GB1015560A - A process for the production of semi-conductor wafers - Google Patents
A process for the production of semi-conductor wafersInfo
- Publication number
- GB1015560A GB1015560A GB2262564A GB2262564A GB1015560A GB 1015560 A GB1015560 A GB 1015560A GB 2262564 A GB2262564 A GB 2262564A GB 2262564 A GB2262564 A GB 2262564A GB 1015560 A GB1015560 A GB 1015560A
- Authority
- GB
- United Kingdom
- Prior art keywords
- semi
- wafers
- conductor
- film
- wound
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Shaping Of Tube Ends By Bending Or Straightening (AREA)
- Laminated Bodies (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
1,015,560. Preparing semi-conductor wafers. SIEMENS-SCHUCKERTWERKE A.G. June 1, 1964 [June 1, 1963], No. 22625/64. Heading H1K. Semi-conductor wafers are prepared by wrapping a layer of stretched plastics material around a rod-shaped body of semi - conductor material, heating the body to shrink the plastics material and cutting the wafers from the body. In a specific embodiment, Fig. 1, a semi-conductor body 2 is wound about 3-5 times with a stretched polystyrene film 3. A body 4 of phenoplast laminate, glass or hard wood is placed against the wound body 2 and wrapped about 3-5 times with the film. A support body 5 of aluminium is placed against 4 and again wrapped about with the film. The assembly is then placed in over at 85-95‹ C. for 1-10 hrs. to produce a rigid assembly. The semi-conductor body is then cut into wafers with a diamond saw, the cuts being made perpendicularly to the longitudinal axis of the body 2 and right through into the body 4 which prevents damage to the saw. The plastics wrapping may be removed after the wafers have been cut. The film may have a width greater than the length of the body 2 or may be narrower than the body and consequently wound in an overlapping helix. The film is preferably 10-100Á whilst polyamides or polyurethanes may also be employed.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DES85497A DE1224192B (en) | 1963-06-01 | 1963-06-01 | Method for wrapping a semiconductor rod for the purpose of the subsequent separation of wafers |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB1015560A true GB1015560A (en) | 1966-01-05 |
Family
ID=7512400
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB2262564A Expired GB1015560A (en) | 1963-06-01 | 1964-06-01 | A process for the production of semi-conductor wafers |
Country Status (5)
| Country | Link |
|---|---|
| BE (1) | BE648587A (en) |
| CH (1) | CH407337A (en) |
| DE (1) | DE1224192B (en) |
| GB (1) | GB1015560A (en) |
| NL (1) | NL302762A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3597658A (en) * | 1969-11-26 | 1971-08-03 | Rca Corp | High current semiconductor device employing a zinc-coated aluminum substrate |
| US4564494A (en) * | 1982-07-06 | 1986-01-14 | Honeywell Inc. | Encapsulant of CdTe boules for multiblade wafering |
| CN109808271A (en) * | 2018-12-30 | 2019-05-28 | 苏州润德新材料有限公司 | A kind of silicon wafer cutting plastic support board and preparation method thereof |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0210727A (en) * | 1988-06-28 | 1990-01-16 | Naoetsu Denshi Kogyo Kk | Method and apparatus for dividing semiconductor wafer |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2813326A (en) * | 1953-08-20 | 1957-11-19 | Liebowitz Benjamin | Transistors |
| DE1059571B (en) * | 1957-08-13 | 1959-06-18 | Siemens Ag | Small dry rectifier arrangement and method for its manufacture |
| DE1066282B (en) * | 1958-03-26 | 1900-01-01 | ||
| US2968866A (en) * | 1958-05-21 | 1961-01-24 | Sylvania Electric Prod | Method of producing thin wafers of semiconductor materials |
-
0
- NL NL302762D patent/NL302762A/xx unknown
-
1963
- 1963-06-01 DE DES85497A patent/DE1224192B/en active Pending
-
1964
- 1964-01-23 CH CH77664A patent/CH407337A/en unknown
- 1964-05-29 BE BE648587D patent/BE648587A/xx unknown
- 1964-06-01 GB GB2262564A patent/GB1015560A/en not_active Expired
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3597658A (en) * | 1969-11-26 | 1971-08-03 | Rca Corp | High current semiconductor device employing a zinc-coated aluminum substrate |
| US4564494A (en) * | 1982-07-06 | 1986-01-14 | Honeywell Inc. | Encapsulant of CdTe boules for multiblade wafering |
| CN109808271A (en) * | 2018-12-30 | 2019-05-28 | 苏州润德新材料有限公司 | A kind of silicon wafer cutting plastic support board and preparation method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| NL302762A (en) | |
| DE1224192B (en) | 1966-09-01 |
| BE648587A (en) | 1964-11-30 |
| CH407337A (en) | 1966-02-15 |
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