JPS54138068A - Polyimide film - Google Patents

Polyimide film

Info

Publication number
JPS54138068A
JPS54138068A JP4549478A JP4549478A JPS54138068A JP S54138068 A JPS54138068 A JP S54138068A JP 4549478 A JP4549478 A JP 4549478A JP 4549478 A JP4549478 A JP 4549478A JP S54138068 A JPS54138068 A JP S54138068A
Authority
JP
Japan
Prior art keywords
polyimide film
formula
processability
improved
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4549478A
Other languages
Japanese (ja)
Inventor
Kenji Tsunashima
Seizo Aoki
Masabumi Sakubayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toray Industries Inc
Original Assignee
Toray Industries Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toray Industries Inc filed Critical Toray Industries Inc
Priority to JP4549478A priority Critical patent/JPS54138068A/en
Publication of JPS54138068A publication Critical patent/JPS54138068A/en
Pending legal-status Critical Current

Links

Landscapes

  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Shaping By String And By Release Of Stress In Plastics And The Like (AREA)

Abstract

PURPOSE: To prepare a poliymide film having improved adhesivity, processability, and alkali resistance, and useful for a wide variety of applications, by uniaxially orienting a specific polyimide film under specific conditions.
CONSTITUTION: A polyimide film of formula I (R is organic residue of formula II; n ≥ 0) is prepared by the thermal or chemical cyclization of a polyamide-acid film obtained by the reaction of pyromellitic anhydride with 4, 4'-diaminodiphenyl ether. The polyimide film obtained above is stretched uniaxially at 50W420°C under the tension of ≥ 1000 kg/cm2 at a draw ratio of ≥ 1.05 to obtain the objective polyimide film having a refractive index of ≥ 2.1 along the direction of the drawing, extremely improved stiffness, increased low temperature heat shrinkability, and consequently improved processability.
COPYRIGHT: (C)1979,JPO&Japio
JP4549478A 1978-04-18 1978-04-18 Polyimide film Pending JPS54138068A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4549478A JPS54138068A (en) 1978-04-18 1978-04-18 Polyimide film

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4549478A JPS54138068A (en) 1978-04-18 1978-04-18 Polyimide film

Publications (1)

Publication Number Publication Date
JPS54138068A true JPS54138068A (en) 1979-10-26

Family

ID=12720946

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4549478A Pending JPS54138068A (en) 1978-04-18 1978-04-18 Polyimide film

Country Status (1)

Country Link
JP (1) JPS54138068A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4886573A (en) * 1986-08-27 1989-12-12 Hitachi, Ltd. Process for forming wiring on substrate

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4886573A (en) * 1986-08-27 1989-12-12 Hitachi, Ltd. Process for forming wiring on substrate

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