JPS5565227A - Production of polyimide solution - Google Patents
Production of polyimide solutionInfo
- Publication number
- JPS5565227A JPS5565227A JP13735678A JP13735678A JPS5565227A JP S5565227 A JPS5565227 A JP S5565227A JP 13735678 A JP13735678 A JP 13735678A JP 13735678 A JP13735678 A JP 13735678A JP S5565227 A JPS5565227 A JP S5565227A
- Authority
- JP
- Japan
- Prior art keywords
- imidization
- solvent
- aromatic diamine
- tetracarboxylic acid
- halogenated phenol
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Paints Or Removers (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
Abstract
PURPOSE: Tetracarboxylic acid component and aromatic diamine component at a specified molar ratio are polymerized in a solvent of halogenated phenol at a specific temperature followed by imidization to produce title solution suitably used as a varnish for coating electric wires that gives cured films with high strength.
CONSTITUTION: The polymerization of (A) tetracarboxylic acid component containing more than 80mol% of 3,3',4,4'-biphenyltetracarboxylic acid and (B) aromatic diamine component containing more than 70% of 4,4'-diaminodiphenylether at a sustantially equimolar ratio is effected in a solvent of halogenated phenol as p-chlorophenol, etc., at about 100W300°C, followed by imidization to produce the objective solution of polymer with the structure given in the formula as the major component.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13735678A JPS5565227A (en) | 1978-11-09 | 1978-11-09 | Production of polyimide solution |
FR7927576A FR2440960B1 (en) | 1978-11-09 | 1979-11-08 | PROCESS FOR THE PREPARATION OF A POLYIMIDE SOLUTION |
US06/092,508 US4290936A (en) | 1978-11-09 | 1979-11-08 | Process for preparing polyimide solution |
GB7938718A GB2037305B (en) | 1978-11-09 | 1979-11-08 | Process for preparing polyimide solution |
DE2945139A DE2945139C2 (en) | 1978-11-09 | 1979-11-08 | Process for the preparation of a homogeneous polyimide solution |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13735678A JPS5565227A (en) | 1978-11-09 | 1978-11-09 | Production of polyimide solution |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5565227A true JPS5565227A (en) | 1980-05-16 |
JPS6145652B2 JPS6145652B2 (en) | 1986-10-09 |
Family
ID=15196735
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13735678A Granted JPS5565227A (en) | 1978-11-09 | 1978-11-09 | Production of polyimide solution |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5565227A (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62275130A (en) * | 1986-05-22 | 1987-11-30 | Sumitomo Bakelite Co Ltd | Production of heat-resistant resin |
JPS63353A (en) * | 1986-06-19 | 1988-01-05 | Ube Ind Ltd | Organic solvent-soluble photosensitive polyimide composition |
EP0261400A2 (en) * | 1986-08-27 | 1988-03-30 | Hitachi, Ltd. | Lift-off process for forming wiring on a substrate |
US5143948A (en) * | 1989-08-02 | 1992-09-01 | Shin-Etsu Chemical Co., Ltd. | Semiconductor element protecting compositions |
JPH05271438A (en) * | 1992-07-21 | 1993-10-19 | Ube Ind Ltd | Composite polyimide sheet |
WO2011001501A1 (en) * | 2009-06-30 | 2011-01-06 | 双日株式会社 | Polyimide composition comprising pmda, dade, bpda and 9,9-bis(4-aminophenyl)fluorene component and soluble in organic solvent, and process for production thereof |
-
1978
- 1978-11-09 JP JP13735678A patent/JPS5565227A/en active Granted
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62275130A (en) * | 1986-05-22 | 1987-11-30 | Sumitomo Bakelite Co Ltd | Production of heat-resistant resin |
JPS63353A (en) * | 1986-06-19 | 1988-01-05 | Ube Ind Ltd | Organic solvent-soluble photosensitive polyimide composition |
EP0261400A2 (en) * | 1986-08-27 | 1988-03-30 | Hitachi, Ltd. | Lift-off process for forming wiring on a substrate |
US5143948A (en) * | 1989-08-02 | 1992-09-01 | Shin-Etsu Chemical Co., Ltd. | Semiconductor element protecting compositions |
JPH05271438A (en) * | 1992-07-21 | 1993-10-19 | Ube Ind Ltd | Composite polyimide sheet |
JPH0725906B2 (en) * | 1992-07-21 | 1995-03-22 | 宇部興産株式会社 | Polyimide composite sheet |
WO2011001501A1 (en) * | 2009-06-30 | 2011-01-06 | 双日株式会社 | Polyimide composition comprising pmda, dade, bpda and 9,9-bis(4-aminophenyl)fluorene component and soluble in organic solvent, and process for production thereof |
JP5667053B2 (en) * | 2009-06-30 | 2015-02-12 | ソルピー工業株式会社 | Polyimide composition soluble in organic solvent containing PMDA, DADE, BPDA and 9,9-bis (4-aminophenyl) fluorene component and method for producing the same |
Also Published As
Publication number | Publication date |
---|---|
JPS6145652B2 (en) | 1986-10-09 |
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