NL302762A - - Google Patents

Info

Publication number
NL302762A
NL302762A NL302762DA NL302762A NL 302762 A NL302762 A NL 302762A NL 302762D A NL302762D A NL 302762DA NL 302762 A NL302762 A NL 302762A
Authority
NL
Netherlands
Application number
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Publication of NL302762A publication Critical patent/NL302762A/xx

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
NL302762D 1963-06-01 NL302762A (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DES85497A DE1224192B (de) 1963-06-01 1963-06-01 Verfahren zum Umhuellen eines Halbleiterstabes zum Zwecke des anschliessenden Abtrennens von Scheiben

Publications (1)

Publication Number Publication Date
NL302762A true NL302762A (de)

Family

ID=7512400

Family Applications (1)

Application Number Title Priority Date Filing Date
NL302762D NL302762A (de) 1963-06-01

Country Status (5)

Country Link
BE (1) BE648587A (de)
CH (1) CH407337A (de)
DE (1) DE1224192B (de)
GB (1) GB1015560A (de)
NL (1) NL302762A (de)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3597658A (en) * 1969-11-26 1971-08-03 Rca Corp High current semiconductor device employing a zinc-coated aluminum substrate
US4564494A (en) * 1982-07-06 1986-01-14 Honeywell Inc. Encapsulant of CdTe boules for multiblade wafering
JPH0210727A (ja) * 1988-06-28 1990-01-16 Naoetsu Denshi Kogyo Kk 半導体ウエハの分割方法および装置
CN109808271A (zh) * 2018-12-30 2019-05-28 苏州润德新材料有限公司 一种硅片切割用塑料支撑板及其制备方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2813326A (en) * 1953-08-20 1957-11-19 Liebowitz Benjamin Transistors
DE1059571B (de) * 1957-08-13 1959-06-18 Siemens Ag Trockengleichrichteranordnung kleiner Bauweise und Verfahren zu ihrer Herstellung
DE1066282B (de) * 1958-03-26 1900-01-01
US2968866A (en) * 1958-05-21 1961-01-24 Sylvania Electric Prod Method of producing thin wafers of semiconductor materials

Also Published As

Publication number Publication date
CH407337A (de) 1966-02-15
BE648587A (de) 1964-11-30
GB1015560A (en) 1966-01-05
DE1224192B (de) 1966-09-01

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