KR900007758B1 - 반도체 장치 - Google Patents

반도체 장치 Download PDF

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Publication number
KR900007758B1
KR900007758B1 KR1019860009524A KR860009524A KR900007758B1 KR 900007758 B1 KR900007758 B1 KR 900007758B1 KR 1019860009524 A KR1019860009524 A KR 1019860009524A KR 860009524 A KR860009524 A KR 860009524A KR 900007758 B1 KR900007758 B1 KR 900007758B1
Authority
KR
South Korea
Prior art keywords
ultraviolet
resin
semiconductor chip
semiconductor
wire bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
KR1019860009524A
Other languages
English (en)
Korean (ko)
Other versions
KR870009468A (ko
Inventor
싱고 이께다
Original Assignee
미쓰비시 전기주식회사
시끼 모리야
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 미쓰비시 전기주식회사, 시끼 모리야 filed Critical 미쓰비시 전기주식회사
Publication of KR870009468A publication Critical patent/KR870009468A/ko
Application granted granted Critical
Publication of KR900007758B1 publication Critical patent/KR900007758B1/ko
Expired legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C16/00—Erasable programmable read-only memories
    • G11C16/02—Erasable programmable read-only memories electrically programmable
    • G11C16/06—Auxiliary circuits, e.g. for writing into memory
    • G11C16/10—Programming or data input circuits
    • G11C16/18—Circuits for erasing optically
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped

Landscapes

  • Non-Volatile Memory (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Semiconductor Memories (AREA)
KR1019860009524A 1986-03-14 1986-11-12 반도체 장치 Expired KR900007758B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP61-57468 1986-03-14
JP57468 1986-03-14
JP5746886A JPH0783075B2 (ja) 1986-03-14 1986-03-14 半導体装置の製造方法

Publications (2)

Publication Number Publication Date
KR870009468A KR870009468A (ko) 1987-10-27
KR900007758B1 true KR900007758B1 (ko) 1990-10-19

Family

ID=13056518

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019860009524A Expired KR900007758B1 (ko) 1986-03-14 1986-11-12 반도체 장치

Country Status (5)

Country Link
US (1) US4853761A (https=)
JP (1) JPH0783075B2 (https=)
KR (1) KR900007758B1 (https=)
DE (1) DE3708251A1 (https=)
GB (1) GB2189646B (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5045918A (en) * 1986-12-19 1991-09-03 North American Philips Corp. Semiconductor device with reduced packaging stress
US5171716A (en) * 1986-12-19 1992-12-15 North American Philips Corp. Method of manufacturing semiconductor device with reduced packaging stress
JPH02105418A (ja) * 1988-10-14 1990-04-18 Mitsubishi Electric Corp 樹脂封止型半導体装置
JPH04261049A (ja) * 1991-01-31 1992-09-17 Mitsubishi Electric Corp 半導体装置およびその製造方法
JP5147249B2 (ja) * 2007-01-31 2013-02-20 オンセミコンダクター・トレーディング・リミテッド 半導体装置の製造方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3622419A (en) * 1969-10-08 1971-11-23 Motorola Inc Method of packaging an optoelectrical device
US4001872A (en) * 1973-09-28 1977-01-04 Rca Corporation High-reliability plastic-packaged semiconductor device
JPS55156343A (en) * 1979-05-25 1980-12-05 Hitachi Ltd Manufacture of semiconductor device
JPS56137658A (en) * 1980-03-31 1981-10-27 Chiyou Lsi Gijutsu Kenkyu Kumiai Semiconductor device
JPS5763831A (en) * 1980-10-06 1982-04-17 Nec Corp Semiconductor device
DE3125284A1 (de) * 1981-06-26 1983-01-13 Siemens AG, 1000 Berlin und 8000 München Verfahren zum herstellen von bauelementen aus halbleiterscheiben
US4460915A (en) * 1981-12-28 1984-07-17 Intel Corporation Plastic package for radiation sensitive semiconductor devices
JPS58126645A (ja) * 1982-01-22 1983-07-28 Toshiba Corp 偏向ヨ−ク装置
US4574465A (en) * 1982-04-13 1986-03-11 Texas Instruments Incorporated Differing field oxide thicknesses in dynamic memory device
JPS58182837A (ja) * 1982-04-21 1983-10-25 Hitachi Ltd 樹脂封止半導体装置の製造方法
JPS59110174A (ja) * 1982-12-15 1984-06-26 Hitachi Ltd 固体撮像装置
JPS6083337A (ja) * 1983-10-14 1985-05-11 Oki Electric Ind Co Ltd 半導体装置の製造方法
JPS6083338A (ja) * 1983-10-14 1985-05-11 Oki Electric Ind Co Ltd Ｅｐｒｏｍ装置の製造方法
JPS6083351A (ja) * 1983-10-14 1985-05-11 Oki Electric Ind Co Ltd Ｅｐｒｏｍ装置

Also Published As

Publication number Publication date
JPS62214649A (ja) 1987-09-21
GB2189646B (en) 1990-07-11
US4853761A (en) 1989-08-01
GB2189646A (en) 1987-10-28
GB8706061D0 (en) 1987-04-15
JPH0783075B2 (ja) 1995-09-06
KR870009468A (ko) 1987-10-27
DE3708251C2 (https=) 1992-06-04
DE3708251A1 (de) 1987-09-17

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