DE3062675D1 - Semiconductor integrated circuit device with a double interconnection layer - Google Patents
Semiconductor integrated circuit device with a double interconnection layerInfo
- Publication number
- DE3062675D1 DE3062675D1 DE8080300661T DE3062675T DE3062675D1 DE 3062675 D1 DE3062675 D1 DE 3062675D1 DE 8080300661 T DE8080300661 T DE 8080300661T DE 3062675 T DE3062675 T DE 3062675T DE 3062675 D1 DE3062675 D1 DE 3062675D1
- Authority
- DE
- Germany
- Prior art keywords
- integrated circuit
- semiconductor integrated
- circuit device
- interconnection layer
- double interconnection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/528—Geometry or layout of the interconnection structure
- H01L23/5283—Cross-sectional geometry
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/43—Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/49—Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET
- H01L29/51—Insulating materials associated therewith
- H01L29/511—Insulating materials associated therewith with a compositional variation, e.g. multilayer structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/43—Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/49—Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET
- H01L29/51—Insulating materials associated therewith
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Geometry (AREA)
- Ceramic Engineering (AREA)
- Semiconductor Integrated Circuits (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
- Design And Manufacture Of Integrated Circuits (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Semiconductor Memories (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2736179A JPS55120150A (en) | 1979-03-09 | 1979-03-09 | Semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
DE3062675D1 true DE3062675D1 (en) | 1983-05-19 |
Family
ID=12218902
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE8080300661T Expired DE3062675D1 (en) | 1979-03-09 | 1980-03-05 | Semiconductor integrated circuit device with a double interconnection layer |
Country Status (3)
Country | Link |
---|---|
EP (1) | EP0016577B1 (de) |
JP (1) | JPS55120150A (de) |
DE (1) | DE3062675D1 (de) |
Families Citing this family (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS56161668A (en) * | 1980-05-16 | 1981-12-12 | Hitachi Ltd | Semiconductor device |
DE3123348A1 (de) * | 1980-06-19 | 1982-03-18 | Tokyo Shibaura Denki K.K., Kawasaki, Kanagawa | Halbleiterbaustein und verfahren zu dessen herstellung |
JPS5756958A (en) * | 1980-09-22 | 1982-04-05 | Toshiba Corp | Semiconductor device |
JPS5756959A (en) * | 1980-09-22 | 1982-04-05 | Toshiba Corp | Semiconductor device and manufacture thereof |
JPS57194552A (en) * | 1981-05-25 | 1982-11-30 | Matsushita Electric Ind Co Ltd | Signal transmission line |
JPS57211249A (en) * | 1981-06-22 | 1982-12-25 | Nec Corp | Integrated circuit device |
JPS5834946A (ja) * | 1981-08-27 | 1983-03-01 | Nec Corp | 半導体集積回路装置 |
JPS5854654A (ja) * | 1981-09-28 | 1983-03-31 | Nec Corp | 半導体集積回路装置 |
JPS5860561A (ja) * | 1981-10-06 | 1983-04-11 | Mitsubishi Electric Corp | 半導体集積回路装置 |
JPS5893347A (ja) * | 1981-11-30 | 1983-06-03 | Toshiba Corp | Mos型半導体装置及びその製造方法 |
JPS58219747A (ja) * | 1982-06-14 | 1983-12-21 | Nec Corp | マスタスライス型半導体装置 |
JPS594050A (ja) * | 1982-06-30 | 1984-01-10 | Fujitsu Ltd | 半導体装置 |
JPS5940549A (ja) * | 1982-08-30 | 1984-03-06 | Nippon Telegr & Teleph Corp <Ntt> | 多層配線構造体 |
JPS5952851A (ja) * | 1982-09-18 | 1984-03-27 | Mitsubishi Electric Corp | 半導体集積回路 |
JPS60128651A (ja) * | 1983-12-15 | 1985-07-09 | Fujitsu Ltd | 半導体装置 |
JPS60144238U (ja) * | 1984-03-06 | 1985-09-25 | 富士通株式会社 | 半導体装置 |
DE3585756D1 (de) * | 1984-07-02 | 1992-05-07 | Fujitsu Ltd | Halbleiterschaltungsanordnung in hauptscheibentechnik. |
JPS6290950A (ja) * | 1985-10-16 | 1987-04-25 | Mitsubishi Electric Corp | 半導体装置 |
JPH0789568B2 (ja) * | 1986-06-19 | 1995-09-27 | 日本電気株式会社 | 集積回路装置 |
JPS63268258A (ja) * | 1987-04-24 | 1988-11-04 | Nec Corp | 半導体装置 |
US5316974A (en) * | 1988-12-19 | 1994-05-31 | Texas Instruments Incorporated | Integrated circuit copper metallization process using a lift-off seed layer and a thick-plated conductor layer |
JPH02127042U (de) * | 1990-04-12 | 1990-10-19 | ||
EP0482556A1 (de) * | 1990-10-22 | 1992-04-29 | Nec Corporation | Widerstandselement aus Polysilizium und dieses verwendendes Halbleiterbauelement |
GB2263018B (en) * | 1991-03-23 | 1995-06-21 | Sony Corp | Static random access memories |
GB2254487B (en) * | 1991-03-23 | 1995-06-21 | Sony Corp | Full CMOS type static random access memories |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS53124084A (en) * | 1977-04-06 | 1978-10-30 | Hitachi Ltd | Semiconductor memory device containing floating type poly silicon layer and its manufacture |
-
1979
- 1979-03-09 JP JP2736179A patent/JPS55120150A/ja active Pending
-
1980
- 1980-03-05 EP EP19800300661 patent/EP0016577B1/de not_active Expired
- 1980-03-05 DE DE8080300661T patent/DE3062675D1/de not_active Expired
Also Published As
Publication number | Publication date |
---|---|
EP0016577A1 (de) | 1980-10-01 |
JPS55120150A (en) | 1980-09-16 |
EP0016577B1 (de) | 1983-04-13 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8320 | Willingness to grant licences declared (paragraph 23) | ||
8327 | Change in the person/name/address of the patent owner |
Owner name: KABUSHIKI KAISHA TOSHIBA, KAWASAKI, KANAGAWA, JP |
|
8339 | Ceased/non-payment of the annual fee |