DE68922360T DE68922360T DE68922360D1 DE 68922360 D1 DE68922360 D1 DE 68922360D1 DE 68922360 T DE68922360 T DE 68922360T DE 68922360 T DE68922360 T DE 68922360T DE 68922360 D1 DE68922360 D1 DE 68922360D1
Authority
DE
Germany
Prior art keywords
production
metal
polyimide composites
composites
polyimide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE68922360T
Other languages
English (en)
Other versions
DE68922360T2 (de
Inventor
Shunichi Numata
Takao Miwa
Takayoshi Ikeda
Koji Fujisaki
Hisae Shimanoki
Kunio Miyazaki
Osamu Miura
Ryuji Watanabe
Toshio Miyamoto
Yukio Okoshi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Application granted granted Critical
Publication of DE68922360D1 publication Critical patent/DE68922360D1/de
Publication of DE68922360T2 publication Critical patent/DE68922360T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/303—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups H01B3/38 or H01B3/302
    • H01B3/306—Polyimides or polyesterimides
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof
    • H10W70/695—Organic materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W99/00—Subject matter not provided for in other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
    • Y10T428/31681—Next to polyester, polyamide or polyimide [e.g., alkyd, glue, or nylon, etc.]

Landscapes

  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Dispersion Chemistry (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Laminated Bodies (AREA)
  • Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
DE68922360T 1988-09-30 1989-09-28 Verfahren zur Herstellung von Metall-Polyimid-Verbundwerkstoffen. Expired - Fee Related DE68922360T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63243986A JPH07102646B2 (ja) 1988-09-30 1988-09-30 金属とポリイミドの複合成形体

Publications (2)

Publication Number Publication Date
DE68922360D1 true DE68922360D1 (de) 1995-06-01
DE68922360T2 DE68922360T2 (de) 1995-09-28

Family

ID=17112011

Family Applications (1)

Application Number Title Priority Date Filing Date
DE68922360T Expired - Fee Related DE68922360T2 (de) 1988-09-30 1989-09-28 Verfahren zur Herstellung von Metall-Polyimid-Verbundwerkstoffen.

Country Status (4)

Country Link
US (1) US5133989A (de)
EP (1) EP0361461B1 (de)
JP (1) JPH07102646B2 (de)
DE (1) DE68922360T2 (de)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5209814A (en) * 1991-09-30 1993-05-11 E. I. Du Pont De Nemours And Company Method for diffusion patterning
WO1994018701A1 (en) * 1993-02-05 1994-08-18 W.L. Gore & Associates, Inc. Stress-resistant semiconductor chip-circuit board interconnect
TW294702B (de) * 1994-03-08 1997-01-01 Sumitomo Bakelite Co
US5612450A (en) * 1994-05-17 1997-03-18 Japan Synthetic Rubber Co., Ltd. Liquid crystal aligning agent and liquid crystal display device
US5550199A (en) * 1994-12-02 1996-08-27 Exxon Research And Engineering Company Diepoxide crosslinked/esterified polyimide-aliphatic polyester copolymers
US7000313B2 (en) * 2001-03-08 2006-02-21 Ppg Industries Ohio, Inc. Process for fabricating circuit assemblies using electrodepositable dielectric coating compositions
US6992001B1 (en) * 2003-05-08 2006-01-31 Kulicke And Soffa Industries, Inc. Screen print under-bump metalization (UBM) to produce low cost flip chip substrate
JP4923678B2 (ja) * 2006-03-31 2012-04-25 日立化成工業株式会社 金属箔付フレキシブル基板及びフレキシブルプリント配線板
US8999764B2 (en) * 2007-08-10 2015-04-07 International Business Machines Corporation Ionizing radiation blocking in IC chip to reduce soft errors
US20090130468A1 (en) * 2007-11-16 2009-05-21 Li-Hua Wang Polyamic acid composition, method for preparing the same, method for preparing polyimide and polyimide flexible metal-clad laminates
KR102068870B1 (ko) 2016-06-17 2020-01-21 주식회사 엘지화학 전극 구조체, 이를 포함하는 전자 소자 및 이의 제조방법
US20230025661A1 (en) * 2021-06-25 2023-01-26 Essex Furukawa Magnet Wire Usa Llc Amine-Substituted 2-Amino-Ethan-1-Olyl Polymers, Polyimides, Articles, and Methods
CN114355727A (zh) * 2022-01-17 2022-04-15 苏州理硕科技有限公司 一种光刻胶组合物及应用

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1570659A1 (de) * 1964-04-15 1970-01-22 Gen Electric Polyamidsaeureharze,sowie Verfahren zu deren Herstellung
FR1571736A (de) * 1967-06-26 1969-06-20
CH549069A (de) * 1971-02-26 1974-05-15 Ciba Geigy Ag Verfahren zur herstellung von in organischen loesungsmitteln loeslichen, n-silylgruppenhaltigen polymeren.
JPS5545746A (en) * 1978-09-29 1980-03-31 Hitachi Ltd Reactive polymer composition
JPS55135124A (en) * 1979-04-10 1980-10-21 Hitachi Chem Co Ltd Production of polyimide-amide carboxylic acid
DE3060913D1 (en) * 1979-05-12 1982-11-11 Fujitsu Ltd Improvement in method of manufacturing electronic device having multilayer wiring structure
JPS5888741A (ja) * 1981-11-20 1983-05-26 Hitachi Chem Co Ltd 感光性樹脂組成物及び感光性樹脂組成物積層体
JPS5968332A (ja) * 1982-10-13 1984-04-18 Nitto Electric Ind Co Ltd 感光性樹脂組成物
EP0116297B1 (de) * 1983-01-15 1987-12-02 Akzo GmbH Polyimid-Laminate mit hoher Schälfestigkeit und Verfahren zu deren Herstellung
US4648179A (en) * 1983-06-30 1987-03-10 International Business Machines Corporation Process of making interconnection structure for semiconductor device
DE3486131T2 (de) * 1983-08-01 1993-10-28 Hitachi Chemical Co Ltd Harzmaterial mit geringer thermischer Ausdehnung für Verdrahtungsisolationsfolie.
KR850002551A (ko) * 1983-09-30 1985-05-13 원본미기재 두꺼운 니켈 폴리머필름
US4656050A (en) * 1983-11-30 1987-04-07 International Business Machines Corporation Method of producing electronic components utilizing cured vinyl and/or acetylene terminated copolymers
US4699803A (en) * 1983-11-30 1987-10-13 International Business Machines Corporation Method for forming electrical components comprising cured vinyl and/or acetylene terminated copolymers
US4654223A (en) * 1983-11-30 1987-03-31 International Business Machines Corporation Method for forming a film of dielectric material on an electric component
JPS60206639A (ja) * 1984-03-31 1985-10-18 日東電工株式会社 ポリイミド−金属箔複合フイルムの製造方法
US4758476A (en) * 1984-12-12 1988-07-19 Hitachi Chemical Company, Ltd. Polyimide precursor resin composition and semiconductor device using the same
CA1290490C (en) * 1985-11-20 1991-10-08 Masakazu Uekita Amphiphilic high polymer and process for producing the same
CA1294731C (en) * 1986-04-25 1992-01-21 Masakazu Uekita Copolymeric and amphiphilic polyimide precursor, process for preparing the same and thin film
US4943471A (en) * 1986-05-20 1990-07-24 Kanegafuchi Kagaku Kogyo Kabushiki Kaisha Patterned thin film and process for preparing the same
JPH0727966B2 (ja) * 1986-07-04 1995-03-29 日立化成工業株式会社 半導体装置

Also Published As

Publication number Publication date
EP0361461A3 (en) 1990-12-19
JPH0292535A (ja) 1990-04-03
EP0361461B1 (de) 1995-04-26
EP0361461A2 (de) 1990-04-04
DE68922360T2 (de) 1995-09-28
US5133989A (en) 1992-07-28
JPH07102646B2 (ja) 1995-11-08

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee