CH407337A - Process for manufacturing semiconductor wafers - Google Patents

Process for manufacturing semiconductor wafers

Info

Publication number
CH407337A
CH407337A CH77664A CH77664A CH407337A CH 407337 A CH407337 A CH 407337A CH 77664 A CH77664 A CH 77664A CH 77664 A CH77664 A CH 77664A CH 407337 A CH407337 A CH 407337A
Authority
CH
Switzerland
Prior art keywords
semiconductor wafers
manufacturing semiconductor
manufacturing
wafers
semiconductor
Prior art date
Application number
CH77664A
Other languages
German (de)
Inventor
Norbert Dr Schink
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Publication of CH407337A publication Critical patent/CH407337A/en

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Laminated Bodies (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
CH77664A 1963-06-01 1964-01-23 Process for manufacturing semiconductor wafers CH407337A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DES85497A DE1224192B (en) 1963-06-01 1963-06-01 Method for wrapping a semiconductor rod for the purpose of the subsequent separation of wafers

Publications (1)

Publication Number Publication Date
CH407337A true CH407337A (en) 1966-02-15

Family

ID=7512400

Family Applications (1)

Application Number Title Priority Date Filing Date
CH77664A CH407337A (en) 1963-06-01 1964-01-23 Process for manufacturing semiconductor wafers

Country Status (5)

Country Link
BE (1) BE648587A (en)
CH (1) CH407337A (en)
DE (1) DE1224192B (en)
GB (1) GB1015560A (en)
NL (1) NL302762A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0348783A2 (en) * 1988-06-28 1990-01-03 Naoetsu Electronics Company Process of making discrete type substrates

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3597658A (en) * 1969-11-26 1971-08-03 Rca Corp High current semiconductor device employing a zinc-coated aluminum substrate
US4564494A (en) * 1982-07-06 1986-01-14 Honeywell Inc. Encapsulant of CdTe boules for multiblade wafering
CN109808271A (en) * 2018-12-30 2019-05-28 苏州润德新材料有限公司 A kind of silicon wafer cutting plastic support board and preparation method thereof

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2813326A (en) * 1953-08-20 1957-11-19 Liebowitz Benjamin Transistors
DE1059571B (en) * 1957-08-13 1959-06-18 Siemens Ag Small dry rectifier arrangement and method for its manufacture
DE1066282B (en) * 1958-03-26 1900-01-01
US2968866A (en) * 1958-05-21 1961-01-24 Sylvania Electric Prod Method of producing thin wafers of semiconductor materials

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0348783A2 (en) * 1988-06-28 1990-01-03 Naoetsu Electronics Company Process of making discrete type substrates
EP0348783A3 (en) * 1988-06-28 1991-04-10 Naoetsu Electronics Company Process of making discrete type substrates

Also Published As

Publication number Publication date
NL302762A (en)
DE1224192B (en) 1966-09-01
GB1015560A (en) 1966-01-05
BE648587A (en) 1964-11-30

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