DE2746320C2 - Kupfer-Glas-Stoffzusammensetzung und ihre Verwendung - Google Patents

Kupfer-Glas-Stoffzusammensetzung und ihre Verwendung

Info

Publication number
DE2746320C2
DE2746320C2 DE2746320A DE2746320A DE2746320C2 DE 2746320 C2 DE2746320 C2 DE 2746320C2 DE 2746320 A DE2746320 A DE 2746320A DE 2746320 A DE2746320 A DE 2746320A DE 2746320 C2 DE2746320 C2 DE 2746320C2
Authority
DE
Germany
Prior art keywords
weight
copper
glass
oxide
composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE2746320A
Other languages
German (de)
English (en)
Other versions
DE2746320A1 (de
Inventor
Lewis Charles Hockessin Del. Hoffman
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EIDP Inc
Original Assignee
EI Du Pont de Nemours and Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by EI Du Pont de Nemours and Co filed Critical EI Du Pont de Nemours and Co
Publication of DE2746320A1 publication Critical patent/DE2746320A1/de
Application granted granted Critical
Publication of DE2746320C2 publication Critical patent/DE2746320C2/de
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C12/00—Powdered glass; Bead compositions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/14—Conductive material dispersed in non-conductive inorganic material
    • H01B1/16—Conductive material dispersed in non-conductive inorganic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24926—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including ceramic, glass, porcelain or quartz layer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Organic Chemistry (AREA)
  • Dispersion Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Glass Compositions (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Conductive Materials (AREA)
DE2746320A 1976-10-15 1977-10-14 Kupfer-Glas-Stoffzusammensetzung und ihre Verwendung Expired DE2746320C2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/732,749 US4070518A (en) 1976-10-15 1976-10-15 Copper metallizations

Publications (2)

Publication Number Publication Date
DE2746320A1 DE2746320A1 (de) 1978-04-20
DE2746320C2 true DE2746320C2 (de) 1982-06-16

Family

ID=24944807

Family Applications (1)

Application Number Title Priority Date Filing Date
DE2746320A Expired DE2746320C2 (de) 1976-10-15 1977-10-14 Kupfer-Glas-Stoffzusammensetzung und ihre Verwendung

Country Status (7)

Country Link
US (1) US4070518A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JP (1) JPS6027123B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
CA (1) CA1096202A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
DE (1) DE2746320C2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
FR (1) FR2367715A1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
GB (1) GB1568564A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
IT (1) IT1087598B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Families Citing this family (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4353153A (en) * 1978-11-16 1982-10-12 Union Carbide Corporation Method of making capacitor with CO-fired end terminations
US4246625A (en) * 1978-11-16 1981-01-20 Union Carbide Corporation Ceramic capacitor with co-fired end terminations
US4243710A (en) * 1978-12-06 1981-01-06 Ferro Corporation Thermoplastic electrode ink for the manufacture of ceramic multi-layer capacitor
US4382981A (en) * 1979-07-26 1983-05-10 Acheson Industries, Inc. Method for shielding electronic equipment by coating with copper containing composition
US4305847A (en) * 1979-07-26 1981-12-15 Acheson Industries, Inc. Copper coating composition for shielding electronic equipment and the like
JPS5736892A (ja) * 1980-08-15 1982-02-27 Hitachi Ltd Seramitsukukibanjohenodomakunokeiseihoho
DE3140968A1 (de) * 1980-10-17 1982-06-16 RCA Corp., 10020 New York, N.Y. "aufglasurfarbe"
DE3140969A1 (de) * 1980-10-17 1982-06-16 RCA Corp., 10020 New York, N.Y. "kupferleitfarbe"
CA1190736A (en) * 1981-06-03 1985-07-23 Robert J. Moneta Copper conductor composition for porcelain enamel steel substrates
FR2508054A1 (fr) * 1981-06-19 1982-12-24 Labo Electronique Physique Melange de depart pour une encre serigraphiable contenant un verre au plomb a cuire en atmosphere non oxydante et encre serigraphiable obtenue
JPS5868803A (ja) * 1981-10-21 1983-04-23 ティーディーケイ株式会社 導電性ペ−スト組成物
JPS5868802A (ja) * 1981-10-21 1983-04-23 ティーディーケイ株式会社 導電性ペ−スト組成物
JPS5879837A (ja) * 1981-10-31 1983-05-13 Tdk Corp 磁器コンデンサ
US4517155A (en) * 1982-05-18 1985-05-14 Union Carbide Corporation Copper base metal termination for multilayer ceramic capacitors
US4511601A (en) * 1983-05-13 1985-04-16 North American Philips Corporation Copper metallization for dielectric materials
US4521329A (en) * 1983-06-20 1985-06-04 E. I. Du Pont De Nemours And Company Copper conductor compositions
US4514321A (en) * 1983-08-25 1985-04-30 E. I. Du Pont De Nemours And Company Thick film conductor compositions
US4540604A (en) * 1983-08-25 1985-09-10 E. I. Du Pont De Nemours And Company Thick film conductor compositions
US4659611A (en) * 1984-02-27 1987-04-21 Kabushiki Kaisha Toshiba Circuit substrate having high thermal conductivity
US4714570A (en) * 1984-07-17 1987-12-22 Matsushita Electric Industrial Co., Ltd. Conductor paste and method of manufacturing a multilayered ceramic body using the paste
US4712161A (en) * 1985-03-25 1987-12-08 Olin Corporation Hybrid and multi-layer circuitry
KR900008781B1 (ko) * 1985-06-17 1990-11-29 마쯔시다덴기산교 가부시기가이샤 후막도체조성물
JPS62176943U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 1986-04-30 1987-11-10
US4868034A (en) * 1988-02-11 1989-09-19 Heraeus Incorporated Cermalloy Division Non-oxidizing copper thick film conductors
US4906404A (en) * 1988-11-07 1990-03-06 Dai-Ichi Kogyo Seiyaku Co., Ltd. Copper conductor composition
JP3467872B2 (ja) * 1994-12-02 2003-11-17 株式会社村田製作所 多層セラミック基板の製造方法
JP3327045B2 (ja) * 1995-04-28 2002-09-24 株式会社村田製作所 誘電体ペースト及びそれを用いた厚膜コンデンサ
US6007900A (en) * 1995-04-28 1999-12-28 Murata Manufacturing Co., Ltd. Dielectric paste and thick-film capacitor using same
US5698015A (en) * 1995-05-19 1997-12-16 Nikko Company Conductor paste for plugging through-holes in ceramic circuit boards and a ceramic circuit board having this conductor paste
JPH09241862A (ja) * 1996-03-01 1997-09-16 Murata Mfg Co Ltd 銅粉末及び銅ペースト並びにセラミック電子部品
US6376054B1 (en) * 1999-02-10 2002-04-23 International Business Machines Corporation Surface metallization structure for multiple chip test and burn-in
US6187418B1 (en) 1999-07-19 2001-02-13 International Business Machines Corporation Multilayer ceramic substrate with anchored pad
KR20040008093A (ko) * 2002-07-17 2004-01-28 엔지케이 스파크 플러그 캄파니 리미티드 동 페이스트 및 그것을 이용한 배선기판
KR100779770B1 (ko) * 2002-07-17 2007-11-27 엔지케이 스파크 플러그 캄파니 리미티드 동 페이스트 및 그것을 이용한 배선기판
US20090266409A1 (en) * 2008-04-28 2009-10-29 E.I.Du Pont De Nemours And Company Conductive compositions and processes for use in the manufacture of semiconductor devices
JP2012521100A (ja) * 2009-03-19 2012-09-10 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー 太陽電池電極用導体ペースト

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1229086A (fr) * 1958-05-23 1960-09-02 Du Pont Liant en matière céramique minérale vitrifiable et compositions d'argent le contenant
US2993815A (en) * 1959-05-25 1961-07-25 Bell Telephone Labor Inc Metallizing refractory substrates
US3484284A (en) * 1967-08-15 1969-12-16 Corning Glass Works Electroconductive composition and method
US3647532A (en) * 1969-02-17 1972-03-07 Gen Electric Application of conductive inks
US3827891A (en) * 1970-12-17 1974-08-06 J Larry High adhesion metallizing compositions
JPS5110844B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 1973-04-24 1976-04-07
NL7406083A (nl) * 1974-05-07 1975-11-11 Philips Nv Werkwijze voor het samenstellen van een gemeng voor loodglas.
US3970590A (en) * 1975-06-23 1976-07-20 E. I. Du Pont De Nemours And Company Gold conductor compositions

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
NICHTS-ERMITTELT

Also Published As

Publication number Publication date
JPS5349296A (en) 1978-05-04
GB1568564A (en) 1980-06-04
JPS6027123B2 (ja) 1985-06-27
FR2367715A1 (fr) 1978-05-12
IT1087598B (it) 1985-06-04
FR2367715B1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1982-05-14
DE2746320A1 (de) 1978-04-20
US4070518A (en) 1978-01-24
CA1096202A (en) 1981-02-24

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Legal Events

Date Code Title Description
OD Request for examination
D2 Grant after examination
8339 Ceased/non-payment of the annual fee