DE3708251A1 - Halbleiterbauelement - Google Patents

Halbleiterbauelement

Info

Publication number
DE3708251A1
DE3708251A1 DE19873708251 DE3708251A DE3708251A1 DE 3708251 A1 DE3708251 A1 DE 3708251A1 DE 19873708251 DE19873708251 DE 19873708251 DE 3708251 A DE3708251 A DE 3708251A DE 3708251 A1 DE3708251 A1 DE 3708251A1
Authority
DE
Germany
Prior art keywords
semiconductor chip
semiconductor
ultraviolet
resin film
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE19873708251
Other languages
German (de)
English (en)
Other versions
DE3708251C2 (https=
Inventor
Shingo Ikeda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of DE3708251A1 publication Critical patent/DE3708251A1/de
Application granted granted Critical
Publication of DE3708251C2 publication Critical patent/DE3708251C2/de
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C16/00—Erasable programmable read-only memories
    • G11C16/02—Erasable programmable read-only memories electrically programmable
    • G11C16/06—Auxiliary circuits, e.g. for writing into memory
    • G11C16/10—Programming or data input circuits
    • G11C16/18—Circuits for erasing optically
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped

Landscapes

  • Non-Volatile Memory (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Semiconductor Memories (AREA)
DE19873708251 1986-03-14 1987-03-13 Halbleiterbauelement Granted DE3708251A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5746886A JPH0783075B2 (ja) 1986-03-14 1986-03-14 半導体装置の製造方法

Publications (2)

Publication Number Publication Date
DE3708251A1 true DE3708251A1 (de) 1987-09-17
DE3708251C2 DE3708251C2 (https=) 1992-06-04

Family

ID=13056518

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19873708251 Granted DE3708251A1 (de) 1986-03-14 1987-03-13 Halbleiterbauelement

Country Status (5)

Country Link
US (1) US4853761A (https=)
JP (1) JPH0783075B2 (https=)
KR (1) KR900007758B1 (https=)
DE (1) DE3708251A1 (https=)
GB (1) GB2189646B (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4202290A1 (de) * 1991-01-31 1992-08-13 Mitsubishi Electric Corp Halbleitereinrichtung mit giessharzverkapselung und verfahren zur herstellung derselben

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5045918A (en) * 1986-12-19 1991-09-03 North American Philips Corp. Semiconductor device with reduced packaging stress
US5171716A (en) * 1986-12-19 1992-12-15 North American Philips Corp. Method of manufacturing semiconductor device with reduced packaging stress
JPH02105418A (ja) * 1988-10-14 1990-04-18 Mitsubishi Electric Corp 樹脂封止型半導体装置
JP5147249B2 (ja) * 2007-01-31 2013-02-20 オンセミコンダクター・トレーディング・リミテッド 半導体装置の製造方法

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3622419A (en) * 1969-10-08 1971-11-23 Motorola Inc Method of packaging an optoelectrical device
DE3019868A1 (de) * 1979-05-25 1980-11-27 Hitachi Ltd Verfahren zur herstellung von halbleiteranordnungen
JPS5763831A (en) * 1980-10-06 1982-04-17 Nec Corp Semiconductor device
DE3125284A1 (de) * 1981-06-26 1983-01-13 Siemens AG, 1000 Berlin und 8000 München Verfahren zum herstellen von bauelementen aus halbleiterscheiben
US4460915A (en) * 1981-12-28 1984-07-17 Intel Corporation Plastic package for radiation sensitive semiconductor devices
JPS6083337A (ja) * 1983-10-14 1985-05-11 Oki Electric Ind Co Ltd 半導体装置の製造方法
JPS6083338A (ja) * 1983-10-14 1985-05-11 Oki Electric Ind Co Ltd Ｅｐｒｏｍ装置の製造方法
JPS6083351A (ja) * 1983-10-14 1985-05-11 Oki Electric Ind Co Ltd Ｅｐｒｏｍ装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4001872A (en) * 1973-09-28 1977-01-04 Rca Corporation High-reliability plastic-packaged semiconductor device
JPS56137658A (en) * 1980-03-31 1981-10-27 Chiyou Lsi Gijutsu Kenkyu Kumiai Semiconductor device
JPS58126645A (ja) * 1982-01-22 1983-07-28 Toshiba Corp 偏向ヨ−ク装置
US4574465A (en) * 1982-04-13 1986-03-11 Texas Instruments Incorporated Differing field oxide thicknesses in dynamic memory device
JPS58182837A (ja) * 1982-04-21 1983-10-25 Hitachi Ltd 樹脂封止半導体装置の製造方法
JPS59110174A (ja) * 1982-12-15 1984-06-26 Hitachi Ltd 固体撮像装置

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3622419A (en) * 1969-10-08 1971-11-23 Motorola Inc Method of packaging an optoelectrical device
DE3019868A1 (de) * 1979-05-25 1980-11-27 Hitachi Ltd Verfahren zur herstellung von halbleiteranordnungen
JPS5763831A (en) * 1980-10-06 1982-04-17 Nec Corp Semiconductor device
DE3125284A1 (de) * 1981-06-26 1983-01-13 Siemens AG, 1000 Berlin und 8000 München Verfahren zum herstellen von bauelementen aus halbleiterscheiben
US4460915A (en) * 1981-12-28 1984-07-17 Intel Corporation Plastic package for radiation sensitive semiconductor devices
JPS6083337A (ja) * 1983-10-14 1985-05-11 Oki Electric Ind Co Ltd 半導体装置の製造方法
JPS6083338A (ja) * 1983-10-14 1985-05-11 Oki Electric Ind Co Ltd Ｅｐｒｏｍ装置の製造方法
JPS6083351A (ja) * 1983-10-14 1985-05-11 Oki Electric Ind Co Ltd Ｅｐｒｏｍ装置

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
Ed. M.T. Goosey "Plastics for Electronics", Elsevier Applied Science Publishers, New York and London, (1985), S. 327-333 *
Japan Patent Abstract zu & JP-A 57-063831 *
K. Alexander et al. "Moisture Resistive, UV Transmissive Passivation for Plastic Encapsulated EPROM Devices" in IEEE/IRPS 1984, S. 218-222 *

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4202290A1 (de) * 1991-01-31 1992-08-13 Mitsubishi Electric Corp Halbleitereinrichtung mit giessharzverkapselung und verfahren zur herstellung derselben
DE4202290C2 (de) * 1991-01-31 2001-07-19 Mitsubishi Electric Corp Halbleitereinrichtung mit Gießharzversiegelung und Verfahren zur Herstellung derselben

Also Published As

Publication number Publication date
JPS62214649A (ja) 1987-09-21
GB2189646B (en) 1990-07-11
KR900007758B1 (ko) 1990-10-19
US4853761A (en) 1989-08-01
GB2189646A (en) 1987-10-28
GB8706061D0 (en) 1987-04-15
JPH0783075B2 (ja) 1995-09-06
KR870009468A (ko) 1987-10-27
DE3708251C2 (https=) 1992-06-04

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Legal Events

Date Code Title Description
OP8 Request for examination as to paragraph 44 patent law
D2 Grant after examination
8364 No opposition during term of opposition
8320 Willingness to grant licences declared (paragraph 23)
8339 Ceased/non-payment of the annual fee